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Author: Institute of Electrical and Electronics Engineers
Publisher:
ISBN:
Category : Electric cables
Languages : en
Pages : 0
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Book Description
Various field test methods that are currently available for or have been developed are listed in this guide. The guide covers shielded, insulated power cable systems rated 5 kV and above. The guide also describes the tests and gives advantages and disadvantages, suggested applications, and typical results. Complete guides covering some of the test methods listed are available in the form of IEEE 400 "point" documents.
Author: Institute of Electrical and Electronics Engineers
Publisher:
ISBN:
Category : Electric cables
Languages : en
Pages : 0
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Book Description
Various field test methods that are currently available for or have been developed are listed in this guide. The guide covers shielded, insulated power cable systems rated 5 kV and above. The guide also describes the tests and gives advantages and disadvantages, suggested applications, and typical results. Complete guides covering some of the test methods listed are available in the form of IEEE 400 "point" documents.
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ISBN: 9781504499293
Category :
Languages : en
Pages : 0
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ISBN: 9781504495974
Category :
Languages : en
Pages : 0
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Author: Xuzhu Dong
Publisher: Springer Nature
ISBN: 9819974011
Category : Technology & Engineering
Languages : en
Pages : 731
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Book Description
This book includes original, peer-reviewed research papers from the 2023 4th International Symposium on Insulation and Discharge Computation for Power Equipment (IDCOMPU2023), held in Wuhan, China. The topics covered include but are not limited to: insulation, discharge computations, electric power equipment, and electrical materials. The papers share the latest findings in the field of insulation and discharge computations of electric power equipment, making the book a valuable asset for researchers, engineers, university students, etc.
Author: Chunwei Cai
Publisher: Springer Nature
ISBN: 9819708737
Category :
Languages : en
Pages : 748
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Book Description
Author: Muhammet Nuri Seyman
Publisher: Springer Nature
ISBN: 3031527607
Category :
Languages : en
Pages : 405
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Book Description
Author: Dongkai Shangguan
Publisher: CRC Press
ISBN: 1040028640
Category : Technology & Engineering
Languages : en
Pages : 463
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Book Description
In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come. This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book. The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.
Author: Biao Luo
Publisher: Springer Nature
ISBN: 9819980798
Category : Computers
Languages : en
Pages : 614
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Book Description
The six-volume set LNCS 14447 until 14452 constitutes the refereed proceedings of the 30th International Conference on Neural Information Processing, ICONIP 2023, held in Changsha, China, in November 2023. The 652 papers presented in the proceedings set were carefully reviewed and selected from 1274 submissions. They focus on theory and algorithms, cognitive neurosciences; human centred computing; applications in neuroscience, neural networks, deep learning, and related fields.
Author: Amit Kumar Tyagi
Publisher: CRC Press
ISBN: 1040116906
Category : Technology & Engineering
Languages : en
Pages : 389
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Book Description
Industry 4.0 is a revolutionary concept that aims to enhance productivity and profitability in various industries through the implementation of smart manufacturing techniques. This book discusses the profound impact of Industry 4.0, which involves the seamless integration of digital technologies into manufacturing processes within the realm of industrial engineering. Industry 4.0, Smart Manufacturing, and Industrial Engineering: Challenges and Opportunities thoroughly examines the intricate facets of Industry 4.0 and Smart Manufacturing, offering a comprehensive overview of the challenges and opportunities that this paradigm shift presents to industrial engineers. It provides practical insights and strategies to help professionals navigate the complexities of this evolving landscape. Fundamental components of Industry 4.0 and Smart Manufacturing, ranging from the incorporation of sensors and data analytics to the deployment of cyber-physical systems and the promotion of sustainable practices are covered in detail. The book addresses the obstacles and prospects brought about by Industry 4.0 in the digital age and offers solutions to issues such as data security, interoperability, and workforce preparedness. The book sheds light on how Industry 4.0 combines various disciplines, including engineering technology, data science, and management. It serves as a valuable resource for researchers, undergraduate and postgraduate students, as well as professionals operating in the field of industrial engineering and related domains.
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ISBN:
Category :
Languages : en
Pages : 0
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