Handbook of Multilevel Metallization for Integrated Circuits PDF Download
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Author: Syd R. Wilson
Publisher: William Andrew
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 922
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Book Description
It is widely recognized that the successful design, development, and integration of multilevel metallization (MLM) systems is and will continue to be key to current and future VLSI technologies. All major semiconductor companies have significant ongoing research teams focused in this area. These teams must view multilevel metallization as a system rather than a collection of isolated process modules.
Author: Syd R. Wilson
Publisher: William Andrew
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 922
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Book Description
It is widely recognized that the successful design, development, and integration of multilevel metallization (MLM) systems is and will continue to be key to current and future VLSI technologies. All major semiconductor companies have significant ongoing research teams focused in this area. These teams must view multilevel metallization as a system rather than a collection of isolated process modules.
Author:
Publisher:
ISBN:
Category : Application-specific integrated circuits
Languages : en
Pages : 76
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Book Description
Author: John N. Helbert
Publisher: William Andrew
ISBN: 0815517807
Category : Technology & Engineering
Languages : en
Pages : 1025
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Book Description
This handbook gives readers a close look at the entire technology of printing very high resolution and high density integrated circuit (IC) patterns into thin resist process transfer coatingsùincluding optical lithography, electron beam, ion beam, and x-ray lithography. The book's main theme is the special printing process needed to achieve volume high density IC chip production, especially in the Dynamic Random Access Memory (DRAM) industry. The book leads off with a comparison of various lithography methods, covering the three major patterning parameters of line/space, resolution, line edge and pattern feature dimension control. The book's explanation of resist and resist process equipment technology may well be the first practical description of the relationship between the resist process and equipment parameters. The basics of resist technology are completely coveredùincluding an entire chapter on resist process defectivity and the potential yield limiting effect on device production.Each alternative lithographic technique and testing method is considered and evaluated: basic metrology including optical, scanning-electron-microscope (SEM) techniques and electrical test devices, along with explanations of actual printing tools and their design, construction and performance. The editor devotes an entire chapter to today's sophisticated, complex electron-beam printers, and to the emerging x-ray printing technology now used in high-density CMOS devices. Energetic ion particle printing is a controllable, steerable technology that does not rely on resist, and occupies a final section of the handbook.
Author: Krishna Seshan
Publisher: William Andrew
ISBN: 1437778747
Category : Technology & Engineering
Languages : en
Pages : 411
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Book Description
The Handbook of Thin Film Deposition is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry and the closely related areas of thin film deposition, thin film micro properties, photovoltaic solar energy applications, new materials for memory applications and methods for thin film optical processes. In a major restructuring, this edition of the handbook lays the foundations with an up-to-date treatment of lithography, contamination and yield management, and reliability of thin films. The established physical and chemical deposition processes and technologies are then covered, the last section of the book being devoted to more recent technological developments such as microelectromechanical systems, photovoltaic applications, digital cameras, CCD arrays, and optical thin films. A practical survey of thin film technologies aimed at engineers and managers involved in all stages of the process: design, fabrication, quality assurance and applications Covers core processes and applications in the semiconductor industry and new developments in the photovoltaic and optical thin film industries The new edition takes covers the transition taking place in the semiconductor world from Al/SiO2 to copper interconnects with low-k dielectrics Written by acknowledged industry experts from key companies in the semiconductor industry including Intel and IBM Foreword by Gordon E. Moore, co-founder of Intel and formulator of the renowned ‘Moore’s Law’ relating to the technology development cycle in the semiconductor industry
Author: Paul H. Holloway
Publisher: Cambridge University Press
ISBN: 0080946143
Category : Technology & Engineering
Languages : en
Pages : 937
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Book Description
This book reviews the recent advances and current technologies used to produce microelectronic and optoelectronic devices from compound semiconductors. It provides a complete overview of the technologies necessary to grow bulk single-crystal substrates, grow hetero-or homoepitaxial films, and process advanced devices such as HBT's, QW diode lasers, etc.
Author: K. Byrappa
Publisher: Cambridge University Press
ISBN: 008094681X
Category : Science
Languages : en
Pages : 898
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Book Description
Quartz, zeolites, gemstones, perovskite type oxides, ferrite, carbon allotropes, complex coordinated compounds and many moreùall products now being produced using hydrothermal technology. Handbook of Hydrothermal Technology brings together the latest techniques in this rapidly advancing field in one exceptionally useful, long-needed volume. The handbook provides a single source for understanding how aqueous solvents or mineralizers work under temperature and pressure to dissolve and recrystallize normally insoluble materials, and decompose or recycle any waste material. The result, as the authors show in the book, is technologically the most efficient method in crystal growth, materials processing, and waste treatment. The book gives scientists and technologists an overview of the entire subject including: ò Evolution of the technology from geology to widespread industrial use. ò Descriptions of equipment used in the process and how it works. ò Problems involved with the growth of crystals, processing of technological materials, environmental and safety issues. ò Analysis of the direction of today's technology. In addition, readers get a close look at the hydrothermal synthesis of zeolites, fluorides, sulfides, tungstates, and molybdates, as well as native elements and simple oxides. Delving into the commercial production of various types, the authors clarify the effects of temperature, pressure, solvents, and various other chemical components on the hydrothermal processes.
Author: Hugh O. Pierson
Publisher: William Andrew
ISBN: 081551770X
Category : Technology & Engineering
Languages : en
Pages : 363
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Book Description
Refractory carbides and nitrides are useful materials with numerous industrial applications and a promising future, in addition to being materials of great interest to the scientific community. Although most of their applications are recent, the refractory carbides and nitrides have been known for over one hundred years. The industrial importance of the refractory carbides and nitrides is growing rapidly, not only in the traditional and well-established applications based on the strength and refractory nature of these materials such as cutting tools and abrasives, but also in new and promising fields such as electronics and optoelectronics.
Author: G. S. Mathad
Publisher: The Electrochemical Society
ISBN: 9781566772549
Category : Science
Languages : en
Pages : 358
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Book Description
Author: M. Sherif El-Eskandarany
Publisher: William Andrew
ISBN: 0815518242
Category : Technology & Engineering
Languages : en
Pages : 259
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Book Description
Unique in bringing about a solid-state reaction at room temperature, mechanical alloying produces powders and compounds difficult or impossible to obtain by conventional techniques. Immediate and cost-effective industry applications of the resultant advanced materials are in cutting tools and high performance aerospace products such as metal matrix armor and turbine blades. The book is a guided introduction to mechanical alloying, covering material requirements equipment, processing, and engineering properties and characteristics of the milled powders. Chapters 3 and 4 treat the fabrication of nanophase materials and nanophase composite materials. Chapter 8 provides extensive coverage of metallic glass substances. This book is ideal for materials scientists in industry and in research, design, processing, and plant engineers in the cutting tools and aerospace industries as well as senior level students in metallurgical and mechanical materials engineering. The book will especially benefit metallurgists unacquainted with ball milling fabrication.
Author: Hugh O. Pierson
Publisher: William Andrew
ISBN: 0815517432
Category : Technology & Engineering
Languages : en
Pages : 507
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Book Description
Turn to this new second edition for an understanding of the latest advances in the chemical vapor deposition (CVD) process. CVD technology has recently grown at a rapid rate, and the number and scope of its applications and their impact on the market have increased considerably. The market is now estimated to be at least double that of a mere seven years ago when the first edition of this book was published. The second edition is an update with a considerably expanded and revised scope. Plasma CVD and metallo-organic CVD are two major factors in this rapid growth. Readers will find the latest data on both processes in this volume. Likewise, the book explains the growing importance of CVD in production of semiconductor and related applications.
