Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 392

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Book Description

Author:
Publisher:
ISBN:
Category : Computer architecture
Languages : en
Pages : 392

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Book Description

Author: Koen De Bosschere
Publisher: Springer
ISBN: 3540693386
Category : Computers
Languages : en
Pages : 298

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Book Description
This book constitutes the refereed proceedings of the Second International Conference on High Performance Embedded Architectures and Compilers, HiPEAC 2007, held in Ghent, Belgium, in January 2007. The 19 revised full papers presented together with one invited keynote paper were carefully reviewed and selected from 65 submissions. The papers are organized in topical sections.

Author: Dennis Abts
Publisher: Morgan & Claypool Publishers
ISBN: 1608454029
Category : Computers
Languages : en
Pages : 117

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Book Description
This book describes the design and engineering tradeoffs of datacenter networks. It describes interconnection networks from topology and network architecture to routing algorithms, and presents opportunities for taking advantage of the emerging technology trends that are influencing router microarchitecture. With the emergence of "many-core" processor chips, it is evident that we will also need "many-port" routing chips to provide a bandwidth-rich network to avoid the performance limiting effects of Amdahl's Law. We provide an overview of conventional topologies and their routing algorithms and show how technology, signaling rates and cost-effective optics are motivating new network topologies that scale up to millions of hosts. The book also provides detailed case studies of two high performance parallel computer systems and their networks. --Book Jacket.

Author: Albert Y. Zomaya
Publisher: John Wiley & Sons
ISBN: 1118342003
Category : Computers
Languages : en
Pages : 605

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Book Description
The energy consumption issue in distributed computing systems raises various monetary, environmental and system performance concerns. Electricity consumption in the US doubled from 2000 to 2005. From a financial and environmental standpoint, reducing the consumption of electricity is important, yet these reforms must not lead to performance degradation of the computing systems. These contradicting constraints create a suite of complex problems that need to be resolved in order to lead to 'greener' distributed computing systems. This book brings together a group of outstanding researchers that investigate the different facets of green and energy efficient distributed computing. Key features: One of the first books of its kind Features latest research findings on emerging topics by well-known scientists Valuable research for grad students, postdocs, and researchers Research will greatly feed into other technologies and application domains

Author: Gabriela Nicolescu
Publisher: Springer Science & Business Media
ISBN: 9400711255
Category : Technology & Engineering
Languages : en
Pages : 473

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Book Description
Design technology to address the new and vast problem of heterogeneous embedded systems design while remaining compatible with standard “More Moore” flows, i.e. capable of simultaneously handling both silicon complexity and system complexity, represents one of the most important challenges facing the semiconductor industry today and will be for several years to come. While the micro-electronics industry, over the years and with its spectacular and unique evolution, has built its own specific design methods to focus mainly on the management of complexity through the establishment of abstraction levels, the emergence of device heterogeneity requires new approaches enabling the satisfactory design of physically heterogeneous embedded systems for the widespread deployment of such systems. Heterogeneous Embedded Systems, compiled largely from a set of contributions from participants of past editions of the Winter School on Heterogeneous Embedded Systems Design Technology (FETCH), proposes a necessarily broad and holistic overview of design techniques used to tackle the various facets of heterogeneity in terms of technology and opportunities at the physical level, signal representations and different abstraction levels, architectures and components based on hardware and software, in all the main phases of design (modeling, validation with multiple models of computation, synthesis and optimization). It concentrates on the specific issues at the interfaces, and is divided into two main parts. The first part examines mainly theoretical issues and focuses on the modeling, validation and design techniques themselves. The second part illustrates the use of these methods in various design contexts at the forefront of new technology and architectural developments.

Author: Yuan Xie
Publisher: Springer Nature
ISBN: 3031017471
Category : Technology & Engineering
Languages : en
Pages : 113

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Book Description
The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, promise attractive solutions to reduce the delay of interconnects in future microprocessors. 3D memory stacking enables much higher memory bandwidth for future chip-multiprocessor design, mitigating the "memory wall" problem. In addition, heterogenous integration enabled by 3D technology can also result in innovative designs for future microprocessors. This book first provides a brief introduction to this emerging technology, and then presents a variety of approaches to designing future 3D microprocessor systems, by leveraging the benefits of low latency, high bandwidth, and heterogeneous integration capability which are offered by 3D technology.

Author: Philip Garrou
Publisher: John Wiley & Sons
ISBN: 352762306X
Category : Technology & Engineering
Languages : en
Pages : 798

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Book Description
The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.

Author: Guangyu Sun
Publisher: Springer Science & Business Media
ISBN: 3319006819
Category : Technology & Engineering
Languages : en
Pages : 126

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Book Description
This book equips readers with tools for computer architecture of high performance, low power, and high reliability memory hierarchy in computer systems based on emerging memory technologies, such as STTRAM, PCM, FBDRAM, etc. The techniques described offer advantages of high density, near-zero static power, and immunity to soft errors, which have the potential of overcoming the “memory wall.” The authors discuss memory design from various perspectives: emerging memory technologies are employed in the memory hierarchy with novel architecture modification; hybrid memory structure is introduced to leverage advantages from multiple memory technologies; an analytical model named “Moguls” is introduced to explore quantitatively the optimization design of a memory hierarchy; finally, the vulnerability of the CMPs to radiation-based soft errors is improved by replacing different levels of on-chip memory with STT-RAMs.

Author: Christoforos Kachris
Publisher: Springer Science & Business Media
ISBN: 1461446309
Category : Technology & Engineering
Languages : en
Pages : 179

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Book Description
Optical Interconnects in Future Data Center Networks covers optical networks and how they can be used to provide high bandwidth, energy efficient interconnects for future data centers with increased communication bandwidth requirements. This contributed volume presents an integrated view of the future requirements of the data centers and serves as a reference work for some of the most advanced solutions that have been proposed by major universities and companies. Collecting the most recent and innovative optical interconnects for data center networks that have been presented in the research community by universities and industries, this book is a valuable reference to researchers, students, professors and engineers interested in the domain of high performance interconnects and data center networks. Additionally, Optical Interconnects in Future Data Center Networks provides invaluable insights into the benefits and advantages of optical interconnects and how they can be a promising alternative for future data center networks.