Heat Transfer in Microelectronic Equipment PDF Download
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Author: John H. Seely
Publisher:
ISBN: 9780608302782
Category :
Languages : en
Pages : 357
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Book Description
Author: John H. Seely
Publisher:
ISBN: 9780608302782
Category :
Languages : en
Pages : 357
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Book Description
Author: John H. Seely
Publisher: Marcel Dekker
ISBN: 9780824716110
Category : Science
Languages : en
Pages : 362
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Book Description
Author: Lian-Tuu Yeh
Publisher: American Society of Mechanical Engineers
ISBN:
Category : Science
Languages : en
Pages : 454
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Book Description
With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This new book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies. While focusing on understanding the physics involved in the subject area, the authors have provided substantial practical design data and empirical correlations used in the analysis and design of equipment. The book provides the fundamentals along with a step-by-step analysis approach to engineering, making it an indispensable reference volume. The authors present a comprehensive convective heat transfer catalog that includes correlations of heat transfer for various physical configurations and thermal boundary conditions. They also provide property tables of solids and fluids. Lian-Tuu Yeh and Richard Chu are recognized experts in the field of thermal management of electronic systems and have a combined 60 years of experience in the defense and commercial industries.
Author: John H. Seely
Publisher:
ISBN:
Category :
Languages : en
Pages : 350
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Book Description
Author: Adrian Bejan
Publisher: John Wiley & Sons
ISBN: 9780471390152
Category : Technology & Engineering
Languages : en
Pages : 1502
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Book Description
Das umfangreiche Handbuch des Wärmetransports reflektiert den gegenwärtigen Stand der Technologie und des Marktes. Geschrieben von Spezialisten dieses Gebiets; mit umfangreichem Daten- und Formelmaterial sowie Spezifikationen.
Author: Lian-Tuu Yeh
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages :
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Book Description
This Second Edition of a classic text is fully updated and greatly expanded, with in-depth revisions that include advancements in the component technology of microelectronics. The most noticeable one is the addition of an entirely new chapter on microwave modules and the gallium arsenide (GaAs) chips, which have seldom been discussed in any of the textbooks or publications in the area of thermal management of electronic equipment. With this new chapter, the book is complete and whole in the area of thermal design of electronics systems. With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies. While focusing on understanding the physics involved in the subject area, the authors have provided substantial practical design data and empirical correlations used in the analysis and design of equipment. The book provides the fundamentals along with a step-by-step analysis approach to engineering, making it an indispensable reference volume.
Author:
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 692
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Book Description
Author: Jerry E. Sergent
Publisher: McGraw Hill Professional
ISBN: 9780070266995
Category : Science
Languages : en
Pages : 370
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Book Description
Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. The "hands-on" guide to thermal management! In recent years, heat-sensitive electronic systems have been miniaturized far more than their heat-producing power supplies, leading to major design and reliability challenges — and making thermal management a critical design factor. This timely handbook covers all the practical issues that any packaging engineer must consider with regard to the thermal management of printed circuit boards, hybrid circuits, and multichip modules. Readers will also benefit from the extensive data on material properties and circuit functions, thus enabling more intelligent decisions at the design stage — and preventing thermal-related problems from occurring in the first place.
Author:
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 624
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Book Description
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages :
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Book Description
