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Author: Mourad Elsobky
Publisher: Cambridge University Press
ISBN: 1108983383
Category : Technology & Engineering
Languages : en
Pages : 92
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Book Description
Hybrid Systems-in-Foil (HySiF) is a concept that extends the potential of conventional More-than-More Systems-in/on-Package (SiPs and SoPs) to the flexible electronics world. In HySiF, an economical implementation of flexible electronic systems is possible by integrating a minimum number of embedded silicon chips and a maximum number of on-foil components. Here, the complementary characteristics of CMOS SoCs and larger area organic and printed electronics are combined in a HySiF-compatible polymeric substrate. Within the HySiF scope, the fabrication process steps and the integration design rules with all the accompanying boundary conditions concerning material compatibility, surface properties, and thermal budget, are defined. This Element serves as an introduction to the HySiF concept. A summary of recent ultra-thin chip fabrication and flexible packaging techniques is provided. Several bendable electronic components are presented demonstrating the benefits of HySiF. Finally, prototypes of flexible wireless sensor systems that adopt the HySiF concept are demonstrated.
Author: Mourad Elsobky
Publisher: Cambridge University Press
ISBN: 1108983383
Category : Technology & Engineering
Languages : en
Pages : 92
Get Book Here
Book Description
Hybrid Systems-in-Foil (HySiF) is a concept that extends the potential of conventional More-than-More Systems-in/on-Package (SiPs and SoPs) to the flexible electronics world. In HySiF, an economical implementation of flexible electronic systems is possible by integrating a minimum number of embedded silicon chips and a maximum number of on-foil components. Here, the complementary characteristics of CMOS SoCs and larger area organic and printed electronics are combined in a HySiF-compatible polymeric substrate. Within the HySiF scope, the fabrication process steps and the integration design rules with all the accompanying boundary conditions concerning material compatibility, surface properties, and thermal budget, are defined. This Element serves as an introduction to the HySiF concept. A summary of recent ultra-thin chip fabrication and flexible packaging techniques is provided. Several bendable electronic components are presented demonstrating the benefits of HySiF. Finally, prototypes of flexible wireless sensor systems that adopt the HySiF concept are demonstrated.
Author: An Chen
Publisher: John Wiley & Sons
ISBN: 1119869609
Category : Technology & Engineering
Languages : en
Pages : 372
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Book Description
Advances in Semiconductor Technologies Discover the broad sweep of semiconductor technologies in this uniquely curated resource Semiconductor technologies and innovations have been the backbone of numerous different fields: electronics, online commerce, the information and communication industry, and the defense industry. For over fifty years, silicon technology and CMOS scaling have been the central focus and primary driver of innovation in the semiconductor industry. Traditional CMOS scaling has approached some fundamental limits, and as a result, the pace of scientific research and discovery for novel semiconductor technologies is increasing with a focus on novel materials, devices, designs, architectures, and computer paradigms. In particular, new computing paradigms and systems—such as quantum computing, artificial intelligence, and Internet of Things—have the potential to unlock unprecedented power and application space. Advances in Semiconductor Technologies provides a comprehensive overview of selected semiconductor technologies and the most up-to-date research topics, looking in particular at mainstream developments in current industry research and development, from emerging materials and devices, to new computing paradigms and applications. This full-coverage volume gives the reader valuable insights into state-of-the-art advances currently being fabricated, a wide range of novel applications currently under investigation, and a glance into the future with emerging technologies in development. Advances in Semiconductor Technologies readers will also find: A comprehensive approach that ensures a thorough understanding of state-of-the-art technologies currently being fabricated Treatments on all aspects of semiconductor technologies, including materials, devices, manufacturing, modeling, design, architecture, and applications Articles written by an impressive team of international academics and industry insiders that provide unique insights into a wide range of topics Advances in Semiconductor Technologies is a useful, time-saving reference for electrical engineers working in industry and research, who are looking to stay abreast of rapidly advancing developments in semiconductor electronics, as well as academics in the field and government policy advisors.
Author: Jonathan Demko
Publisher: CRC Press
ISBN: 1000579689
Category : Science
Languages : en
Pages : 459
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Book Description
Cryogenic engineering (cryogenics) is the production, preservation, and use or application of cold. This book presents a comprehensive introduction to designing systems to deal with heat – effective management of cold, exploring the directing (or redirecting), promoting, or inhibiting this flow of heat in a practical way. It provides a description of the necessary theory, design methodology, and advanced demonstrations (thermodynamics, heat transfer, thermal insulation, fluid mechanics) for many frequently occurring situations in low-temperature apparatus. This includes systems that are widely used such as superconducting magnets for magnetic resonance imaging (MRI), high-energy physics, fusion, tokamak and free electron laser systems, space launch and exploration, and energy and transportation use of liquid hydrogen, as well as potential future applications of cryo-life sciences and chemical industries. The book is written with the assumption that the reader has an undergraduate understanding of thermodynamics, heat transfer, and fluid mechanics, in addition to the mechanics of materials, material science, and physical chemistry. Cryogenic Heat Management: Technology and Applications for Science and Industry will be a valuable guide for those researching, teaching, or working with low-temperature or cryogenic systems, in addition to postgraduates studying the topic. Key features: Presents simplified but useful and practical equations that can be applied in estimating performance and design of energy-efficient systems in low-temperature systems or cryogenics Contains practical approaches and advanced design materials for insulation, shields/anchors, cryogen vessels/pipes, calorimeters, cryogenic heat switches, cryostats, current leads, and RF couplers Provides a comprehensive introduction to the necessary theory and models needed for solutions to common difficulties and illustrates the engineering examples with more than 300 figures
Author:
Publisher:
ISBN:
Category : Technology
Languages : en
Pages : 1286
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Book Description
Author: Hong Meng
Publisher: John Wiley & Sons
ISBN: 3527353593
Category : Technology & Engineering
Languages : en
Pages : 389
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Book Description
Flexible Electronic Packaging and Encapsulation Technology A systematic introduction to the future of electronic packaging Electronic packaging materials are among the most important components of the broader electronics industry, capable of facilitating heat dissipation, redistributing stress on electronic components, and providing environmental protections for electronic systems. Recent advances in integrated circuits, especially the development of flexible electronic technology, have placed increasingly stringent demands on the capabilities of electronic packaging. These technologies have the potential to reshape our world, and they demand a generation of engineers capable of harnessing that potential. Flexible Electronic Packaging and Encapsulation Technology meets this demand with an introduction to the cutting-edge technologies available to package electronic components, as well as the testing methods and applications that bring these technologies to bear on the industry. These packaging technologies promise to bring lightness, flexibility, and environmental friendliness to the next generation of electronic systems. Flexible Electronic Packaging and Encapsulation Technology readers will also find: Survey of commercial electronic packaging materials and patents for reference purposes Guidelines for designing high-performance packaging materials with novel structures An authorial team of leading researchers in the field Flexible Electronic Packaging and Encapsulation Technology is ideal for materials scientists, electronics engineers, solid state physicists, professionals in the semiconductor industry, and any other researchers or professionals working with electronic systems.
Author: Anatolie Sidorenko
Publisher: Springer Nature
ISBN: 9402419098
Category : Technology & Engineering
Languages : en
Pages : 320
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Book Description
Over the last decade, techniques for materials preparation and processing at nanometer scale have advanced rapidly, leading to the introduction of novel principles for a new generation of sensors and detectors. At the same time, the chemical industry, transport and agriculture produce huge amounts of dangerous waste gases and liquids, leading to soil, air and water contamination. One more modern threat - international terrorism - demands that scientists make efforts to apply new principles and technologies to protect society against chemical, biological, radiological and nuclear (CBRN) attacks and to develop novel effective technologies for the remediation of large contaminated areas. Accordingly, the main goal of this book is to bring together experts (theorists, experimentalists, engineers and technologists) for an extensive discussion covering: novel principles for functional nanostructures and detector fabrication and implementation, the development of novel technologies for the deactivation of CBRN agents, their experimental realization and their application in novel monitoring and control systems, and technological processes for soil and water remediation, with a view to environmental protection and defence against CBRN-based terrorism. In keeping with the book’s main goal, the following topics are highlighted and discussed: - Sensors and detectors - detection of chemicals, principles of “artificial nose” and chemical “micro-lab on a chip” design, surface and underground water quality monitoring systems, molecular electronics, superconducting electronic devices, quantum detectors and Qubits. - Environmental protection and CBRN - detection of infrared, microwave, X-ray and terahertz radiation. Principles for novel IR-, UV-, and Terahertz-wave devices for the detection of low-contrast objects. - Novel technological processes for CBRN destruction and deactivation. All these topics are strongly interrelated, both with regard to fundamental aspects and to fabrication and implementation technologies; in addition, they are highly promising for application in novel functional devices, computer logics, sensing and detection of low-concentration chemicals, weak and extremely weak magnetic and microwave fields, infrared and ultraviolet radiation. Given its scope, the book will be a useful and interesting guide for a broad readership of engineers, scientists, PhD students and experts in the area of defence against environmental terrorism.
Author: Athanasios Chasalevris
Publisher: Springer Nature
ISBN: 3031323947
Category : Technology & Engineering
Languages : en
Pages : 218
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Book Description
This book reports on cutting-edge experimental and numerical findings related to the application of active bearings, including smart ones, in rotating machinery. It discusses their role in improving stability and control of rotor systems and reports in depth on the corresponding modeling and control approaches. Chapters are based on peer-reviewed contributions to the 1st Workshop on Active Bearings in Rotating Machinery (ABROM 2022), held on June 29- 30, 2022, in Athens, Greece, and organized in collaboration between the School of Mechanical Engineering of The National Technical University of Athens (NTUA) and the Faculty of Mechanical Engineering of Karlsruhe Institute of Technology (KIT). In connection with the increasing digital transformation of machine elements, this book offers a timely perspective and extensive information on testing methods and experimental procedures involved in the development of intelligent rotors for industrial applications.
Author: Nathan F. Lepora
Publisher: Springer
ISBN: 3642398022
Category : Computers
Languages : en
Pages : 480
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Book Description
This book constitutes the refereed proceedings of the second International Conference on Biomimetic and Biohybrid Systems, Living Machines 2013, held in London, UK, in July/August 2013. The 65 revised full papers presented were carefully reviewed and selected from various submissions. The papers are targeted at the intersection of research on novel live-like technologies inspired by scientific investigation of biological systems, biomimetics, and research that seeks to interface biological and artificial systems to create biohybrid systems
Author: S. W. Tsai
Publisher: ASTM International
ISBN: 9780803103078
Category : Technology & Engineering
Languages : en
Pages : 700
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Book Description
Author: Pawan Kumar Rakesh
Publisher: Springer Nature
ISBN: 9813340185
Category : Technology & Engineering
Languages : en
Pages : 557
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Book Description
This book presents the selected peer-reviewed proceedings of the International Conference on Innovative Engineering Design (ICOIED 2020). The contents provide a multidisciplinary approach for the development of innovative product design and their benefits for the society. The book presents latest advances in various fields like design process, service development, micro/nano technology, sensors and MEMS, and sustainability in engineering design. This book can be useful for students, researchers, and professionals interested in innovative product/process design and development.
