Medical Device Packaging Handbook, Second Edition, Revised and Expanded PDF Download
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Author: Max Sherman
Publisher:
ISBN: 9780429074691
Category : Biomedical engineering
Languages : en
Pages :
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Book Description
"This volume details current developments in industry practices and standards relating to medical device packaging. This edition offers entirely new as well as revised chapters on packaging materials, package validation and methods and integrity testing, bar-coding technology, environmentally sound packaging and disposal procedures, storage autoclave sytems, international standards, customer needs, regulatory aspects, and more."--Provided by publisher.
Author: Max Sherman
Publisher:
ISBN: 9780429074691
Category : Biomedical engineering
Languages : en
Pages :
Get Book Here
Book Description
"This volume details current developments in industry practices and standards relating to medical device packaging. This edition offers entirely new as well as revised chapters on packaging materials, package validation and methods and integrity testing, bar-coding technology, environmentally sound packaging and disposal procedures, storage autoclave sytems, international standards, customer needs, regulatory aspects, and more."--Provided by publisher.
Author: Max Sherman
Publisher: CRC Press
ISBN: 9780849384493
Category : Medical
Languages : en
Pages : 422
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Book Description
This volume details current developments in industry practices and standards relating to medical device packaging. This edition offers entirely new as well as revised chapters on packaging materials, package validation and methods and integrity testing, bar-coding technology, environmentally sound packaging and disposal procedures, storage autoclave sytems, international standards, customer needs, regulatory aspects, and more.
Author: Max Sherman
Publisher: CRC Press
ISBN: 9780824701994
Category : Medical
Languages : en
Pages : 416
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Book Description
This volume details current developments in industry practices and standards relating to medical device packaging. This edition offers entirely new as well as revised chapters on packaging materials, package validation and methods and integrity testing, bar-coding technology, environmentally sound packaging and disposal procedures, storage autoclave sytems, international standards, customer needs, regulatory aspects, and more.
Author: Eugenio Iannone
Publisher: CRC Press
ISBN: 1466560738
Category : Medical
Languages : en
Pages : 1143
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Book Description
Labs on Chip: Principles, Design and Technology provides a complete reference for the complex field of labs on chip in biotechnology. Merging three main areas— fluid dynamics, monolithic micro- and nanotechnology, and out-of-equilibrium biochemistry—this text integrates coverage of technology issues with strong theoretical explanations of design techniques. Analyzing each subject from basic principles to relevant applications, this book: Describes the biochemical elements required to work on labs on chip Discusses fabrication, microfluidic, and electronic and optical detection techniques Addresses planar technologies, polymer microfabrication, and process scalability to huge volumes Presents a global view of current lab-on-chip research and development Devotes an entire chapter to labs on chip for genetics Summarizing in one source the different technical competencies required, Labs on Chip: Principles, Design and Technology offers valuable guidance for the lab-on-chip design decision-making process, while exploring essential elements of labs on chip useful both to the professional who wants to approach a new field and to the specialist who wants to gain a broader perspective.
Author: Harutun Karian
Publisher: CRC Press
ISBN: 0824748263
Category : Technology & Engineering
Languages : en
Pages : 685
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Book Description
Building on the success of its predecessor with completely revised material and six new chapters, the Handbook of Polypropylene and Polypropylene Composites, Second Edition responds to increasing interest and changing global trends in the manufacture and application of polypropylene resin. The authors highlight viable options for the manufacture of polypropylene composites to better accommodate market requirements across various industries. The second edition introduces chapters on high-purity submicron talc fillers with lamellar microstructures, the utilization of Wollastonite fibers for polypropylene reinforcement, and updated material on nanocomposite production using exfoliated clay treated with maleated polypropylene-based materials, among many other topics.
Author: Dr. Ali Jamnia
Publisher: CRC Press
ISBN: 1351372009
Category : Technology & Engineering
Languages : en
Pages : 483
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Book Description
Introduction to Product Design and Development for Engineers provides guidelines and best practices for the design, development, and evaluation of engineered products. Created to serve fourth year undergraduate students in Engineering Design modules with a required project, the text covers the entire product design process and product life-cycle, from the initial concept to the design and development stages, and through to product testing, design documentation, manufacturability, marketing, and sustainability. Reflecting the author's long career as a design engineer, this text will also serve as a practical guide for students working on their capstone design projects.
Author: Ali Jamnia
Publisher: CRC Press
ISBN: 1498754023
Category : Technology & Engineering
Languages : en
Pages : 374
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Book Description
Successfully Estimate the Thermal and Mechanical Characteristics of Electronics Systems A definitive guide for practitioners new to the field or requiring a refresher course, Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition provides an understanding of system failures and helps identify the areas where they can occur. Specifically designed for the mechanical, electrical, or quality engineer, the book addresses engineering issues involved in electronics packaging and provides the basics needed to design a new system or troubleshoot a current one. Updated to reflect recent developments in the field, this latest edition adds two new chapters on acoustic and reliability fundamentals, and contains more information on electrical failures and causes. It also includes tools for understanding heat transfer, shock, and vibration. Additionally, the author: Addresses various cross-discipline issues in the design of electromechanical products Provides a solid foundation for heat transfer, vibration, and life expectancy calculations Identifies reliability issues and concerns Develops the ability to conduct a more thorough analysis for the final design Includes design tips and guidelines for each aspect of electronics packaging Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition explains the mechanical and thermal/fluid aspects of electronic product design and offers a basic understanding of electronics packaging design issues. Defining the material in-depth, it also describes system design guidelines and identifies reliability concerns for practitioners in mechanical, – electrical or quality engineering.
Author: Walter Soroka
Publisher: DEStech Publications, Inc
ISBN: 1930268270
Category : Emballage
Languages : en
Pages : 273
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Book Description
Comprising over 4,500 definitions, this book provides explanation of the often arcane, English-language terminology that denotes the materials and manufacturing processes used in different phases of the packaging industry. It is suitable for those who use packaging technology.
Author: Charles A. Harper
Publisher: McGraw-Hill Companies
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 1020
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Book Description
Charles A. Harper's 2nd edition on designing and manufacturing all the major types of electronic systems is now double the size of the 1st edition. It draws upon the expertise of a dozen experts to make sense of this highly interdisciplinary field
Author:
Publisher:
ISBN:
Category : Chemical engineering
Languages : en
Pages : 766
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Book Description
