Measurement and Mechanics of Multilayered Thin-film Adhesion PDF Download
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Author: Michael David Kriese
Publisher:
ISBN:
Category :
Languages : en
Pages : 426
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Book Description
Author: Michael David Kriese
Publisher:
ISBN:
Category :
Languages : en
Pages : 426
Get Book Here
Book Description
Author: Ephraim Suhir
Publisher: Springer Science & Business Media
ISBN: 0387329897
Category : Technology & Engineering
Languages : en
Pages : 1471
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Book Description
This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.
Author: Sam Zhang
Publisher: CRC Press
ISBN: 1482222914
Category : Science
Languages : en
Pages : 610
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Book Description
Thin Films and Coatings: Toughening and Toughness Characterization captures the latest developments in the toughening of hard coatings and in the measurement of the toughness of thin films and coatings. Featuring chapters contributed by experts from Australia, China, Czech Republic, Poland, Singapore, Spain, and the United Kingdom, this book: Presents the current status of hard-yet-tough ceramic coatings Reviews various toughness evaluation methods for films and hard coatings Explores the toughness and toughening mechanisms of porous thin films and laser-treated surfaces Examines adhesions of the film/substrate interface and the characterization of coating adhesion strength Discusses nanoindentation determination of fracture toughness, resistance to cracking, and sliding contact fracture phenomena Toughening and toughness measurement (of films and coatings) are two related, yet separate, fields of great importance in today’s nanotechnology world. Thin Films and Coatings: Toughening and Toughness Characterization is a timely reference written in such a way that novices will find it a stepping stone to the field and veterans will find it a rich source of information for their research.
Author: K. L. Mittal
Publisher: John Wiley & Sons
ISBN: 1119407516
Category : Technology & Engineering
Languages : en
Pages : 458
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Book Description
With the ever-increasing amount of research being published it is a Herculean task to be fully conversant with the latest research developments in any field, and the arena of adhesion and adhesives is no exception. Thus, topical review articles provide an alternate and very efficient way to stay abreast of the state-of-the-art in may subjects representing the field of adhesion science and adheisves. Based on the success and the warm reception accorded to the premier volume in this series “Progress in Adhesion and Adhesives” (containing the review articles published in Volume 2 (2014) of the journal Reviews of Adhesion and Adhesives (RAA)), volume 2 comprises 14 review articles published in Volume 4 (2016) of RAA. The subjects of these 14 reviews fall into the following general areas: 1. Surface modification of polymers for a variety of purposes. 2. Adhesion aspects in reinforced composites 3. Thin films/coatings and their adhesion measurement 4. Bioadhesion and bio-implants 5. Adhesives and adhesive joints 6. General adhesion aspects The topics covered include: surface modification of natural fibers for reinforced polymer composites; adhesion of submicrometer thin metals films; surface treatments to modulate bioadhesion; hot-melt adhesives from renewable resources; particulate-polymer composites; functionally graded adhesively bonded joints; fabrication of nano-biodevices; effects of particulates on contact angles , thermal stresses in adhesively bonded joints and ways to mitigate these; laser-assisted electroless metallization of polymer materials; adhesion measurement of coatings on biodevices/implants; cyanoacrylate adhesives; and adhesion of green flame retardant coatings onto polyolefins.
Author: K. L. Mittal
Publisher: John Wiley & Sons
ISBN: 1118831349
Category : Technology & Engineering
Languages : en
Pages : 293
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Book Description
This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesion Surface (physical or chemical) characterization of materials as it pertains to adhesion Surface cleaning as it pertains to adhesion Ways to improve adhesion Unraveling of interfacial interactions using an array of pertinent techniques Characterization of interfaces / interphases Polymer-polymer adhesion Metal-polymer adhesion (metallized polymers) Polymer adhesion to various substrates Adhesion of thin films Adhesion of underfills Adhesion of molding compounds Adhesion of different dielectric materials Delamination and reliability issues in packaged devices Interface mechanics and crack propagation Adhesion measurement of thin films and coatings
Author: Bharat Bhushan
Publisher: Springer Science & Business Media
ISBN: 3540776087
Category : Technology & Engineering
Languages : en
Pages : 1530
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Book Description
This volume serves as a timely, practical introduction to the principles of nanotribology and nanomechanics and applications to magnetic storage systems and MEMS/NEMS. Assuming some familiarity with macrotribology/mechanics, the book comprises chapters by internationally recognized experts, who integrate knowledge of the field from the mechanics and materials-science perspectives. Graduate students, research workers, and practicing engineers will find the book of value.
Author: Mikhail Baklanov
Publisher: John Wiley & Sons
ISBN: 0470662549
Category : Technology & Engineering
Languages : en
Pages : 616
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Book Description
Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.
Author: Bharat Bhushan
Publisher: Springer Science & Business Media
ISBN: 364215283X
Category : Technology & Engineering
Languages : en
Pages : 633
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Book Description
The comprehensive reference and textbook serves as a timely, practical introduction to the principles of nanotribology and nanomechanics. Assuming some familiarity with macroscopic tribology, the book comprises chapters by internationally recognized experts, who integrate knowledge of the field from the mechanics and materials-science perspectives. They cover key measurement techniques, their applications, and theoretical modelling of interfaces, each beginning their contributions with macro- and progressing to microconcepts.
Author: Takayuki Kitamura
Publisher: CRC Press
ISBN: 9814669059
Category : Science
Languages : en
Pages : 329
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Book Description
Materials of micro-/nanometer dimensions have aroused remarkable interest, motivated by the diverse utility of unconventional mechanical and electronic properties distinguished from the bulk counterpart and various industrial applications such as electronic/optic devices and MEMS/NEMS. The size of their elements is now, ultimately, approaching nano
Author: Francesca Iacopi
Publisher: Springer Nature
ISBN: 3031216105
Category : Technology & Engineering
Languages : en
Pages : 271
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Book Description
This book provides readers with a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems with a broad range of functionalities that can be added to 3D microsystems, including flexible electronics, metasurfaces and power sources. The book also includes examples of applications for brain-computer interfaces and event-driven imaging systems. Provides a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems; Covers functionalities to add to 3D microsystems, including flexible electronics, metasurfaces and power sources; Includes current applications, such as brain-computer interfaces, event - driven imaging and edge computing.
