Author: Felipe de Campos Carreri
Publisher: Fraunhofer Verlag
ISBN: 9783839612873
Category : Technology & Engineering
Languages : en
Pages : 0
Get Book Here
Book Description
The scope of this work is to investigate and to develop advanced HIPIMS processes for deposition of oxides, utilizing industrial-scale equipment and technology. Two classes of oxide materials were studied: insulating (aluminum oxide) and conducting oxides (indium-tin oxide and aluminum-doped zinc oxide). The electrical properties of the oxides have a significant influence on the process design, as the issues and approaches for deposition of insulating materials are fairly different from conducting materials. Different types of reactive process control were also investigated, utilizing optical emission spectroscopy to control the oxygen flow and lambda probes to control the discharge power. A non-reactive process was also studied for indium-tin oxide.
Author: Peter M. Martin
Publisher: William Andrew
ISBN: 0815520328
Category : Technology & Engineering
Languages : en
Pages : 932
Get Book Here
Book Description
This 3e, edited by Peter M. Martin, PNNL 2005 Inventor of the Year, is an extensive update of the many improvements in deposition technologies, mechanisms, and applications. This long-awaited revision includes updated and new chapters on atomic layer deposition, cathodic arc deposition, sculpted thin films, polymer thin films and emerging technologies. Extensive material was added throughout the book, especially in the areas concerned with plasma-assisted vapor deposition processes and metallurgical coating applications.
Author: Daniel Lundin
Publisher:
ISBN: 0128124547
Category : Technology & Engineering
Languages : en
Pages : 398
Get Book Here
Book Description
High Power Impulse Magnetron Sputtering: Fundamentals, Technologies, Challenges and Applications is an in-depth introduction to HiPIMS that emphasizes how this novel sputtering technique differs from conventional magnetron processes in terms of both discharge physics and the resulting thin film characteristics. Ionization of sputtered atoms is discussed in detail for various target materials. In addition, the role of self-sputtering, secondary electron emission and the importance of controlling the process gas dynamics, both inert and reactive gases, are examined in detail with an aim to generate stable HiPIMS processes. Lastly, the book also looks at how to characterize the HiPIMS discharge, including essential diagnostic equipment. Experimental results and simulations based on industrially relevant material systems are used to illustrate mechanisms controlling nucleation kinetics, column formation and microstructure evolution. Includes a comprehensive description of the HiPIMS process from fundamental physics to applications Provides a distinctive link between the process plasma and thin film communities Discusses the industrialization of HiPIMS and its real world applications
Author: Asim Aijaz
Publisher:
ISBN: 9789175194080
Category :
Languages : en
Pages : 98
Get Book Here
Book Description
Author: Krishna Seshan
Publisher: William Andrew
ISBN: 0128123125
Category : Technology & Engineering
Languages : en
Pages : 472
Get Book Here
Book Description
Handbook of Thin Film Deposition, Fourth Edition, is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry and the closely related areas of thin film deposition, thin film micro properties, photovoltaic solar energy applications, materials for memory applications and methods for thin film optical processes. The book is broken up into three sections: scaling, equipment and processing, and applications. In this newly revised edition, the handbook will also explore the limits of thin film applications, most notably as they relate to applications in manufacturing, materials, design and reliability. - Offers a practical survey of thin film technologies aimed at engineers and managers involved in all stages of the process: design, fabrication, quality assurance, applications and the limitations faced by those processes - Covers core processes and applications in the semiconductor industry and new developments within the photovoltaic and optical thin film industries - Features a new chapter discussing Gates Dielectrics
Author: Diederik Depla
Publisher: Springer Science & Business Media
ISBN: 3540766642
Category : Technology & Engineering
Languages : en
Pages : 584
Get Book Here
Book Description
In this valuable work, all aspects of the reactive magnetron sputtering process, from the discharge up to the resulting thin film growth, are described in detail, allowing the reader to understand the complete process. Hence, this book gives necessary information for those who want to start with reactive magnetron sputtering, understand and investigate the technique, control their sputtering process and tune their existing process, obtaining the desired thin films.
Author: Jaydeep Sarkar
Publisher: William Andrew
ISBN: 0815519877
Category : Technology & Engineering
Languages : en
Pages : 614
Get Book Here
Book Description
An important resource for students, engineers and researchers working in the area of thin film deposition using physical vapor deposition (e.g. sputtering) for semiconductor, liquid crystal displays, high density recording media and photovoltaic device (e.g. thin film solar cell) manufacturing. This book also reviews microelectronics industry topics such as history of inventions and technology trends, recent developments in sputtering technologies, manufacturing steps that require sputtering of thin films, the properties of thin films and the role of sputtering target performance on overall productivity of various processes. Two unique chapters of this book deal with productivity and troubleshooting issues. The content of the book has been divided into two sections: (a) the first section (Chapter 1 to Chapter 3) has been prepared for the readers from a range of disciplines (e.g. electrical, chemical, chemistry, physics) trying to get an insight into use of sputtered films in various devices (e.g. semiconductor, display, photovoltaic, data storage), basic of sputtering and performance of sputtering target in relation to productivity, and (b) the second section (Chapter 4 to Chapter 8) has been prepared for readers who already have background knowledge of sputter deposition of thin films, materials science principles and interested in the details of sputtering target manufacturing methods, sputtering behavior and thin film properties specific to semiconductor, liquid crystal display, photovoltaic and magnetic data storage applications. In Chapters 5 to 8, a general structure has been used, i.e. a description of the applications of sputtered thin films, sputtering target manufacturing methods (including flow charts), sputtering behavior of targets (e.g. current - voltage relationship, deposition rate) and thin film properties (e.g. microstructure, stresses, electrical properties, in-film particles). While discussing these topics, attempts have been made to include examples from the actual commercial processes to highlight the increased complexity of the commercial processes with the growth of advanced technologies. In addition to personnel working in industry setting, university researchers with advanced knowledge of sputtering would also find discussion of such topics (e.g. attributes of target design, chamber design, target microstructure, sputter surface characteristics, various troubleshooting issues) useful. . - Unique coverage of sputtering target manufacturing methods in the light of semiconductor, displays, data storage and photovoltaic industry requirements - Practical information on technology trends, role of sputtering and major OEMs - Discussion on properties of a wide variety of thin films which include silicides, conductors, diffusion barriers, transparent conducting oxides, magnetic films etc. - Practical case-studies on target performance and troubleshooting - Essential technological information for students, engineers and scientists working in the semiconductor, display, data storage and photovoltaic industry
Author: Alberto Palmero
Publisher: MDPI
ISBN: 3039364294
Category : Science
Languages : en
Pages : 148
Get Book Here
Book Description
Recent years have witnessed the flourishing of numerous novel strategies based on the magnetron sputtering technique aimed at the advanced engineering of thin films, such as HiPIMS, combined vacuum processes, the implementation of complex precursor gases or the inclusion of particle guns in the reactor, among others. At the forefront of these approaches, investigations focused on nanostructured coatings appear today as one of the priorities in many scientific and technological communities: The science behind them appears in most of the cases as a "terra incognita", fascinating both the fundamentalist, who imagines new concepts, and the experimenter, who is able to create and study new films with as of yet unprecedented performances. These scientific and technological challenges, along with the existence of numerous scientific issues that have yet to be clarified in classical magnetron sputtering depositions (e.g., process control and stability, nanostructuration mechanisms, connection between film morphology and properties or upscaling procedures from the laboratory to industrial scales) have motivated us to edit a specialized volume containing the state-of-the art that put together these innovative fundamental and applied research topics. These include, but are not limited to: • Nanostructure-related properties; • Atomistic processes during film growth; • Process control, process stability, and in situ diagnostics; • Fundamentals and applications of HiPIMS; • Thin film nanostructuration phenomena; • Tribological, anticorrosion, and mechanical properties; • Combined procedures based on the magnetron sputtering technique; • Industrial applications; • Devices.
Author:
Publisher: Academic Press
ISBN: 008054293X
Category : Science
Languages : en
Pages : 268
Get Book Here
Book Description
This volume provides the first comprehensive look at a pivotal new technology in integrated circuit fabrication. For some time researchers have sought alternate processes for interconnecting the millions of transistors on each chip because conventional physical vapor deposition can no longer meet the specifications of today's complex integrated circuits. Out of this research, ionized physical vapor deposition has emerged as a premier technology for the deposition of thin metal films that form the dense interconnect wiring on state-of-the-art microprocessors and memory chips.For the first time, the most recent developments in thin film deposition using ionized physical vapor deposition (I-PVD) are presented in a single coherent source. Readers will find detailed descriptions of relevant plasma source technology, specific deposition systems, and process recipes. The tools and processes covered include DC hollow cathode magnetrons, RF inductively coupled plasmas, and microwave plasmas that are used for depositing technologically important materials such as copper, tantalum, titanium, TiN, and aluminum. In addition, this volume describes the important physical processes that occur in I-PVD in a simple and concise way. The physical descriptions are followed by experimentally-verified numerical models that provide in-depth insight into the design and operation I-PVD tools.Practicing process engineers, research and development scientists, and students will find that this book's integration of tool design, process development, and fundamental physical models make it an indispensable reference.Key Features:The first comprehensive volume on ionized physical vapor depositionCombines tool design, process development, and fundamental physical understanding to form a complete picture of I-PVDEmphasizes practical applications in the area of IC fabrication and interconnect technologyServes as a guide to select the most appropriate technology for any deposition application*This single source saves time and effort by including comprehensive information at one's finger tips*The integration of tool design, process development, and fundamental physics allows the reader to quickly understand all of the issues important to I-PVD*The numerous practical applications assist the working engineer to select and refine thin film processes
Author: Yao Jin
Publisher:
ISBN:
Category :
Languages : en
Pages :
Get Book Here
Book Description
A vanadium oxide (VO x) thin film is the most common imaging layer used in commercial uncooled focal plane arrays for infrared cameras. These VOx thin films have an x value ranging from 1.3 to 2 and have low resistivity (0.1 to 10 [omega] cm), high temperature coefficient of resistance (TCR) (-2 to -3 %/K), and low 1/f noise. Reactive ion beam sputtering is typically used to deposit these VOx thin films for commercial thermal imaging cameras. However, the reactive ion beam deposition system for the VOx is reported to have less than desirable throughput and a narrow process window. In this work, the potential for reactive pulsed-dc magnetron sputtering of nanocomposite VOx thin films for microbolometer applications was investigated. VOx thin films with resistivity from 10-4 to 105 [omega] cm with a TCR from 0 to -4.3 %/K were deposited by reactive sputtering from a metallic vanadium target in argon/oxygen mixtures with substrate bias. Magnetron sputtered VOx shows bolometric properties comparable to those of commercial-grade IBD prepared VOx. Important limitations for manufacturing implementation of reactive magnetron sputtering such as hysteresis oxidation and non-uniform oxidation of the vanadium target surface were evaluated. The VOx film deposition rate, resistivity, and temperature coefficient of resistance were correlated to oxygen to argon ratio, processing pressure, target-to-substrate distance, and oxygen inlet positions. To deposit VOx in the resistivity range of 0.1--10 [omega] cm with good uniformity and process control, it was found that a lower processing pressure, larger target-to-substrate distance, and an oxygen inlet near the substrate are useful. Other processing methods employing magnetron sputtering were investigated such as co-sputtering of V and V2O5 target, sputtering from a VC target, a V2O5 target, and a V2Ox target but initial investigation of these methods did not yield a superior process to the simple sputtering of a pure metallic vanadium target. Another technique, biased target ion beam deposition (BTIBD), was investigated for deposition VOx thin films with potential alloy additions. In this BTIBD system, ions with energy lower than 25 eV were generated remotely and vanadium targets are negatively biased independently for sputtering. High TCR (
