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Author: Daniel Nenni
Publisher: Createspace Independent Publishing Platform
ISBN: 9781497525047
Category : Integrated circuits industry
Languages : en
Pages : 0
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Book Description
The purpose of this book is to illustrate the magnificence of the fabless semiconductor ecosystem, and to give credit where credit is due. We trace the history of the semiconductor industry from both a technical and business perspective. We argue that the development of the fabless business model was a key enabler of the growth in semiconductors since the mid-1980s. Because business models, as much as the technology, are what keep us thrilled with new gadgets year after year, we focus on the evolution of the electronics business. We also invited key players in the industry to contribute chapters. These "In Their Own Words" chapters allow the heavyweights of the industry to tell their corporate history for themselves, focusing on the industry developments (both in technology and business models) that made them successful, and how they in turn drive the further evolution of the semiconductor industry.
Author: Daniel Nenni
Publisher: Createspace Independent Publishing Platform
ISBN: 9781497525047
Category : Integrated circuits industry
Languages : en
Pages : 0
Get Book Here
Book Description
The purpose of this book is to illustrate the magnificence of the fabless semiconductor ecosystem, and to give credit where credit is due. We trace the history of the semiconductor industry from both a technical and business perspective. We argue that the development of the fabless business model was a key enabler of the growth in semiconductors since the mid-1980s. Because business models, as much as the technology, are what keep us thrilled with new gadgets year after year, we focus on the evolution of the electronics business. We also invited key players in the industry to contribute chapters. These "In Their Own Words" chapters allow the heavyweights of the industry to tell their corporate history for themselves, focusing on the industry developments (both in technology and business models) that made them successful, and how they in turn drive the further evolution of the semiconductor industry.
Author: Rakesh Kumar
Publisher: McGraw Hill Professional
ISBN: 0071642706
Category : Technology & Engineering
Languages : en
Pages : 358
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Book Description
Discover How to Launch and Succeed as a Fabless Semiconductor Firm Fabless Semiconductor Implementation takes you step-by-step through the challenges faced by fabless firms in the development of integrated circuits. This expert guide examines the potential pitfalls of IC implementation in the rapidly growing fabless segment of the semiconductor industry and elaborates how to overcome these difficulties. It provides a comprehensive overview of the issues that executives and technical professionals encounter at fabless companies. Filled with over 150 on-target illustrations, this business-building tool presents a clear picture of the entire lifecycle of a fabless enterprise, describing how to envision and execute fabless IC implementation. Inside This Comprehensive Guide to Fabless IC Design - Define and specify the product Understand the customer requirements, the value chain, and the supply chain Select the right implementation approach, including “make” vs. “buy” Choose the best technologies and supply chain Implement IC design, fabrication, and manufacturing Build the operations infrastructure to meet cost and quality requirements Program-manage the distributed supply chain
Author: Jeorge S. Hurtarte
Publisher: Elsevier
ISBN: 008055119X
Category : Technology & Engineering
Languages : en
Pages : 294
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Book Description
Fabless (no fabrication) IC (integrated circuit) techniques are growing rapidly and promise to become the standard method of IC manufacturing in the near future, this book will provide readers with what will soon be required knowledge of the subject. Other books on IC fabrication deal with the strictly physical process aspects of the topic and assume all factors in IC fabrication are under the control of the IC designing company. By contrast, this title recognizing that fabless IC design is often as much about managing business relationships as it is about physical processes. "Fabless ICs are those designed and marketed by one company but actually manufactured by another.*Written by board members of the Fabless Semiconductor Association, an industry consortium that include Xilinx, Intersil, Micro Linear, and many other members*Approriate for a wide range of integrated circuit (IC) designers and users who need to understand the fabless process and its advantages/limitations*Discusses important topics such as negotiating with outside fabrication companies, choosing the right electronic design tools, protection of intellectual property and business plans, and maintaining quality control
Author: Clair Brown
Publisher: MIT Press
ISBN: 0262258064
Category : Business & Economics
Languages : en
Pages : 272
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Book Description
How the chip industry has responded to a series of crises over the past twenty-five years, often reinventing itself and shifting the basis for global competitive advantage. For decades the semiconductor industry has been a driver of global economic growth and social change. Semiconductors, particularly the microchips essential to most electronic devices, have transformed computing, communications, entertainment, and industry. In Chips and Change, Clair Brown and Greg Linden trace the industry over more than twenty years through eight technical and competitive crises that forced it to adapt in order to continue its exponential rate of improved chip performance. The industry's changes have in turn shifted the basis on which firms hold or gain global competitive advantage. These eight interrelated crises do not have tidy beginnings and ends. Most, in fact, are still ongoing, often in altered form. The U.S. semiconductor industry's fear that it would be overtaken by Japan in the 1980s, for example, foreshadows current concerns over the new global competitors China and India. The intersecting crises of rising costs for both design and manufacturing are compounded by consumer pressure for lower prices. Other crises discussed in the book include the industry's steady march toward the limits of physics, the fierce competition that keeps its profits modest even as development costs soar, and the global search for engineering talent. Other high-tech industries face crises of their own, and the semiconductor industry has much to teach about how industries are transformed in response to such powerful forces as technological change, shifting product markets, and globalization. Chips and Change also offers insights into how chip firms have developed, defended, and, in some cases, lost global competitive advantage.
Author: Jie Zhang
Publisher: Walter de Gruyter GmbH & Co KG
ISBN: 3110487233
Category : Technology & Engineering
Languages : en
Pages : 321
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Book Description
This book systematically introduces modeling, performance evaluation and applications of Automatic Materiel Handling System (AMHS) in semiconductor manufactucing, and focuses discussion on the coordination of two subsystems. Resources dispatch and optimization are conducted on operational research combined with cases studies. Written in a practical way, it is an essential reference for researchers and engineers in manufacturing and management.
Author: Christophe Lecuyer
Publisher: MIT Press
ISBN: 0262014246
Category : Computers
Languages : en
Pages : 327
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Book Description
The first years of the company that developed the microchip and created the model for a successful Silicon Valley start-up. In the first three and a half years of its existence, Fairchild Semiconductor developed, produced, and marketed the device that would become the fundamental building block of the digital world: the microchip. Founded in 1957 by eight former employees of the Schockley Semiconductor Laboratory, Fairchild created the model for a successful Silicon Valley start-up: intense activity with a common goal, close collaboration, and a quick path to the market (Fairchild's first device hit the market just ten months after the company's founding). Fairchild Semiconductor was one of the first companies financed by venture capital, and its success inspired the establishment of venture capital firms in the San Francisco Bay area. These firms would finance the explosive growth of Silicon Valley over the next several decades. This history of the early years of Fairchild Semiconductor examines the technological, business, and social dynamics behind its innovative products. The centerpiece of the book is a collection of documents, reproduced in facsimile, including the company's first prospectus; ideas, sketches, and plans for the company's products; and a notebook kept by cofounder Jay Last that records problems, schedules, and tasks discussed at weekly meetings. A historical overview, interpretive essays, and an introduction to semiconductor technology in the period accompany these primary documents.
Author: James L. Turley
Publisher: Prentice Hall Professional
ISBN: 9780130464040
Category : Education
Languages : en
Pages : 242
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Book Description
The Essential Guide to Semiconductorsis a complete guide to thebusiness and technology of semiconductor design and manufacturing.Conceptual enough for laypeople and nontechnical investors, yet detailedenough for technical professionals, Jim Turley explains exactly howsilicon chips are designed and built, illuminates key markets andopportunities, and shows how the entire industry "fits together."
Author: National Research Council
Publisher: National Academies Press
ISBN: 0309168120
Category : Technology & Engineering
Languages : en
Pages : 342
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Book Description
Based on the deliberations of a high-level international conference, this report summarizes the presentations of an exceptional group of experts, convened by Intel's Chairman Emeritus Gordon Moore and SEMATECH's Chairman Emeritus William Spencer. The report documents the critical technological challenges facing this key industry and the rapid growth in government-industry partnerships overseas to support centers of semiconductor research and production in national economies. Importantly, the report provides a series of recommendations designed to strengthen U.S. research in disciplines supporting the continued growth of semiconductor industry, an industry which has made major contributions to the remarkable increases in productivity in the U.S. economy.
Author: Chinmay K. Maiti
Publisher: CRC Press
ISBN: 1000638057
Category : Technology & Engineering
Languages : en
Pages : 340
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Book Description
This book deals with 3D nanodevices such as nanowire and nanosheet transistors at 7 nm and smaller technology nodes. It discusses technology computer-aided design (TCAD) simulations of stress- and strain-engineered advanced semiconductor devices, including III-nitride and RF FDSOI CMOS, for flexible and stretchable electronics. The book focuses on how to set up 3D TCAD simulation tools, from mask layout to process and device simulation, including fabless intelligent manufacturing. The simulation examples chosen are from the most popular devices in use today and provide useful technology and device physics insights. In order to extend the role of TCAD in the More-than-Moore era, the design issues related to strain engineering for flexible and stretchable electronics have been introduced for the first time.
Author: Andrea Chen
Publisher: CRC Press
ISBN: 1439862079
Category : Technology & Engineering
Languages : en
Pages : 208
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Book Description
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
