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Author: Ungyu Paik
Publisher: CRC Press
ISBN: 1000023222
Category : Science
Languages : en
Pages : 222
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Book Description
In the development of next-generation nanoscale devices, higher speed and lower power operation is the name of the game. Increasing reliance on mobile computers, mobile phone, and other electronic devices demands a greater degree of speed and power. As chemical mechanical planarization (CMP) progressively becomes perceived less as black art and more as a cutting-edge technology, it is emerging as the technology for achieving higher performance devices. Nanoparticle Engineering for Chemical-Mechanical Planarization explains the physicochemical properties of nanoparticles according to each step in the CMP process, including dielectric CMP, shallow trend isolation CMP, metal CMP, poly isolation CMP, and noble metal CMP. The authors provide a detailed guide to nanoparticle engineering of novel CMP slurry for next-generation nanoscale devices below the 60nm design rule. They present design techniques using polymeric additives to improve CMP performance. The final chapter focuses on novel CMP slurry for the application to memory devices beyond 50nm technology. Most books published on CMP focus on the polishing process, equipment, and cleaning. Even though some of these books may touch on CMP slurries, the methods they cover are confined to conventional slurries and none cover them with the detail required for the development of next-generation devices. With its coverage of fundamental concepts and novel technologies, this book delivers expert insight into CMP for all current and next-generation systems.
Author: Ungyu Paik
Publisher: CRC Press
ISBN: 1000023222
Category : Science
Languages : en
Pages : 222
Get Book
Book Description
In the development of next-generation nanoscale devices, higher speed and lower power operation is the name of the game. Increasing reliance on mobile computers, mobile phone, and other electronic devices demands a greater degree of speed and power. As chemical mechanical planarization (CMP) progressively becomes perceived less as black art and more as a cutting-edge technology, it is emerging as the technology for achieving higher performance devices. Nanoparticle Engineering for Chemical-Mechanical Planarization explains the physicochemical properties of nanoparticles according to each step in the CMP process, including dielectric CMP, shallow trend isolation CMP, metal CMP, poly isolation CMP, and noble metal CMP. The authors provide a detailed guide to nanoparticle engineering of novel CMP slurry for next-generation nanoscale devices below the 60nm design rule. They present design techniques using polymeric additives to improve CMP performance. The final chapter focuses on novel CMP slurry for the application to memory devices beyond 50nm technology. Most books published on CMP focus on the polishing process, equipment, and cleaning. Even though some of these books may touch on CMP slurries, the methods they cover are confined to conventional slurries and none cover them with the detail required for the development of next-generation devices. With its coverage of fundamental concepts and novel technologies, this book delivers expert insight into CMP for all current and next-generation systems.
Author: R. Rhoades
Publisher: The Electrochemical Society
ISBN: 1607687453
Category : Science
Languages : en
Pages : 93
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Book Description
Author: Stephen W. Freiman
Publisher: John Wiley & Sons
ISBN: 0470104910
Category : Technology & Engineering
Languages : en
Pages : 964
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Book Description
This is the only global roadmap that identifies the technical and manufacturing challenges associated with the development and expansion of commercial markets for ceramics and glass. Featuring presentations by industry leaders at the 1st International Congress on Ceramics (ICC) held in 2006, it suggests positive, proactive ways to address these challenges. The ICC Global Roadmap contains the following content: 1) Summary papers prepared by the invited speakers before the meeting 2) A detailed account of the presentation of each invited speaker written by an editor who attends the presentation 3) A summary account and future recommendations for the industry on each topic covered written by the board and the president of this meeting, Dr. Stephen Freiman (National Institutes of Standards and Technology) 4) The CDRom accompanying the book contains all of the above as well as pdfs of the presentations for non-invited speakers, including posters presented and discussed.
Author: Takuya Tsuzuki
Publisher: CRC Press
ISBN: 9814303291
Category : Business & Economics
Languages : en
Pages : 470
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Book Description
In terms of commercialization, nanomaterials occupy a unique place in nanotechnology. Engineered nanomaterials, especially nanoparticulate materials, are the leading sector in nanotechnology commercialization. In addition, the nanomaterial sector has attracted much more heated debate than any other nanotechnology sector with regard to safety, regul
Author: Babu Suryadevara
Publisher: Woodhead Publishing
ISBN: 0128218193
Category : Technology & Engineering
Languages : en
Pages : 650
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Book Description
Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. Reviews the most relevant techniques and processes for CMP of dielectric and metal films Includes chapters devoted to CMP for current and emerging materials Addresses consumables and process control for improved CMP, including post-CMP
Author: Suryadevara Babu
Publisher: Woodhead Publishing
ISBN: 0081002181
Category : Technology & Engineering
Languages : en
Pages : 536
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Book Description
Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. This important book offers a systematic review of fundamentals and advances in the area. Part One covers CMP of dielectric and metal films, with chapters focusing on the use of particular techniques and processes, and on CMP of particular various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. Part Two addresses consumables and process control for improved CMP, and includes chapters on the preparation and characterization of slurry, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes, and approaches for defection characterization, mitigation, and reduction. Considers techniques and processes for CMP of dielectric and metal films Includes chapters devoted to CMP for particular materials Addresses consumables and process control for improved CMP
Author: Makio Naito
Publisher: Elsevier
ISBN: 0444641114
Category : Technology & Engineering
Languages : en
Pages : 904
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Book Description
Nanoparticle Technology Handbook, Third Edition, is an updated and expanded authoritative reference providing both the theory behind nanoparticles and the practical applications of nanotechnology. This third edition features twenty new chapters, providing a reference much broader in scope than the previous edition. Over 140 experts in nanotechnology and/or particle technology contributed to this new edition. The book not only includes the theory behind nanoparticles, but also the practical applications of nanotechnology. It examines future possibilities and new innovations and contains important knowledge on nanoparticle characterization and the effect of nanoparticles on the environment and humans. Nanoparticle technology is a new and revolutionary technology, which is increasingly used in electronic devices and nanomaterials. It handles the preparation, processing, application and characterization of nanoparticles and has become the core of nanotechnology as an extension of conventional fine particle/powder technology. Nanoparticle technology plays an important role in the implementation of nanotechnology in many engineering and industrial fields, including electronic devices, advanced ceramics, new batteries, engineered catalysts, functional paint and ink, drug delivery system, biotechnology, etc., making use of the unique properties of nanoparticles, which are completely different from those of bulk materials. Introduces all aspects of nanoparticle technology, from the fundamentals to applications Cover basic information on preparation through to the characterization of nanoparticles in a systematic way Features information on nanostructures, which play an important role in practical applications Includes the effects of nanoparticles on human health and the environment Includes applications of nanoparticles in diverse fields, including applications in new areas, such as electronics cosmetics, etc. Offers up-to-date information given by specialists in each field
Author: Claes Granqvist
Publisher: Springer Science & Business Media
ISBN: 1402024444
Category : Science
Languages : en
Pages : 194
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Book Description
Author: Ping Chen
Publisher: CRC Press
ISBN: 1315638886
Category : Technology & Engineering
Languages : en
Pages : 711
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Book Description
Material Science and Engineering presents novel and fundamental advances in the field of material science and engineering. This proceedings collects the comprehensive and worldwide research results on Metallic Materials and Applications, Chemical Materials, Electronic Materials, Nanomaterials, Composite and Polymer Materials, Bio and Medical Materi
Author: Myer Kutz
Publisher: William Andrew
ISBN: 1437735150
Category : Technology & Engineering
Languages : en
Pages : 574
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Book Description
A practical reference for all plastics engineers who are seeking to answer a question, solve a problem, reduce a cost, improve a design or fabrication process, or even venture into a new market. Applied Plastics Engineering Handbook covers both polymer basics – helpful to bring readers quickly up to speed if they are not familiar with a particular area of plastics processing – and recent developments – enabling practitioners to discover which options best fit their requirements. Each chapter is an authoritative source of practical advice for engineers, providing authoritative guidance from experts that will lead to cost savings and process improvements. Throughout the book, the focus is on the engineering aspects of producing and using plastics. The properties of plastics are explained along with techniques for testing, measuring, enhancing and analyzing them. Practical introductions to both core topics and new developments make this work equally valuable for newly qualified plastics engineers seeking the practical rules-of-thumb they don’t teach you in school, and experienced practitioners evaluating new technologies or getting up to speed on a new field The depth and detail of the coverage of new developments enables engineers and managers to gain knowledge of, and evaluate, new technologies and materials in key growth areas such as biomaterials and nanotechnology This highly practical handbook is set apart from other references in the field, being written by engineers for an audience of engineers and providing a wealth of real-world examples, best practice guidance and rules-of-thumb
