Nanoparticle Engineering for Chemical-mechanical Planarization PDF Download
Are you looking for read ebook online? Search for your book and save it on your Kindle device, PC, phones or tablets. Download Nanoparticle Engineering for Chemical-mechanical Planarization PDF full book. Access full book title Nanoparticle Engineering for Chemical-mechanical Planarization by Ungyu Paik. Download full books in PDF and EPUB format.
Author: Ungyu Paik
Publisher:
ISBN: 9780429291890
Category : SCIENCE
Languages : en
Pages : 221
Get Book Here
Book Description
In the development of next-generation nanoscale devices, higher speed and lower power operation is the name of the game. Increasing reliance on mobile computers, mobile phone, and other electronic devices demands a greater degree of speed and power. As chemical mechanical planarization (CMP) progressively becomes perceived less as black art and more as a cutting-edge technology, it is emerging as the technology for achieving higher performance devices. Nanoparticle Engineering for Chemical-Mechanical Planarization explains the physicochemical properties of nanoparticles according to each step in the CMP process, including dielectric CMP, shallow trend isolation CMP, metal CMP, poly isolation CMP, and noble metal CMP. The authors provide a detailed guide to nanoparticle engineering of novel CMP slurry for next-generation nanoscale devices below the 60nm design rule. They present design techniques using polymeric additives to improve CMP performance. The final chapter focuses on novel CMP slurry for the application to memory devices beyond 50nm technology. Most books published on CMP focus on the polishing process, equipment, and cleaning. Even though some of these books may touch on CMP slurries, the methods they cover are confined to conventional slurries and none cover them with the detail required for the development of next-generation devices. With its coverage of fundamental concepts and novel technologies, this book delivers expert insight into CMP for all current and next-generation systems.
Author: Ungyu Paik
Publisher:
ISBN: 9780429291890
Category : SCIENCE
Languages : en
Pages : 221
Get Book Here
Book Description
In the development of next-generation nanoscale devices, higher speed and lower power operation is the name of the game. Increasing reliance on mobile computers, mobile phone, and other electronic devices demands a greater degree of speed and power. As chemical mechanical planarization (CMP) progressively becomes perceived less as black art and more as a cutting-edge technology, it is emerging as the technology for achieving higher performance devices. Nanoparticle Engineering for Chemical-Mechanical Planarization explains the physicochemical properties of nanoparticles according to each step in the CMP process, including dielectric CMP, shallow trend isolation CMP, metal CMP, poly isolation CMP, and noble metal CMP. The authors provide a detailed guide to nanoparticle engineering of novel CMP slurry for next-generation nanoscale devices below the 60nm design rule. They present design techniques using polymeric additives to improve CMP performance. The final chapter focuses on novel CMP slurry for the application to memory devices beyond 50nm technology. Most books published on CMP focus on the polishing process, equipment, and cleaning. Even though some of these books may touch on CMP slurries, the methods they cover are confined to conventional slurries and none cover them with the detail required for the development of next-generation devices. With its coverage of fundamental concepts and novel technologies, this book delivers expert insight into CMP for all current and next-generation systems.
Author: Ungyu Paik
Publisher: CRC Press
ISBN: 1000023222
Category : Science
Languages : en
Pages : 222
Get Book Here
Book Description
In the development of next-generation nanoscale devices, higher speed and lower power operation is the name of the game. Increasing reliance on mobile computers, mobile phone, and other electronic devices demands a greater degree of speed and power. As chemical mechanical planarization (CMP) progressively becomes perceived less as black art and more as a cutting-edge technology, it is emerging as the technology for achieving higher performance devices. Nanoparticle Engineering for Chemical-Mechanical Planarization explains the physicochemical properties of nanoparticles according to each step in the CMP process, including dielectric CMP, shallow trend isolation CMP, metal CMP, poly isolation CMP, and noble metal CMP. The authors provide a detailed guide to nanoparticle engineering of novel CMP slurry for next-generation nanoscale devices below the 60nm design rule. They present design techniques using polymeric additives to improve CMP performance. The final chapter focuses on novel CMP slurry for the application to memory devices beyond 50nm technology. Most books published on CMP focus on the polishing process, equipment, and cleaning. Even though some of these books may touch on CMP slurries, the methods they cover are confined to conventional slurries and none cover them with the detail required for the development of next-generation devices. With its coverage of fundamental concepts and novel technologies, this book delivers expert insight into CMP for all current and next-generation systems.
Author: Babu Suryadevara
Publisher: Woodhead Publishing
ISBN: 0128218193
Category : Technology & Engineering
Languages : en
Pages : 650
Get Book Here
Book Description
Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. - Reviews the most relevant techniques and processes for CMP of dielectric and metal films - Includes chapters devoted to CMP for current and emerging materials - Addresses consumables and process control for improved CMP, including post-CMP
Author: Stephen W. Freiman
Publisher: John Wiley & Sons
ISBN: 0470104910
Category : Technology & Engineering
Languages : en
Pages : 964
Get Book Here
Book Description
This is the only global roadmap that identifies the technical and manufacturing challenges associated with the development and expansion of commercial markets for ceramics and glass. Featuring presentations by industry leaders at the 1st International Congress on Ceramics (ICC) held in 2006, it suggests positive, proactive ways to address these challenges. The ICC Global Roadmap contains the following content: 1) Summary papers prepared by the invited speakers before the meeting 2) A detailed account of the presentation of each invited speaker written by an editor who attends the presentation 3) A summary account and future recommendations for the industry on each topic covered written by the board and the president of this meeting, Dr. Stephen Freiman (National Institutes of Standards and Technology) 4) The CDRom accompanying the book contains all of the above as well as pdfs of the presentations for non-invited speakers, including posters presented and discussed.
Author: R. Rhoades
Publisher: The Electrochemical Society
ISBN: 1607687453
Category : Science
Languages : en
Pages : 93
Get Book Here
Book Description
Author: Takuya Tsuzuki
Publisher: CRC Press
ISBN: 9814303291
Category : Business & Economics
Languages : en
Pages : 470
Get Book Here
Book Description
In terms of commercialization, nanomaterials occupy a unique place in nanotechnology. Engineered nanomaterials, especially nanoparticulate materials, are the leading sector in nanotechnology commercialization. In addition, the nanomaterial sector has attracted much more heated debate than any other nanotechnology sector with regard to safety, regul
Author: Shazia Syed
Publisher: Cambridge Scholars Publishing
ISBN: 1036416534
Category : Technology & Engineering
Languages : en
Pages : 289
Get Book Here
Book Description
Nanoparticles, though incredibly small, are giants in the world of science and technology. The present book is a journey into the fascinating world of these microscopic wonders, illustrating how they're making significant strides in various fields including medicine, electronics, and environmental science. At the heart of this exploration is an understanding of what nanoparticles are – entities so minute, yet so powerful in their ability to change material properties. The book delves into how these particles behave differently from their larger counterparts, revealing a world where size and composition open up a plethora of possibilities. As we look to the future, the book sheds light on the evolving landscape of nanotechnology. It talks about the need for regulations, the ethical considerations, and the endless possibilities that nanoparticles bring to various industries. This book is more than just a scientific treatise; it is a narrative that brings the microscopic to the macroscopic level of understanding.
Author: Hong Liang
Publisher: CRC Press
ISBN: 1420028391
Category : Technology & Engineering
Languages : en
Pages : 199
Get Book Here
Book Description
Illustrating their intersecting role in manufacturing and technological development, this book examines tribological principles and their applications in CMP, including integrated circuits, basic concepts in surfaces of contacts, and common defects as well as friction, lubrication fundamentals, and the basics of wear. The book concludes its focus with mechanical aspects of CMP, pad materials, elastic modulus, and cell buckling. As the first source to integrate CMP and tribology, Tribology in Chemical-Mechanical Planarization provides applied scientists and engineers in the fields of semiconductors and microelectronics with clear foresight to the future of this technology.
Author: Prem Jose Vazhacharickal
Publisher: Amazon Publishers, USA
ISBN: 1089128673
Category : Reference
Languages : en
Pages : 299
Get Book Here
Book Description
Soil borne diseases which are caused to various plants include a wide variety of soil microbes like fungi and bacteria, among which Fusarium wilt is one such disease caused by Fusarium oxysporum cubense in banana plants. Wilt disease or the panama disease of plant is among the most destructive disease of banana in the tropics and even the control methods like field sanitation, soil treatments and crop rotations have not been a long term control for this disease. An alternative method of treating Fusarium oxysporum was adopted by using various banana parts mainly its peel, pulp sap and its latex of varieties such as Robusta (B1) Musa acuminate Colla (AAA), Etha (B2) Musa x paradisiaca (AAB), Poovan (B3) Musa x paradisiaca (AAB), Sundari (B4) Musa acuminate Colla (AA), Njalipoovan (B5) Musa acuminate Colla (AB), Palayamkodan (B6) Musa x paradisiaca (AAB), Kannan (B8) Musa acuminate Colla (AAA), Pachakadali (B9) Musa acuminate Colla (AAA). Nanoparticles are small particles with a dimension of 10-9 and 10-10. Green synthesis is a new method developed for the synthesis of nanoparticles which is small in size, large surface area and eco- friendly. Leaf extracts of these plants were used for synthesis of copper and zinc nanoparticles, as nanoparticles are powerful antimicrobial agents. The results shows that dry skin and fruit extracts of Palemkodan, Njalipoovan, Etha, Pachakhadali with solvents, propane, ethanol, methanol and acetone and the fresh extract latex and sap of Palemkodan and Poovan with solvents isoproponol, ethanol, methanol with 1/10 and 1/50 dilution are used for the synthesis of copper and zinc nanoparticles. Copper and zinc nanoparticle shows greater antifungal activity than copper sulphate and zinc sulphate, respectively and dry extract. The maximum zone of inhibition was at 50 and 100 µl for all the test plates. This indicates that the zone of inhibition increases with as the concentration of nanoparticles increased. An overall result showed that ethanol, methanol and isoropane could be used as a good solvents and skin of Njalipoovan and Etha could be used for controlling the Fusarium oxysporum cubense under invitro conditions.
Author: Prem Jose Vazhacharickal
Publisher: Amazon Publishers, USA
ISBN: 1095343858
Category : Reference
Languages : en
Pages : 141
Get Book Here
Book Description
Soil borne diseases which are caused to various plants include a wide variety of soil microbes like fungi and bacteria, among which Fusarium wilt is one such disease caused by Fusarium oxysporum cubense in banana plants. Wilt disease or the panama disease of plant is among the most destructive disease of banana in the tropics and even the control methods like field sanitation, soil treatments and crop rotations have not been a long term control for this disease. An alternative method of treating Fusarium oxysporum was adopted by using various natural plant leaves of Chromolaena odorata, Justicia adhatoda, Glycosmis pentaphylla, Azadirachta indica, Gliricidia sepium, Piper nigrum, Ocimum tenuiflorum and Tabernaemontana divaricate. Nanoparticles are small particles with a dimension of 10-9 and 10-10. Green synthesis is a new method developed for the synthesis of nanoparticles which is small in size, large surface area and eco- friendly. Leaf extracts of these plants were used for synthesis of copper and zinc nanoparticles, as nanoparticles are powerful antimicrobial agents. The extract is prepared with a stock solution of 100mM copper sulphate and 100mM zinc sulphate. The leaf extracts were prepared with 5 solvents (Distilled water, Propane, Hexane, Acetone and Methanol). The action of plant leaves were observed by the zone of inhibition obtained with a concentration of 50, 100 and 150µl respectively. The result was more in copper nanoparticles of leaf extract as compared to the zinc nanoparticles of particular leaf extracts but the zinc particles with methanol and propane showed good result with particular leaves. In dried condition of leaves copper nanoparticles with propane as solvent exhibited a greater zone of inhibition. Moreover the solvent, methanol showed good results with both zinc and copper nanoparticles. The synthesized nanoparticle were characterized by UV-VIS spectrophotometry to confirm the formation of nanoparticles. Green synthesis is used namely because of low cost, simple, use of less toxic materials, most important is eco-friendly.
