High-Density Magnetic Recording and Integrated Magneto-Optics: Materials and Devices: Volume 517

High-Density Magnetic Recording and Integrated Magneto-Optics: Materials and Devices: Volume 517 PDF Author: James Bain
Publisher:
ISBN:
Category : Computers
Languages : en
Pages : 706

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Book Description
Papers from an April 1998 symposium are arranged, as was the symposium, in two sections, the first on materials for high-density magnetic recording--head materials for write transducers and readback sensors; and integrated magneto-optics--materials and devices. The first section comprises contributions in such areas as high moment pole materials; anisotropic magnetoresistance, giant magnetoresistance, and exchange materials; spin tunnel junctions; microstructual issues in longitudinal recording media; thermal stability; novel structures; and nanotribology of wear layers. The second section contains papers on garnet materials for integrated photonics--fabrication and processing, and devices; magneto-optic recording media; and diluted magnetic semiconductors and other materials. Annotation copyrighted by Book News, Inc., Portland, OR

High-Density Magnetic Recording and Integrated Magneto-Optics: Materials and Devices: Volume 517

High-Density Magnetic Recording and Integrated Magneto-Optics: Materials and Devices: Volume 517 PDF Author: James Bain
Publisher:
ISBN:
Category : Computers
Languages : en
Pages : 706

Get Book Here

Book Description
Papers from an April 1998 symposium are arranged, as was the symposium, in two sections, the first on materials for high-density magnetic recording--head materials for write transducers and readback sensors; and integrated magneto-optics--materials and devices. The first section comprises contributions in such areas as high moment pole materials; anisotropic magnetoresistance, giant magnetoresistance, and exchange materials; spin tunnel junctions; microstructual issues in longitudinal recording media; thermal stability; novel structures; and nanotribology of wear layers. The second section contains papers on garnet materials for integrated photonics--fabrication and processing, and devices; magneto-optic recording media; and diluted magnetic semiconductors and other materials. Annotation copyrighted by Book News, Inc., Portland, OR

High-Density Magnetic Recording and Integrated Magneto-Optics: Materials and Devices; Symposium Held in San Francisco, California, on April 12-16 1998

High-Density Magnetic Recording and Integrated Magneto-Optics: Materials and Devices; Symposium Held in San Francisco, California, on April 12-16 1998 PDF Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 0

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Book Description
Symposium L. High-density magnetic recording continues to be one of the fastest growing and most rapidly improving technologies in the computer industry. Information storage density has doubled every two years for the past two decades. Nevertheless, recent materials advances in several areas have allowed an even faster rate of improvement during the past six years. Completely new areas of materials science are moving rapidly from basic theory to practical application in commercial products in a few short years.-- "Integrated Magneto-Optics-Materials and Devices" (Symposium M of the 1998 MRS Spring Meeting) drew international researchers with approximately one-third each coming from Japan and the U.S., and the remaining one-third coming from Europe, Russia and South America. Symposium topics included fabrication and processing of garnet materials for integrated photonics, devices for integrated photonics, magneto-optic (MO) recording media, diluted magnetic semiconductors, and other materials.

Electronic Packaging Materials Science X: Volume 515

Electronic Packaging Materials Science X: Volume 515 PDF Author: Daniel J. Belton
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 288

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Book Description
Proceedings of the April 1998 symposium, which focused on high-density package solutions, with an emphasis on flip-chip technology. Topics include interfacial adhesion behavior, flip-chip interconnections, high-density substrates, thermomechanical behavior, and packaging reliability issues. Articles address the fracture of polymer interfaces and the delamination tendencies seen with flip-chip interconnections on organic substrates, under-bump metallurgy issues, and overall reliability issues. Annotation copyrighted by Book News, Inc., Portland, OR

GaN and Related Alloys: Volume 537

GaN and Related Alloys: Volume 537 PDF Author: S. J. Pearton
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 1056

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Book Description
This book covers the full spectrum of activity in the GaN and related materials arena. These semiconductors are finding applications in full-color displays, high-density information storage, white lighting for outdoor or backlit displays, solar-blind UV detectors, high-power/high-temperature electronics, and covert undersea communications. Progress is been reported in the growth of thick layers on patterned substrates by various methods, leading to lower overall defect concentrations and improved current-voltage and reliability characteristics. The rapidly increasing market for blue/green LEDs is also noted by the entry of a number of new companies to the field. While these emitter technologies continue to be dominated by MOCVD material, there are exciting reports of UV detectors and HFET structures grown by MBE with device performance at least as good as by MOCVD. Topics include: GaN electronic and photonic devices; laser diodes and spectroscopy; electronic devices and processing; quantum dots and processing; novel growth, doping and processing and rare-earth doping and optical emission.

Advanced Interconnects and Contact Materials and Processes for Future Integrated Circuits: Volume 514

Advanced Interconnects and Contact Materials and Processes for Future Integrated Circuits: Volume 514 PDF Author: S. P. Murarka
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 596

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Book Description
Comprising the proceedings of an MRS symposium held in April of 1998, contributions in this volume are divided into ten sections: interconnection frontiers; aluminum interconnects; cobalt and other silicides; titanium silicide; MOSFET, source, drain, and interconnect engineering; copper interconnects and barriers; a poster session on advanced interconnects and contacts; contacts to compound semiconductor devices; novel interconnect materials and schemes; and diffusion barriers. Annotation copyrighted by Book News, Inc., Portland, OR

Advanced Catalytic Materials

Advanced Catalytic Materials PDF Author:
Publisher:
ISBN:
Category : Catalysts
Languages : en
Pages : 296

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Book Description


Diffusion Mechanisms in Crystalline Materials: Volume 527

Diffusion Mechanisms in Crystalline Materials: Volume 527 PDF Author: Yuri Mishin
Publisher: Mrs Proceedings
ISBN:
Category : Science
Languages : en
Pages : 576

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Book Description
Participants of the symposium held in April 1998 in San Francisco as part of the 1998 MRS Spring Meeting cleared the fog at least on some aspects of solid-state diffusion, particularly experimental and simulation techniques that provide access to atomic-scale mechanisms of diffusion in diverse classes of crystalline materials. The 68 contributions (including 18 invited talks) added to the knowledge base in several key areas: diffusion mechanisms in metals and alloys, in intermetallic compounds, and in semiconductors; grain boundary and surface diffusion, and diffusion in quasicrystals; and diffusion and ionic conductivity in ionic materials. Annotation copyrighted by Book News, Inc., Portland, OR

Solid Freeform and Additive Fabrication: Volume 542

Solid Freeform and Additive Fabrication: Volume 542 PDF Author: Duane Dimos
Publisher: Mrs Proceedings
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 200

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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Solid State Ionics

Solid State Ionics PDF Author:
Publisher:
ISBN:
Category : Ions
Languages : en
Pages : 752

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Book Description


III-V and IV-IV Materials and Processing Challenges for Highly Integrated Microelectronics and Optoelectronics: Volume 535

III-V and IV-IV Materials and Processing Challenges for Highly Integrated Microelectronics and Optoelectronics: Volume 535 PDF Author: S. A. Ringel
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 338

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Book Description
This book contains the proceedings of two symposia - 'Integration of Dissimilar Materials in Micro- and Optoelectronics' and 'III-V and SiGe Group IV Device/IC Processing Challenges for Commercial Applications'. The publication stems from the desire to achieve new levels of device functionality and higher levels of performance via integration of devices based on dissimilar semiconductors, where the constraint of lattice-matching on the breadth of attainable devices can be reduced. It covers fundamental topics germane to integration of a wide range of dissimilar materials spanning wide-bandgap III-V nitrides, III-V/Si integration, II-VI and II-VI/III-V compounds, heterovalent structures, oxides, photonic bandgap structures and others. Topics such as compliancy, dislocation control, selective area growth, bonding methodologies, etc. are featured. It also addresses processing issues in the manufacturing of III-V and Si-based heterostructures for commercial products. Here, the success enjoyed by silicon germanium technology is contrasted by the promise of silicon-carbon alloys which have opportunities and challenges for the new generation of process developers.