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Author: Pei-Ning Guo
Publisher:
ISBN:
Category :
Languages : en
Pages : 198
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Book Description
Author: Pei-Ning Guo
Publisher:
ISBN:
Category :
Languages : en
Pages : 198
Get Book Here
Book Description
Author: Andrew B. Kahng
Publisher: Springer Nature
ISBN: 3030964159
Category : Technology & Engineering
Languages : en
Pages : 329
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Book Description
The complexity of modern chip design requires extensive use of specialized software throughout the process. To achieve the best results, a user of this software needs a high-level understanding of the underlying mathematical models and algorithms. In addition, a developer of such software must have a keen understanding of relevant computer science aspects, including algorithmic performance bottlenecks and how various algorithms operate and interact. This book introduces and compares the fundamental algorithms that are used during the IC physical design phase, wherein a geometric chip layout is produced starting from an abstract circuit design. This updated second edition includes recent advancements in the state-of-the-art of physical design, and builds upon foundational coverage of essential and fundamental techniques. Numerous examples and tasks with solutions increase the clarity of presentation and facilitate deeper understanding. A comprehensive set of slides is available on the Internet for each chapter, simplifying use of the book in instructional settings. “This improved, second edition of the book will continue to serve the EDA and design community well. It is a foundational text and reference for the next generation of professionals who will be called on to continue the advancement of our chip design tools and design the most advanced micro-electronics.” Dr. Leon Stok, Vice President, Electronic Design Automation, IBM Systems Group “This is the book I wish I had when I taught EDA in the past, and the one I’m using from now on.” Dr. Louis K. Scheffer, Howard Hughes Medical Institute “I would happily use this book when teaching Physical Design. I know of no other work that’s as comprehensive and up-to-date, with algorithmic focus and clear pseudocode for the key algorithms. The book is beautifully designed!” Prof. John P. Hayes, University of Michigan “The entire field of electronic design automation owes the authors a great debt for providing a single coherent source on physical design that is clear and tutorial in nature, while providing details on key state-of-the-art topics such as timing closure.” Prof. Kurt Keutzer, University of California, Berkeley “An excellent balance of the basics and more advanced concepts, presented by top experts in the field.” Prof. Sachin Sapatnekar, University of Minnesota
Author: Si. Pi Ravikumār
Publisher: Praeger
ISBN:
Category : Business & Economics
Languages : en
Pages : 224
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Book Description
Author: Sadiq M. Sait
Publisher: World Scientific
ISBN: 9789810238834
Category : Technology & Engineering
Languages : en
Pages : 506
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Book Description
&Quot;VLSI Physical Design Automation: Theory and Practice is an essential introduction for senior undergraduates, postgraduates and anyone starting work in the field of CAD for VLSI. It covers all aspects of physical design, together with such related areas as automatic cell generation, silicon compilation, layout editors and compaction. A problem-solving approach is adopted and each solution is illustrated with examples. Each topic is treated in a standard format: Problem Definition, Cost Functions and Constraints, Possible Approaches and Latest Developments."--BOOK JACKET.
Author: Bing Lu
Publisher: Springer Science & Business Media
ISBN: 1475734158
Category : Computers
Languages : en
Pages : 292
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Book Description
Introduction The exponential scaling of feature sizes in semiconductor technologies has side-effects on layout optimization, related to effects such as inter connect delay, noise and crosstalk, signal integrity, parasitics effects, and power dissipation, that invalidate the assumptions that form the basis of previous design methodologies and tools. This book is intended to sample the most important, contemporary, and advanced layout opti mization problems emerging with the advent of very deep submicron technologies in semiconductor processing. We hope that it will stimulate more people to perform research that leads to advances in the design and development of more efficient, effective, and elegant algorithms and design tools. Organization of the Book The book is organized as follows. A multi-stage simulated annealing algorithm that integrates floorplanning and interconnect planning is pre sented in Chapter 1. To reduce the run time, different interconnect plan ning approaches are applied in different ranges of temperatures. Chapter 2 introduces a new design methodology - the interconnect-centric design methodology and its centerpiece, interconnect planning, which consists of physical hierarchy generation, floorplanning with interconnect planning, and interconnect architecture planning. Chapter 3 investigates a net-cut minimization based placement tool, Dragon, which integrates the state of the art partitioning and placement techniques.
Author: Vasilis F. Pavlidis
Publisher: Newnes
ISBN: 0124104843
Category : Technology & Engineering
Languages : en
Pages : 770
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Book Description
Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization
Author: Naveed A. Sherwani
Publisher: Springer Science & Business Media
ISBN: 1461523516
Category : Technology & Engineering
Languages : en
Pages : 554
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Book Description
Algorithms for VLSI Physical Design Automation, Second Edition is a core reference text for graduate students and CAD professionals. Based on the very successful First Edition, it provides a comprehensive treatment of the principles and algorithms of VLSI physical design, presenting the concepts and algorithms in an intuitive manner. Each chapter contains 3-4 algorithms that are discussed in detail. Additional algorithms are presented in a somewhat shorter format. References to advanced algorithms are presented at the end of each chapter. Algorithms for VLSI Physical Design Automation covers all aspects of physical design. In 1992, when the First Edition was published, the largest available microprocessor had one million transistors and was fabricated using three metal layers. Now we process with six metal layers, fabricating 15 million transistors on a chip. Designs are moving to the 500-700 MHz frequency goal. These stunning developments have significantly altered the VLSI field: over-the-cell routing and early floorplanning have come to occupy a central place in the physical design flow. This Second Edition introduces a realistic picture to the reader, exposing the concerns facing the VLSI industry, while maintaining the theoretical flavor of the First Edition. New material has been added to all chapters, new sections have been added to most chapters, and a few chapters have been completely rewritten. The textual material is supplemented and clarified by many helpful figures. Audience: An invaluable reference for professionals in layout, design automation and physical design.
Author: Patrick Lee
Publisher: Lulu.com
ISBN: 0557401089
Category : Technology & Engineering
Languages : en
Pages : 160
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Book Description
This book covers issues and solutions in the physical integration and tapeout management for VLSI design. Chapter 1 gives the overview. Chapter 2 shows detailed techniques for physical design. Chapter 3 provides CAD flows. Chapter 4 discusses on-chip interconnects. A glossary of keywords is provided at the end.
Author: Majid Sarrafzadeh
Publisher: World Scientific
ISBN: 981021488X
Category : Technology & Engineering
Languages : en
Pages : 411
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Book Description
In the past two decades, research in VLSI physical design has been directed toward automation of layout process. Since the cost of fabricating a circuit is a fast growing function of the circuit area, circuit layout techniques are developed with an aim to produce layouts with small areas. Other criteria of optimality such as delay and via minimization need to be taken into consideration. This book includes 14 articles that deal with various stages of the VLSI layout problem. It covers topics including partitioning, floorplanning, placement, global routing, detailed routing and layout verification. Some of the chapters are review articles, giving the state-of-the-art of the problems related to timing driven placement, global and detailed routing, and circuit partitioning. The rest of the book contains research articles, giving recent findings of new approaches to the above-mentioned problems. They are all written by leading experts in the field. This book will serve as good references for both researchers and professionals who work in this field.
Author: Bryan T. Preas
Publisher: Addison Wesley Publishing Company
ISBN:
Category : Science
Languages : en
Pages : 540
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Book Description
