Micron and Submicron Integrated Circuit Metrology PDF Download
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Author: Kevin M. Monahan
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 238
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Book Description
Author: Kevin M. Monahan
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 238
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Book Description
Author: United States. National Bureau of Standards
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 116
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Book Description
Author: National Institute of Standards and Technology (U.S.)
Publisher:
ISBN:
Category : Semiconductors
Languages : en
Pages : 140
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Book Description
Author:
Publisher:
ISBN:
Category : Electronic circuit design
Languages : en
Pages : 576
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Book Description
Author: Kevin M. Monahan
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 340
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Book Description
Author:
Publisher: ASM International
ISBN: 9780871702852
Category : Technology & Engineering
Languages : en
Pages : 1234
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Book Description
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Author: Laszlo Monostori
Publisher: Springer
ISBN: 3030181804
Category : Technology & Engineering
Languages : en
Pages : 259
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Book Description
This book gathers the proceedings of the 4th International Conference on the Industry 4.0 Model for Advanced Manufacturing (AMP 2019), held in Belgrade, Serbia, on 3–6 June 2019. The event marks the latest in a series of high-level conferences that bring together experts from academia and industry to exchange knowledge, ideas, experiences, research findings, and information in the field of manufacturing. The book addresses a wide range of topics, including: design of smart and intelligent products, developments in CAD/CAM technologies, rapid prototyping and reverse engineering, multistage manufacturing processes, manufacturing automation in the Industry 4.0 model, cloud-based products, and cyber-physical and reconfigurable manufacturing systems. By providing updates on key issues and highlighting recent advances in manufacturing engineering and technologies, the book supports the transfer of vital knowledge to the next generation of academics and practitioners. Further, it will appeal to anyone working or conducting research in this rapidly evolving field.
Author: Gordon S. Kino
Publisher: Academic Press
ISBN: 008052978X
Category : Science
Languages : en
Pages : 353
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Book Description
This book provides a comprehensive introduction to the field of scanning optical microscopy for scientists and engineers. The book concentrates mainly on two instruments: the Confocal Scanning Optical Microscope (CSOM), and the Optical Interference Microscope (OIM). A comprehensive discussion of the theory and design of the Near-Field Scanning Optical Microscope (NSOM) is also given. The text discusses the practical aspects of building a confocal scanning optical microscope or optical interference microscope, and the applications of these microscopes to phase imaging, biological imaging, and semiconductor inspection and metrology.A comprehensive theoretical discussion of the depth and transverse resolution is given with emphasis placed on the practical results of the theoretical calculations and how these can be used to help understand the operation of these microscopes. - Provides a comprehensive introduction to the field of scanning optical microscopy for scientists and engineers - Explains many practical applications of scanning optical and interference microscopy in such diverse fields as biology and semiconductor metrology - Discusses in theoretical terms the origin of the improved depth and transverse resolution of scanning optical and interference microscopes with emphasis on the practical results of the theoretical calculations - Considers the practical aspects of building a confocal scanning or interference microscope and explores some of the design tradeoffs made for microscopes used in various applications - Discusses the theory and design of near-field optical microscopes - Explains phase imaging in the scanning optical and interference microscopes
Author: Kevin M. Monahan
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 556
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Book Description
Author: S.R. Hameroff
Publisher: Elsevier
ISBN: 0444600094
Category : Computers
Languages : en
Pages : 380
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Book Description
The possibility of direct interfacing between biological and technological information devices could result in a merger of mind and machine - Ultimate Computing. This book, a thorough consideration of this idea, involves a number of disciplines, including biochemistry, cognitive science, computer science, engineering, mathematics, microbiology, molecular biology, pharmacology, philosophy, physics, physiology, and psychology.
