Handbook of Aqueous Cleaning Technology for Electronic Assemblies PDF Download
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Author: Frank Cala
Publisher:
ISBN: 9780901150318
Category : Cleaning compounds
Languages : en
Pages : 318
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Book Description
Author: Frank Cala
Publisher:
ISBN: 9780901150318
Category : Cleaning compounds
Languages : en
Pages : 318
Get Book Here
Book Description
Author: Barbara Kanegsberg
Publisher: CRC Press
ISBN: 143982830X
Category : Science
Languages : en
Pages : 560
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Book Description
Applications, Processes, and Controls is the second volume in the Handbook for Critical Cleaning, Second Edition.Should you clean your product during manufacturing? If so, when and how? Cleaning is essential for proper performance, optimal quality, and increased sales. Inadequate cleaning of product elements can lead to catastrophic failure of the
Author: Barbara Kanegsberg
Publisher: CRC Press
ISBN: 1439828288
Category : Science
Languages : en
Pages : 550
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Book Description
Cleaning Agents and Systems is the first volume in the Handbook for Critical Cleaning, Second Edition.Should you clean your product during manufacturing? If so, when and how? Cleaning is essential for proper performance, optimal quality, and increased sales. Inadequate cleaning of product elements can lead to catastrophic failure of the entire syst
Author: Barbara Kanegsberg
Publisher: CRC Press
ISBN: 1439828296
Category : Science
Languages : en
Pages : 576
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Book Description
"Nearly all companies which manufacture or fabricate high-value physical objects (components, parts, assemblies) perform critical cleaning at one or more stages. These range from the giants of the semiconductor, aerospace, and biomedical world to a host of small to medium to large companies producing a dizzying array of components"--
Author: M. Datta
Publisher: CRC Press
ISBN: 020347368X
Category : Technology & Engineering
Languages : en
Pages : 564
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Book Description
Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization. Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impact of electrochemical technology on packaging. The second part discusses chip metallization topics including the development of robust barrier layers and alternative metallization materials. Part III explores key aspects of chip-package interconnect technologies, followed by Part IV's analysis of packages, boards, and connectors which covers materials development, technology trends in ceramic packages and multi-chip modules, and electroplated contact materials. Illustrating the importance of processing tools in enabling technology development, the book concludes with chapters on chemical mechanical planarization, electroplating, and wet etching/cleaning tools. Experts from industry, universities, and national laboratories submitted reviews on each of these subjects, capturing the technological advances made in each area. A detailed examination of how packaging responds to the challenges of Moore's law, this book serves as a timely and valuable reference for microelectronic packaging and processing professionals and other industrial technologists.
Author: Barbara Kanegsberg
Publisher: CRC Press
ISBN: 1466515945
Category : Science
Languages : en
Pages : 1109
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Book Description
This set consists of two volumes: Cleaning Agents and Systems and Applications, Processes, and Controls. Updated, expanded, re-organized, and rewritten, this two-volume handbook covers cleaning processes, applications, management, safety, and environmental concerns. The editors rigorously examine technical issues, cleaning agent options and systems, chemical and equipment integration, and contamination control, as well as cleanliness standards, analytical testing, process selection, implementation and maintenance, specific application areas, and regulatory issues. A collection of international contributors gives the text a global viewpoint. Color illustrations, video clips, and animation are available online to help readers better understand presented material.
Author: Barbara Kanegsberg
Publisher: CRC Press
ISBN: 1420039822
Category : Science
Languages : en
Pages : 687
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Book Description
With all the cleaning approaches available, how do you choose which one is best for your needs? Components manufacturers wonder which will provide a competitive edge. Chemists and engineers worry about the effect of any process modification on a critical component or on the stability of an irreplaceable antique. There is no silver bullet, n
Author: Kash L. Mittal
Publisher: CRC Press
ISBN: 9047403282
Category : Science
Languages : en
Pages : 364
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Book Description
This volume documents the proceedings of the International Symposium on Surface Contamination and Cleaning, held in Newark, New Jersey, May 23-25, 2001. Because of the importance of this topic in many technological areas, tremendous efforts have been devoted to devise novel and more efficient ways to monitor, analyse and characterize contamination
Author: James E. Sullivan
Publisher:
ISBN:
Category : Cleaning compounds
Languages : en
Pages : 26
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Book Description
Author: Frank Riley
Publisher: Springer Science & Business Media
ISBN: 3662131617
Category : Technology & Engineering
Languages : en
Pages : 576
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Book Description
The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in "Assembly Engineering" and "Electronic Packaging and Production", will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation.
