Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics: PDF Download
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Author: G. S. Oehrlein
Publisher: Cambridge University Press
ISBN: 9781107413153
Category : Technology & Engineering
Languages : en
Pages : 614
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Book Description
This book highlights important achievements and challenges in advanced interconnects and low-k dielectrics as employed in the microelectronics industry. The replacement of Al alloys with Cu along with the introduction of new barrier materials to protect Cu from chemical attack, and the utilization of new dielectric materials with a lower relative dielectric constant k than SiO2 in multilevel metallization structures of increasing complexity, are the major themes of evolution in this field. Invited reviews illustrate the significant progress that has been achieved as well as the challenges that remain. Contributed papers presented by researchers from different countries demonstrate progress on current topics using a truly multidisciplinary approach.
Author: G. S. Oehrlein
Publisher: Cambridge University Press
ISBN: 9781107413153
Category : Technology & Engineering
Languages : en
Pages : 614
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Book Description
This book highlights important achievements and challenges in advanced interconnects and low-k dielectrics as employed in the microelectronics industry. The replacement of Al alloys with Cu along with the introduction of new barrier materials to protect Cu from chemical attack, and the utilization of new dielectric materials with a lower relative dielectric constant k than SiO2 in multilevel metallization structures of increasing complexity, are the major themes of evolution in this field. Invited reviews illustrate the significant progress that has been achieved as well as the challenges that remain. Contributed papers presented by researchers from different countries demonstrate progress on current topics using a truly multidisciplinary approach.
Author:
Publisher:
ISBN:
Category : Dielectric films
Languages : en
Pages : 440
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Book Description
Author:
Publisher:
ISBN:
Category : Dielectric films
Languages : en
Pages : 562
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Book Description
Author: R. J. Carter
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 432
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Book Description
The scaling of device dimensions with a simultaneous increase in functional density has imposed tremendous challenges for materials, technology, integration and reliability of interconnects. To meet requirements of the ITRS roadmap, new materials are being introduced at a faster pace in all functions of multilevel interconnects. The issues addressed in this book cannot be dispelled as simply selecting a low-k material and integrating it into a copper damascene process. The intricacies of the back end for sub-100nm technology include novel processing of low-k materials, employing pore-sealing techniques and capping layers, introducing advanced dielectric and diffusion barriers, and developing novel integration schemes. This is in addition to concerns of performance, yield, and reliability appropriate to nanoscaled interconnects. Although many challenges continue to impede progress along the ITRS roadmap, the contributions in this book confront them head-on. It provides a scientific understanding of the issues and stimulate new approaches to advanced multilevel interconnects.
Author:
Publisher:
ISBN:
Category : Dielectric films
Languages : en
Pages : 624
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Book Description
Author: Materials Research Society. Meeting
Publisher:
ISBN:
Category : Dielectric films
Languages : en
Pages : 544
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Book Description
Author:
Publisher:
ISBN: 9781558996502
Category : Dielectric films
Languages : en
Pages : 107
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Book Description
Author: Paul R. Besser
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 450
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This volume was first published in 2005.
Author: Mikhail Baklanov
Publisher: John Wiley & Sons
ISBN: 0470065419
Category : Technology & Engineering
Languages : en
Pages : 508
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Book Description
The topic of thin films is an area of increasing importance in materials science, electrical engineering and applied solid state physics; with both research and industrial applications in microelectronics, computer manufacturing, and physical devices. Advanced, high-performance computers, high-definition TV, broadband imaging systems, flat-panel displays, robotic systems, and medical electronics and diagnostics are a few examples of the miniaturized device technologies that depend on the utilization of thin film materials. This book presents an in-depth overview of the novel developments made by the scientific leaders in the area of modern dielectric films for advanced microelectronic applications. It contains clear, concise explanations of material science of dielectric films and their problem for device operation, including high-k, low-k, medium-k dielectric films and also specific features and requirements for dielectric films used in the packaging technology. A broad range of related topics are covered, from physical principles to design, fabrication, characterization, and applications of novel dielectric films.
Author: G. S. Mathad
Publisher: The Electrochemical Society
ISBN: 9781566772945
Category : Science
Languages : en
Pages : 262
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Book Description
