Modeling and Characterization of Electromigration Failures in IC Metallization Systems and Copper Metallization for ULSI Applications PDF Download
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Author: Jiang Tao
Publisher:
ISBN:
Category :
Languages : en
Pages : 358
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Book Description
Author: Jiang Tao
Publisher:
ISBN:
Category :
Languages : en
Pages : 358
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Book Description
Author: G. S. Mathad
Publisher: The Electrochemical Society
ISBN: 9781566772549
Category : Science
Languages : en
Pages : 358
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Book Description
Author: Rosemary P. Beatty
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 34
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Author:
Publisher:
ISBN:
Category : Dissertation abstracts
Languages : en
Pages : 896
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Book Description
Author: Robert Havemann
Publisher: Mrs Conference Proceedings
ISBN:
Category : Computers
Languages : en
Pages : 640
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author: James R. Lloyd
Publisher:
ISBN:
Category : Electrodiffusion
Languages : en
Pages : 214
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Book Description
Author: Jens Lienig
Publisher: Springer
ISBN: 3319735586
Category : Technology & Engineering
Languages : en
Pages : 171
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Book Description
The book provides a comprehensive overview of electromigration and its effects on the reliability of electronic circuits. It introduces the physical process of electromigration, which gives the reader the requisite understanding and knowledge for adopting appropriate counter measures. A comprehensive set of options is presented for modifying the present IC design methodology to prevent electromigration. Finally, the authors show how specific effects can be exploited in present and future technologies to reduce electromigration’s negative impact on circuit reliability.
Author: Panayotis C. Andricacos
Publisher: The Electrochemical Society
ISBN: 9781566772310
Category : Science
Languages : en
Pages : 418
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Book Description
Author: Cher Ming Tan
Publisher: Springer Science & Business Media
ISBN: 9814451215
Category : Technology & Engineering
Languages : en
Pages : 111
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Book Description
Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level.
Author:
Publisher:
ISBN:
Category : Metallurgy
Languages : en
Pages : 1628
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