Handbook of Multilevel Metallization for Integrated Circuits PDF Download
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Author: Syd R. Wilson
Publisher: William Andrew
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 922
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Book Description
It is widely recognized that the successful design, development, and integration of multilevel metallization (MLM) systems is and will continue to be key to current and future VLSI technologies. All major semiconductor companies have significant ongoing research teams focused in this area. These teams must view multilevel metallization as a system rather than a collection of isolated process modules.
Author: Syd R. Wilson
Publisher: William Andrew
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 922
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Book Description
It is widely recognized that the successful design, development, and integration of multilevel metallization (MLM) systems is and will continue to be key to current and future VLSI technologies. All major semiconductor companies have significant ongoing research teams focused in this area. These teams must view multilevel metallization as a system rather than a collection of isolated process modules.
Author: Paul H. Holloway
Publisher: Cambridge University Press
ISBN: 0080946143
Category : Technology & Engineering
Languages : en
Pages : 937
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Book Description
This book reviews the recent advances and current technologies used to produce microelectronic and optoelectronic devices from compound semiconductors. It provides a complete overview of the technologies necessary to grow bulk single-crystal substrates, grow hetero-or homoepitaxial films, and process advanced devices such as HBT's, QW diode lasers, etc.
Author: John N. Helbert
Publisher: Cambridge University Press
ISBN: 0080946801
Category : Technology & Engineering
Languages : en
Pages : 1026
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Book Description
This handbook gives readers a close look at the entire technology of printing very high resolution and high density integrated circuit (IC) patterns into thin resist process transfer coatingsùincluding optical lithography, electron beam, ion beam, and x-ray lithography. The book's main theme is the special printing process needed to achieve volume high density IC chip production, especially in the Dynamic Random Access Memory (DRAM) industry. The book leads off with a comparison of various lithography methods, covering the three major patterning parameters of line/space, resolution, line edge and pattern feature dimension control. The book's explanation of resist and resist process equipment technology may well be the first practical description of the relationship between the resist process and equipment parameters. The basics of resist technology are completely coveredùincluding an entire chapter on resist process defectivity and the potential yield limiting effect on device production. Each alternative lithographic technique and testing method is considered and evaluated: basic metrology including optical, scanning-electron-microscope (SEM) techniques and electrical test devices, along with explanations of actual printing tools and their design, construction and performance. The editor devotes an entire chapter to today's sophisticated, complex electron-beam printers, and to the emerging x-ray printing technology now used in high-density CMOS devices. Energetic ion particle printing is a controllable, steerable technology that does not rely on resist, and occupies a final section of the handbook.
Author: Krishna Seshan
Publisher: William Andrew
ISBN: 1437778747
Category : Technology & Engineering
Languages : en
Pages : 411
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Book Description
The Handbook of Thin Film Deposition is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry and the closely related areas of thin film deposition, thin film micro properties, photovoltaic solar energy applications, new materials for memory applications and methods for thin film optical processes. In a major restructuring, this edition of the handbook lays the foundations with an up-to-date treatment of lithography, contamination and yield management, and reliability of thin films. The established physical and chemical deposition processes and technologies are then covered, the last section of the book being devoted to more recent technological developments such as microelectromechanical systems, photovoltaic applications, digital cameras, CCD arrays, and optical thin films. - A practical survey of thin film technologies aimed at engineers and managers involved in all stages of the process: design, fabrication, quality assurance and applications - Covers core processes and applications in the semiconductor industry and new developments in the photovoltaic and optical thin film industries - The new edition takes covers the transition taking place in the semiconductor world from Al/SiO2 to copper interconnects with low-k dielectrics - Written by acknowledged industry experts from key companies in the semiconductor industry including Intel and IBM - Foreword by Gordon E. Moore, co-founder of Intel and formulator of the renowned 'Moore's Law' relating to the technology development cycle in the semiconductor industry
Author: John N. Helbert
Publisher: William Andrew
ISBN: 0815517807
Category : Technology & Engineering
Languages : en
Pages : 1025
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Book Description
This handbook gives readers a close look at the entire technology of printing very high resolution and high density integrated circuit (IC) patterns into thin resist process transfer coatingsùincluding optical lithography, electron beam, ion beam, and x-ray lithography. The book's main theme is the special printing process needed to achieve volume high density IC chip production, especially in the Dynamic Random Access Memory (DRAM) industry. The book leads off with a comparison of various lithography methods, covering the three major patterning parameters of line/space, resolution, line edge and pattern feature dimension control. The book's explanation of resist and resist process equipment technology may well be the first practical description of the relationship between the resist process and equipment parameters. The basics of resist technology are completely coveredùincluding an entire chapter on resist process defectivity and the potential yield limiting effect on device production.Each alternative lithographic technique and testing method is considered and evaluated: basic metrology including optical, scanning-electron-microscope (SEM) techniques and electrical test devices, along with explanations of actual printing tools and their design, construction and performance. The editor devotes an entire chapter to today's sophisticated, complex electron-beam printers, and to the emerging x-ray printing technology now used in high-density CMOS devices. Energetic ion particle printing is a controllable, steerable technology that does not rely on resist, and occupies a final section of the handbook.
Author: K. Byrappa
Publisher: Cambridge University Press
ISBN: 008094681X
Category : Science
Languages : en
Pages : 898
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Book Description
Quartz, zeolites, gemstones, perovskite type oxides, ferrite, carbon allotropes, complex coordinated compounds and many moreùall products now being produced using hydrothermal technology. Handbook of Hydrothermal Technology brings together the latest techniques in this rapidly advancing field in one exceptionally useful, long-needed volume. The handbook provides a single source for understanding how aqueous solvents or mineralizers work under temperature and pressure to dissolve and recrystallize normally insoluble materials, and decompose or recycle any waste material. The result, as the authors show in the book, is technologically the most efficient method in crystal growth, materials processing, and waste treatment. The book gives scientists and technologists an overview of the entire subject including: ò Evolution of the technology from geology to widespread industrial use. ò Descriptions of equipment used in the process and how it works. ò Problems involved with the growth of crystals, processing of technological materials, environmental and safety issues. ò Analysis of the direction of today's technology. In addition, readers get a close look at the hydrothermal synthesis of zeolites, fluorides, sulfides, tungstates, and molybdates, as well as native elements and simple oxides. Delving into the commercial production of various types, the authors clarify the effects of temperature, pressure, solvents, and various other chemical components on the hydrothermal processes.
Author: Jerzy Ruzyllo
Publisher: World Scientific
ISBN: 9811216010
Category : Technology & Engineering
Languages : en
Pages : 298
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Book Description
The Guide to Semiconductor Engineering is concerned with semiconductor materials, devices and process technologies which in combination constitute an enabling force behind the growth of our technical civilization. This book was conceived and written keeping in mind those who need to learn about semiconductors, who are professionally associated with select aspects of this technical domain and want to see it in a broader context, or for those who are simply interested in state-of-the-art semiconductor engineering. In its coverage of semiconductor properties, materials, devices, manufacturing technology, and characterization methods, this Guide departs from textbook-style, monothematic in-depth discussions of each topic. Instead, it considers the entire broad field of semiconductor technology and identifies synergistic interactions within various areas in one concise volume. It is a holistic approach to the coverage of semiconductor engineering which distinguishes this Guide among other books concerned with semiconductors related issues.
Author: Professor K.S. K.S Sree Harsha
Publisher: Elsevier
ISBN: 0080480314
Category : Technology & Engineering
Languages : en
Pages : 1173
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Book Description
The goal of producing devices that are smaller, faster, more functional, reproducible, reliable and economical has given thin film processing a unique role in technology.Principles of Vapor Deposition of Thin Films brings in to one place a diverse amount of scientific background that is considered essential to become knowledgeable in thin film depostition techniques. Its ultimate goal as a reference is to provide the foundation upon which thin film science and technological innovation are possible.* Offers detailed derivation of important formulae.* Thoroughly covers the basic principles of materials science that are important to any thin film preparation.* Careful attention to terminologies, concepts and definitions, as well as abundance of illustrations offer clear support for the text.
Author: R. L. Opila
Publisher: The Electrochemical Society
ISBN: 9781566772938
Category : Technology & Engineering
Languages : en
Pages : 350
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Book Description
Author: Alain C. Diebold
Publisher: CRC Press
ISBN: 0203904540
Category : Technology & Engineering
Languages : en
Pages : 703
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Book Description
Containing more than 300 equations and nearly 500 drawings, photographs, and micrographs, this reference surveys key areas such as optical measurements and in-line calibration methods. It describes cleanroom-based measurement technology used during the manufacture of silicon integrated circuits and covers model-based, critical dimension, overlay
