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Author: Rakesh Kumar
Publisher: McGraw Hill Professional
ISBN: 0071642706
Category : Technology & Engineering
Languages : en
Pages : 358
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Book Description
Discover How to Launch and Succeed as a Fabless Semiconductor Firm Fabless Semiconductor Implementation takes you step-by-step through the challenges faced by fabless firms in the development of integrated circuits. This expert guide examines the potential pitfalls of IC implementation in the rapidly growing fabless segment of the semiconductor industry and elaborates how to overcome these difficulties. It provides a comprehensive overview of the issues that executives and technical professionals encounter at fabless companies. Filled with over 150 on-target illustrations, this business-building tool presents a clear picture of the entire lifecycle of a fabless enterprise, describing how to envision and execute fabless IC implementation. Inside This Comprehensive Guide to Fabless IC Design - Define and specify the product Understand the customer requirements, the value chain, and the supply chain Select the right implementation approach, including “make” vs. “buy” Choose the best technologies and supply chain Implement IC design, fabrication, and manufacturing Build the operations infrastructure to meet cost and quality requirements Program-manage the distributed supply chain
Author: Rakesh Kumar
Publisher: McGraw Hill Professional
ISBN: 0071642706
Category : Technology & Engineering
Languages : en
Pages : 358
Get Book
Book Description
Discover How to Launch and Succeed as a Fabless Semiconductor Firm Fabless Semiconductor Implementation takes you step-by-step through the challenges faced by fabless firms in the development of integrated circuits. This expert guide examines the potential pitfalls of IC implementation in the rapidly growing fabless segment of the semiconductor industry and elaborates how to overcome these difficulties. It provides a comprehensive overview of the issues that executives and technical professionals encounter at fabless companies. Filled with over 150 on-target illustrations, this business-building tool presents a clear picture of the entire lifecycle of a fabless enterprise, describing how to envision and execute fabless IC implementation. Inside This Comprehensive Guide to Fabless IC Design - Define and specify the product Understand the customer requirements, the value chain, and the supply chain Select the right implementation approach, including “make” vs. “buy” Choose the best technologies and supply chain Implement IC design, fabrication, and manufacturing Build the operations infrastructure to meet cost and quality requirements Program-manage the distributed supply chain
Author: Daniel Nenni
Publisher: Createspace Independent Publishing Platform
ISBN: 9781497525047
Category : Integrated circuits industry
Languages : en
Pages : 0
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Book Description
The purpose of this book is to illustrate the magnificence of the fabless semiconductor ecosystem, and to give credit where credit is due. We trace the history of the semiconductor industry from both a technical and business perspective. We argue that the development of the fabless business model was a key enabler of the growth in semiconductors since the mid-1980s. Because business models, as much as the technology, are what keep us thrilled with new gadgets year after year, we focus on the evolution of the electronics business. We also invited key players in the industry to contribute chapters. These "In Their Own Words" chapters allow the heavyweights of the industry to tell their corporate history for themselves, focusing on the industry developments (both in technology and business models) that made them successful, and how they in turn drive the further evolution of the semiconductor industry.
Author: Chinmay K. Maiti
Publisher: CRC Press
ISBN: 1000638111
Category : Technology & Engineering
Languages : en
Pages : 314
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Book Description
This book deals with 3D nanodevices such as nanowire and nanosheet transistors at 7 nm and smaller technology nodes. It discusses technology computer-aided design (TCAD) simulations of stress- and strain-engineered advanced semiconductor devices, including III-nitride and RF FDSOI CMOS, for flexible and stretchable electronics. The book focuses on how to set up 3D TCAD simulation tools, from mask layout to process and device simulation, including fabless intelligent manufacturing. The simulation examples chosen are from the most popular devices in use today and provide useful technology and device physics insights. In order to extend the role of TCAD in the More-than-Moore era, the design issues related to strain engineering for flexible and stretchable electronics have been introduced for the first time.
Author: Jeorge S. Hurtarte
Publisher: Elsevier
ISBN: 9780080551197
Category : Technology & Engineering
Languages : en
Pages : 296
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Book Description
Fabless (no fabrication) IC (integrated circuit) techniques are growing rapidly and promise to become the standard method of IC manufacturing in the near future, this book will provide readers with what will soon be required knowledge of the subject. Other books on IC fabrication deal with the strictly physical process aspects of the topic and assume all factors in IC fabrication are under the control of the IC designing company. By contrast, this title recognizing that fabless IC design is often as much about managing business relationships as it is about physical processes. “Fabless ICs are those designed and marketed by one company but actually manufactured by another. *Written by board members of the Fabless Semiconductor Association, an industry consortium that include Xilinx, Intersil, Micro Linear, and many other members *Approriate for a wide range of integrated circuit (IC) designers and users who need to understand the fabless process and its advantages/limitations *Discusses important topics such as negotiating with outside fabrication companies, choosing the right electronic design tools, protection of intellectual property and business plans, and maintaining quality control
Author: Clair Brown
Publisher: MIT Press
ISBN: 0262516829
Category : Business & Economics
Languages : en
Pages : 283
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Book Description
How the chip industry has responded to a series of crises over the past twenty-five years, often reinventing itself and shifting the basis for global competitive advantage. For decades the semiconductor industry has been a driver of global economic growth and social change. Semiconductors, particularly the microchips essential to most electronic devices, have transformed computing, communications, entertainment, and industry. In Chips and Change, Clair Brown and Greg Linden trace the industry over more than twenty years through eight technical and competitive crises that forced it to adapt in order to continue its exponential rate of improved chip performance. The industry's changes have in turn shifted the basis on which firms hold or gain global competitive advantage. These eight interrelated crises do not have tidy beginnings and ends. Most, in fact, are still ongoing, often in altered form. The U.S. semiconductor industry's fear that it would be overtaken by Japan in the 1980s, for example, foreshadows current concerns over the new global competitors China and India. The intersecting crises of rising costs for both design and manufacturing are compounded by consumer pressure for lower prices. Other crises discussed in the book include the industry's steady march toward the limits of physics, the fierce competition that keeps its profits modest even as development costs soar, and the global search for engineering talent. Other high-tech industries face crises of their own, and the semiconductor industry has much to teach about how industries are transformed in response to such powerful forces as technological change, shifting product markets, and globalization. Chips and Change also offers insights into how chip firms have developed, defended, and, in some cases, lost global competitive advantage.
Author: National Research Council
Publisher: National Academies Press
ISBN: 0309168120
Category : Technology & Engineering
Languages : en
Pages : 342
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Book Description
Based on the deliberations of a high-level international conference, this report summarizes the presentations of an exceptional group of experts, convened by Intel's Chairman Emeritus Gordon Moore and SEMATECH's Chairman Emeritus William Spencer. The report documents the critical technological challenges facing this key industry and the rapid growth in government-industry partnerships overseas to support centers of semiconductor research and production in national economies. Importantly, the report provides a series of recommendations designed to strengthen U.S. research in disciplines supporting the continued growth of semiconductor industry, an industry which has made major contributions to the remarkable increases in productivity in the U.S. economy.
Author: Andrea Chen
Publisher: CRC Press
ISBN: 1439862079
Category : Technology & Engineering
Languages : en
Pages : 216
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Book Description
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
Author: Walden Rhines
Publisher:
ISBN:
Category :
Languages : en
Pages : 110
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Book Description
The semiconductor industry exhibited life cycles that were longer than the disk drive industry but had the same free market characteristics. Over time this unfettered competition followed trends in a worldwide market that could be quantified and used to predict the future. Over the past forty years or more, I've collected data and made presentations showing how the actual economics and technology of the semiconductor industry can be used to predict its future direction and magnitude. This book is built upon excerpts of presentations made during the last thirty years that analyze the business and technology of the semiconductor industry. In most cases, the figures in the book are copies of the original slides as they were presented during one or more of those presentations. In general, they show how predictable the semiconductor industry has been. They should also provide insight into the future of the industry.
Author: Chinmay K. Maiti
Publisher: CRC Press
ISBN: 1000638057
Category : Technology & Engineering
Languages : en
Pages : 340
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Book Description
This book deals with 3D nanodevices such as nanowire and nanosheet transistors at 7 nm and smaller technology nodes. It discusses technology computer-aided design (TCAD) simulations of stress- and strain-engineered advanced semiconductor devices, including III-nitride and RF FDSOI CMOS, for flexible and stretchable electronics. The book focuses on how to set up 3D TCAD simulation tools, from mask layout to process and device simulation, including fabless intelligent manufacturing. The simulation examples chosen are from the most popular devices in use today and provide useful technology and device physics insights. In order to extend the role of TCAD in the More-than-Moore era, the design issues related to strain engineering for flexible and stretchable electronics have been introduced for the first time.
Author: Chris Mack
Publisher: John Wiley & Sons
ISBN: 1119965071
Category : Technology & Engineering
Languages : en
Pages : 503
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Book Description
The fabrication of an integrated circuit requires a variety of physical and chemical processes to be performed on a semiconductor substrate. In general, these processes fall into three categories: film deposition, patterning, and semiconductor doping. Films of both conductors and insulators are used to connect and isolate transistors and their components. By creating structures of these various components millions of transistors can be built and wired together to form the complex circuitry of modern microelectronic devices. Fundamental to all of these processes is lithography, ie, the formation of three-dimensional relief images on the substrate for subsequent transfer of the pattern to the substrate. This book presents a complete theoretical and practical treatment of the topic of lithography for both students and researchers. It comprises ten detailed chapters plus three appendices with problems provided at the end of each chapter. Additional Information: Visiting http://www.lithoguru.com/textbook/index.html enhances the reader's understanding as the website supplies information on how you can download a free laboratory manual, Optical Lithography Modelling with MATLAB®, to accompany the textbook. You can also contact the author and find help for instructors.
