ISTFA 2013 PDF Download
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Author: A. S. M. International
Publisher: ASM International
ISBN: 1627080228
Category : Technology & Engineering
Languages : en
Pages : 634
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Book Description
This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures.
Author: A. S. M. International
Publisher: ASM International
ISBN: 1627080228
Category : Technology & Engineering
Languages : en
Pages : 634
Get Book Here
Book Description
This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures.
Author:
Publisher:
ISBN: 9781629938578
Category : Nanoelectronics
Languages : en
Pages :
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Book Description
Author: Philip Garrou
Publisher: John Wiley & Sons
ISBN: 3527670122
Category : Technology & Engineering
Languages : en
Pages : 484
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Book Description
Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and backside processing, both from a technological and a materials science perspective. The last part of the book is concerned with assessing and enhancing the reliability of the 3D integrated devices, which is a prerequisite for the large-scale implementation of this emerging technology. Invaluable reading for materials scientists, semiconductor physicists, and those working in the semiconductor industry, as well as IT and electrical engineers.
Author: Gustaaf van Tendeloo
Publisher: John Wiley & Sons
ISBN: 3527641874
Category : Technology & Engineering
Languages : en
Pages : 1484
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Book Description
This completely revised successor to the Handbook of Microscopy supplies in-depth coverage of all imaging technologies from the optical to the electron and scanning techniques. Adopting a twofold approach, the book firstly presents the various technologies as such, before going on to cover the materials class by class, analyzing how the different imaging methods can be successfully applied. It covers the latest developments in techniques, such as in-situ TEM, 3D imaging in TEM and SEM, as well as a broad range of material types, including metals, alloys, ceramics, polymers, semiconductors, minerals, quasicrystals, amorphous solids, among others. The volumes are divided between methods and applications, making this both a reliable reference and handbook for chemists, physicists, biologists, materials scientists and engineers, as well as graduate students and their lecturers.
Author: Zhiyong Ma
Publisher: CRC Press
ISBN: 135173394X
Category : Science
Languages : en
Pages : 889
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Book Description
Nanoelectronics is changing the way the world communicates, and is transforming our daily lives. Continuing Moore’s law and miniaturization of low-power semiconductor chips with ever-increasing functionality have been relentlessly driving R&D of new devices, materials, and process capabilities to meet performance, power, and cost requirements. This book covers up-to-date advances in research and industry practices in nanometrology, critical for continuing technology scaling and product innovation. It holistically approaches the subject matter and addresses emerging and important topics in semiconductor R&D and manufacturing. It is a complete guide for metrology and diagnostic techniques essential for process technology, electronics packaging, and product development and debugging—a unique approach compared to other books. The authors are from academia, government labs, and industry and have vast experience and expertise in the topics presented. The book is intended for all those involved in IC manufacturing and nanoelectronics and for those studying nanoelectronics process and assembly technologies or working in device testing, characterization, and diagnostic techniques.
Author: Janusz Bogdanowicz
Publisher: Springer Science & Business Media
ISBN: 3642301088
Category : Technology & Engineering
Languages : en
Pages : 217
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Book Description
One of the critical issues in semiconductor technology is the precise electrical characterization of ultra-shallow junctions. Among the plethora of measurement techniques, the optical reflectance approach developed in this work is the sole concept that does not require physical contact, making it suitable for non-invasive in-line metrology. This work develops extensively all the fundamental physical models of the photomodulated optical reflectance technique and introduces novel approaches that extend its applicability from dose monitoring towards detailed carrier profile reconstruction. It represents a significant breakthrough in junction metrology with potential for industrial implementation.
Author: Michael Quinten
Publisher: John Wiley & Sons
ISBN: 3527664351
Category : Science
Languages : en
Pages : 212
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Book Description
A one-stop, concise guide on determining and measuring thin film thickness by optical methods. This practical book covers the laws of electromagnetic radiation and interaction of light with matter, as well as the theory and practice of thickness measurement, and modern applications. In so doing, it shows the capabilities and opportunities of optical thickness determination and discusses the strengths and weaknesses of measurement devices along with their evaluation methods. Following an introduction to the topic, Chapter 2 presents the basics of the propagation of light and other electromagnetic radiation in space and matter. The main topic of this book, the determination of the thickness of a layer in a layer stack by measuring the spectral reflectance or transmittance, is treated in the following three chapters. The color of thin layers is discussed in chapter 6. Finally, in chapter 7, the author discusses several industrial applications of the layer thickness measurement, including high-reflection and anti-reflection coatings, photolithographic structuring of semiconductors, silicon on insulator, transparent conductive films, oxides and polymers, thin film photovoltaics, and heavily doped silicon. Aimed at industrial and academic researchers, engineers, developers and manufacturers involved in all areas of optical layer and thin optical film measurement and metrology, process control, real-time monitoring, and applications.
Author: Laurent Duraffourg
Publisher: John Wiley & Sons
ISBN: 1119177995
Category : Technology & Engineering
Languages : en
Pages : 212
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Book Description
This book will present the theoretical and technological elements of nanosystems. Among the different topics discussed, the authors include the electromechanical properties of NEMS, the scaling effects that give these their interesting properties for different applications and the current manufacturing processes. The authors aim to provide useful tools for future readers and will provide an accurate picture of current and future research in the field.
Author: D. G. Seiler
Publisher: Springer
ISBN: 9780735409651
Category : Nanoelectronics
Languages : en
Pages : 377
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Book Description
Author: ASM International
Publisher: ASM International
ISBN: 1627081518
Category : Technology & Engineering
Languages : en
Pages : 666
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Book Description
The theme for the November 2017 conference was Striving for 100% Success Rate. Papers focus on the tools and techniques needed for maximizing the success rate in every aspect of the electronic device failure analysis process.
