Author: 張鈞程
Publisher:
ISBN:
Category :
Languages : en
Pages :
Book Description
Grouping Method and Run-to-run Control for High-mix Semiconductor Manufacturing Process
Author: 張鈞程
Publisher:
ISBN:
Category :
Languages : en
Pages :
Book Description
Publisher:
ISBN:
Category :
Languages : en
Pages :
Book Description
Run-to-Run Control in Semiconductor Manufacturing
Author: James Moyne
Publisher: CRC Press
ISBN: 1420040669
Category : Technology & Engineering
Languages : en
Pages : 368
Book Description
Run-to-run (R2R) control is cutting-edge technology that allows modification of a product recipe between machine "runs," thereby minimizing process drift, shift, and variability-and with them, costs. Its effectiveness has been demonstrated in a variety of processes, such as vapor phase epitaxy, lithography, and chemical mechanical planarization. The only barrier to the semiconductor industry's widespread adoption of this highly effective process control is a lack of understanding of the technology. Run to Run Control in Semiconductor Manufacturing overcomes that barrier by offering in-depth analyses of R2R control.
Publisher: CRC Press
ISBN: 1420040669
Category : Technology & Engineering
Languages : en
Pages : 368
Book Description
Run-to-run (R2R) control is cutting-edge technology that allows modification of a product recipe between machine "runs," thereby minimizing process drift, shift, and variability-and with them, costs. Its effectiveness has been demonstrated in a variety of processes, such as vapor phase epitaxy, lithography, and chemical mechanical planarization. The only barrier to the semiconductor industry's widespread adoption of this highly effective process control is a lack of understanding of the technology. Run to Run Control in Semiconductor Manufacturing overcomes that barrier by offering in-depth analyses of R2R control.
Run to Run Process Control in Semiconductor Manufacturing
Author: I. Iliopoulos
Publisher:
ISBN:
Category : Chemical engineering
Languages : en
Pages :
Book Description
Publisher:
ISBN:
Category : Chemical engineering
Languages : en
Pages :
Book Description
IEEE/SEMI International Semiconductor Manufacturing Science Symposium
Author: IEEE/SEMI International Semiconductor Manufacturing Science Symposium
Publisher:
ISBN:
Category : Computer integrated manufacturing systems
Languages : en
Pages : 184
Book Description
Publisher:
ISBN:
Category : Computer integrated manufacturing systems
Languages : en
Pages : 184
Book Description
Robust Run-to-run (batch-to-batch) Optimization and Control for Semiconductor Manufacturing Processes
Author: Sudhakar Adivikolanu
Publisher:
ISBN:
Category : Manufacturing processes
Languages : en
Pages : 406
Book Description
Publisher:
ISBN:
Category : Manufacturing processes
Languages : en
Pages : 406
Book Description
IEEE/CHMT International Electronic Manufacturing Technology Symposium
Author:
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 408
Book Description
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 408
Book Description
Chamber Matching in Semiconductor Manufacturing Using Statistical Analysis and Run-to-run Control
Author: Feyza Haskaraman
Publisher:
ISBN:
Category :
Languages : en
Pages : 84
Book Description
This thesis focuses on a chamber matching methodology for semiconductor manufacturing in Analog Devices Inc.'s fabrication sites. As ADI extends its efforts to implement Internet of Things and predictive maintenance (PdM) to its fabrication facilities, it is also seeking to increase their overall yield by implementing better monitoring and control of processes and matching the performance of chambers. This thesis project was conducted by F. Haskaraman, T. Nilgianskul and T. Nerurkar as a team to make a series of recommendations to improve process yields using statistical control and to show the benefits of chamber matching in particular. Nilgianskul's thesis focuses on the statistical process control and Nerurkar's thesis focuses on Design on Experiments (DOEs). A chamber matching methodology is created and applied to chambers that run the plasma-ashing process. Using design of experiments, the machines are modeled individually and globally. While individual models reveal the mismatch, a global model is proposed as a step to optimize the process recipes for matching. The root cause of the differences is diagnosed with instrumented wafers and in-situ sensor monitoring. Recommendations are made to standardize the hardware and software along with calibration methods. First batch of streamed raw data from an in-situ thermocouple is analyzed and found to be another tool to monitor the chamber performance differences. The process is simulated using an EWMA controller and is found to achieve lower mismatch by keeping outputs of the machine closer to the strip thickness in the case of a process drift. At the end of the project, a chamber matching methodology was recommended to the Analog Devices to complement its Internet of Things efforts. By increasing the routing flexibility and decreasing yield variability and tool qualification, this strategy is expected to save significant amount of costs and increase the quality of its products.
Publisher:
ISBN:
Category :
Languages : en
Pages : 84
Book Description
This thesis focuses on a chamber matching methodology for semiconductor manufacturing in Analog Devices Inc.'s fabrication sites. As ADI extends its efforts to implement Internet of Things and predictive maintenance (PdM) to its fabrication facilities, it is also seeking to increase their overall yield by implementing better monitoring and control of processes and matching the performance of chambers. This thesis project was conducted by F. Haskaraman, T. Nilgianskul and T. Nerurkar as a team to make a series of recommendations to improve process yields using statistical control and to show the benefits of chamber matching in particular. Nilgianskul's thesis focuses on the statistical process control and Nerurkar's thesis focuses on Design on Experiments (DOEs). A chamber matching methodology is created and applied to chambers that run the plasma-ashing process. Using design of experiments, the machines are modeled individually and globally. While individual models reveal the mismatch, a global model is proposed as a step to optimize the process recipes for matching. The root cause of the differences is diagnosed with instrumented wafers and in-situ sensor monitoring. Recommendations are made to standardize the hardware and software along with calibration methods. First batch of streamed raw data from an in-situ thermocouple is analyzed and found to be another tool to monitor the chamber performance differences. The process is simulated using an EWMA controller and is found to achieve lower mismatch by keeping outputs of the machine closer to the strip thickness in the case of a process drift. At the end of the project, a chamber matching methodology was recommended to the Analog Devices to complement its Internet of Things efforts. By increasing the routing flexibility and decreasing yield variability and tool qualification, this strategy is expected to save significant amount of costs and increase the quality of its products.
20. ASIM Fachtagung Simulation in Produktion und Logistik
Author: Sören Feldkamp, Niclas Souren, Rainer Straßburger, Steffen Bergmann
Publisher: BoD – Books on Demand
ISBN: 3863602765
Category : Business & Economics
Languages : en
Pages : 500
Book Description
Die 20. ASIM-Fachtagung "Simulation in Produktion und Logistik", Ilmenau, 13.-15. September 2023, steht unter dem Motto der „Nachhaltigkeit in Produktion und Logistik“. Sie soll Anregungen und Denkanstöße geben und über bereits erfolgreiche Projekte und Neuerungen berichten. Der vorliegende Tagungsband präsentiert neben aktuellen Beiträgen aus der klassischen Simulationsforschung und -anwendung, die z.B. den Digitalen Zwilling thematisieren, auch hochinteressante und einschlägige Beiträge zu Fragen der Abbildung energie- und nachhaltigkeitsbezogener Einflussfaktoren in der Simulation.
Publisher: BoD – Books on Demand
ISBN: 3863602765
Category : Business & Economics
Languages : en
Pages : 500
Book Description
Die 20. ASIM-Fachtagung "Simulation in Produktion und Logistik", Ilmenau, 13.-15. September 2023, steht unter dem Motto der „Nachhaltigkeit in Produktion und Logistik“. Sie soll Anregungen und Denkanstöße geben und über bereits erfolgreiche Projekte und Neuerungen berichten. Der vorliegende Tagungsband präsentiert neben aktuellen Beiträgen aus der klassischen Simulationsforschung und -anwendung, die z.B. den Digitalen Zwilling thematisieren, auch hochinteressante und einschlägige Beiträge zu Fragen der Abbildung energie- und nachhaltigkeitsbezogener Einflussfaktoren in der Simulation.
Dissertation Abstracts International
Author:
Publisher:
ISBN:
Category : Dissertations, Academic
Languages : en
Pages : 820
Book Description
Publisher:
ISBN:
Category : Dissertations, Academic
Languages : en
Pages : 820
Book Description
Fundamentals of Semiconductor Manufacturing and Process Control
Author: Gary S. May
Publisher: John Wiley & Sons
ISBN: 0471790273
Category : Technology & Engineering
Languages : en
Pages : 428
Book Description
A practical guide to semiconductor manufacturing from processcontrol to yield modeling and experimental design Fundamentals of Semiconductor Manufacturing and Process Controlcovers all issues involved in manufacturing microelectronic devicesand circuits, including fabrication sequences, process control,experimental design, process modeling, yield modeling, and CIM/CAMsystems. Readers are introduced to both the theory and practice ofall basic manufacturing concepts. Following an overview of manufacturing and technology, the textexplores process monitoring methods, including those that focus onproduct wafers and those that focus on the equipment used toproduce wafers. Next, the text sets forth some fundamentals ofstatistics and yield modeling, which set the foundation for adetailed discussion of how statistical process control is used toanalyze quality and improve yields. The discussion of statistical experimental design offers readers apowerful approach for systematically varying controllable processconditions and determining their impact on output parameters thatmeasure quality. The authors introduce process modeling concepts,including several advanced process control topics such asrun-by-run, supervisory control, and process and equipmentdiagnosis. Critical coverage includes the following: * Combines process control and semiconductor manufacturing * Unique treatment of system and software technology and managementof overall manufacturing systems * Chapters include case studies, sample problems, and suggestedexercises * Instructor support includes electronic copies of the figures andan instructor's manual Graduate-level students and industrial practitioners will benefitfrom the detailed exami?nation of how electronic materials andsupplies are converted into finished integrated circuits andelectronic products in a high-volume manufacturingenvironment. An Instructor's Manual presenting detailed solutions to all theproblems in the book is available from the Wiley editorialdepartment. An Instructor Support FTP site is also available.
Publisher: John Wiley & Sons
ISBN: 0471790273
Category : Technology & Engineering
Languages : en
Pages : 428
Book Description
A practical guide to semiconductor manufacturing from processcontrol to yield modeling and experimental design Fundamentals of Semiconductor Manufacturing and Process Controlcovers all issues involved in manufacturing microelectronic devicesand circuits, including fabrication sequences, process control,experimental design, process modeling, yield modeling, and CIM/CAMsystems. Readers are introduced to both the theory and practice ofall basic manufacturing concepts. Following an overview of manufacturing and technology, the textexplores process monitoring methods, including those that focus onproduct wafers and those that focus on the equipment used toproduce wafers. Next, the text sets forth some fundamentals ofstatistics and yield modeling, which set the foundation for adetailed discussion of how statistical process control is used toanalyze quality and improve yields. The discussion of statistical experimental design offers readers apowerful approach for systematically varying controllable processconditions and determining their impact on output parameters thatmeasure quality. The authors introduce process modeling concepts,including several advanced process control topics such asrun-by-run, supervisory control, and process and equipmentdiagnosis. Critical coverage includes the following: * Combines process control and semiconductor manufacturing * Unique treatment of system and software technology and managementof overall manufacturing systems * Chapters include case studies, sample problems, and suggestedexercises * Instructor support includes electronic copies of the figures andan instructor's manual Graduate-level students and industrial practitioners will benefitfrom the detailed exami?nation of how electronic materials andsupplies are converted into finished integrated circuits andelectronic products in a high-volume manufacturingenvironment. An Instructor's Manual presenting detailed solutions to all theproblems in the book is available from the Wiley editorialdepartment. An Instructor Support FTP site is also available.