Experimental Investigation of Nucleate Boiling and Thin-film Evaporation on Enhanced Silicon Surfaces PDF Download
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Author: Shailesh Malla
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 124
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Book Description
The present work consists of two major studies. The first study investigates the effects of surface energy or wettability on nucleate pool boiling and the second study investigates the thin-film evaporative cooling for near junction thermal management. For the first study, effects of surface energy or wettability on critical heat flux (CHF) and boiling heat transfer (BHT) of smooth heated surfaces was studied in saturated pool boiling of water at 1 atm. For this purpose hydrophilic and hydrophobic surfaces were created on one side of 1cm x 1cm double-side polished silicon substrates. A resistive heating layer was applied on the opposite side of each substrate. The surface energies of the created surfaces were characterized by measuring the static contact angles of water sessile drops. To provide a wide range of surface energies, surfaces were made of Teflon (hydrophobic), bare silicon (hydrophilic) and aluminum oxide (most hydrophilic). The measured contact angles on these surfaces were ~108, ~57 and ~13 degrees respectively. The results of pool boiling tests on these surfaces clearly illustrate the connection between surface energy and CHF. CHF was shown to linearly decrease with contact angle increase, from ~125 W/cm2 on aluminum oxide (most hydrophilic) to nearly one tenth of this value on Teflon (hydrophobic). The most hydrophilic surface also produced increasingly better BHT than plain silicon and Teflon as heat flux increased. However, below ~5 W/cm2 the hydrophobic surface demonstrated better heat transfer due to earlier onset of nucleate boiling, reducing surface superheats by up to ~5 degrees relative to the other two surfaces. Above ~5 W/cm2 the BHT of the hydrophobic surface rapidly deteriorated as superheat increased towards the value at CHF. To further understand the effect of surface energy on pool boiling performance, the growth and departure of bubbles from single nucleating sites on each surface were analyzed from high-speed video recordings. A distinct bubble behavior was observed in the hydrophobic surface where bubble growth and departure period was extremely long compared to plain silicon and aluminum oxide surfaces. This study also investigated the performance of thin-film evaporative cooling for near-junction thermal management. A liquid delivery system capable of delivering water in small volumes ranging 20~75 nl at frequencies of up to 600 Hz was established. On one side of the silicon chip, a resistive heating layer of 2 mm x 2 mm was fabricated to emulate the high heat flux hot-spot, and on the other side a superhydrophilic nanoporous coating (SHNC) was applied over an area of 1 cm x 1 cm. With the aid of the nanoporous coating, delivered droplets spread into thin films of thicknesses less than 10[mu]m. With this system, evaporative tests were conducted in ambient in an effort to maximize dryout heat flux and evaporative heat transfer coefficient. During the tests, heat flux at the hot spot was varied to values above 1000 W/cm2. Water was delivered at either given constant frequency (constant mass flow rate) or at programmed variations of frequency (variable mass flow rate), for a given nanoliter dose volume. Heat flux and hot spot surface temperatures were recorded upon reaching steady state at each applied heat flux increment. Relative to bare silicon surface, dryout heat flux of the SHNC surface was found to increase by ~5 times at 500~600 Hz. Tests were also conducted at various system pressures and temperatures in a micro-gap to emulate the actual embedded thermal management system. The micro-gap was made by positioning a top cover plate 500 [mu]m above the test surface. System temperature did not influence the hotspot temperature. This was due to the formation of near saturation temperature inside the micro-gap for all cases as a result of vapor accumulation. Increase in system pressure increased the hotspot temperature. At 1500 W/cm2, hotspot temperature increased by 6 C and 24 C by increasing the system pressure by 7.32 and 14.7 psi respectively. This was due to increase in saturation point as a result of increase in pressure. On the SHNC surface a mixed mode of heat transfer comprising of thin-film boiling and thin-film evaporation was observed particularly at moderate heat flux (~700 W/cm2). To further enhance the heat transfer coefficient, aluminum microporous coating was developed that increased the number of nucleation sites for thin-film boiling and also maintained the wettability for thin-film evaporation at higher heat fluxes. Test results showed a marginal improvement in dry-out heat flux compared to SHNC, however, significant reduction was achieved in hot-spot temperature at all heat flux levels. A net reduction of ~ 58oC was obtained at ~1600 W/cm2 by using aluminum based microporous coating.
Author: Shailesh Malla
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 124
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Book Description
The present work consists of two major studies. The first study investigates the effects of surface energy or wettability on nucleate pool boiling and the second study investigates the thin-film evaporative cooling for near junction thermal management. For the first study, effects of surface energy or wettability on critical heat flux (CHF) and boiling heat transfer (BHT) of smooth heated surfaces was studied in saturated pool boiling of water at 1 atm. For this purpose hydrophilic and hydrophobic surfaces were created on one side of 1cm x 1cm double-side polished silicon substrates. A resistive heating layer was applied on the opposite side of each substrate. The surface energies of the created surfaces were characterized by measuring the static contact angles of water sessile drops. To provide a wide range of surface energies, surfaces were made of Teflon (hydrophobic), bare silicon (hydrophilic) and aluminum oxide (most hydrophilic). The measured contact angles on these surfaces were ~108, ~57 and ~13 degrees respectively. The results of pool boiling tests on these surfaces clearly illustrate the connection between surface energy and CHF. CHF was shown to linearly decrease with contact angle increase, from ~125 W/cm2 on aluminum oxide (most hydrophilic) to nearly one tenth of this value on Teflon (hydrophobic). The most hydrophilic surface also produced increasingly better BHT than plain silicon and Teflon as heat flux increased. However, below ~5 W/cm2 the hydrophobic surface demonstrated better heat transfer due to earlier onset of nucleate boiling, reducing surface superheats by up to ~5 degrees relative to the other two surfaces. Above ~5 W/cm2 the BHT of the hydrophobic surface rapidly deteriorated as superheat increased towards the value at CHF. To further understand the effect of surface energy on pool boiling performance, the growth and departure of bubbles from single nucleating sites on each surface were analyzed from high-speed video recordings. A distinct bubble behavior was observed in the hydrophobic surface where bubble growth and departure period was extremely long compared to plain silicon and aluminum oxide surfaces. This study also investigated the performance of thin-film evaporative cooling for near-junction thermal management. A liquid delivery system capable of delivering water in small volumes ranging 20~75 nl at frequencies of up to 600 Hz was established. On one side of the silicon chip, a resistive heating layer of 2 mm x 2 mm was fabricated to emulate the high heat flux hot-spot, and on the other side a superhydrophilic nanoporous coating (SHNC) was applied over an area of 1 cm x 1 cm. With the aid of the nanoporous coating, delivered droplets spread into thin films of thicknesses less than 10[mu]m. With this system, evaporative tests were conducted in ambient in an effort to maximize dryout heat flux and evaporative heat transfer coefficient. During the tests, heat flux at the hot spot was varied to values above 1000 W/cm2. Water was delivered at either given constant frequency (constant mass flow rate) or at programmed variations of frequency (variable mass flow rate), for a given nanoliter dose volume. Heat flux and hot spot surface temperatures were recorded upon reaching steady state at each applied heat flux increment. Relative to bare silicon surface, dryout heat flux of the SHNC surface was found to increase by ~5 times at 500~600 Hz. Tests were also conducted at various system pressures and temperatures in a micro-gap to emulate the actual embedded thermal management system. The micro-gap was made by positioning a top cover plate 500 [mu]m above the test surface. System temperature did not influence the hotspot temperature. This was due to the formation of near saturation temperature inside the micro-gap for all cases as a result of vapor accumulation. Increase in system pressure increased the hotspot temperature. At 1500 W/cm2, hotspot temperature increased by 6 C and 24 C by increasing the system pressure by 7.32 and 14.7 psi respectively. This was due to increase in saturation point as a result of increase in pressure. On the SHNC surface a mixed mode of heat transfer comprising of thin-film boiling and thin-film evaporation was observed particularly at moderate heat flux (~700 W/cm2). To further enhance the heat transfer coefficient, aluminum microporous coating was developed that increased the number of nucleation sites for thin-film boiling and also maintained the wettability for thin-film evaporation at higher heat fluxes. Test results showed a marginal improvement in dry-out heat flux compared to SHNC, however, significant reduction was achieved in hot-spot temperature at all heat flux levels. A net reduction of ~ 58oC was obtained at ~1600 W/cm2 by using aluminum based microporous coating.
Author: Almon Duncan Rivers
Publisher:
ISBN:
Category : Mechanical engineering
Languages : en
Pages : 61
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Book Description
Experimental data was taken to determine the heat transfer coefficient during boiling of Freon 113 in thin liquid films from a horizontal, rectangular foil .025 mm thick. Heat flux was held constant at 8, 12, 16 and 32 thousand watts/sgm as liquid level was lowered from 18mm to 0.2mm below which dryout usually occurred. Surface temperature of the foil was qualitatively mapped with Cholesteric Liquid Crystals. This mapping was recorded and is presented by color photographs. There is an increase in heat transfer coefficient as liquid level is lowered below 2.0 mm for Freon 113. Liquid Crystals are a practical means of mapping the nucleation sites on the surface of a thin foil boiling test section. The heating surface under the bubbles forming on the surface is cooler than under the undisturbed liquid. As heat flux increases the number of active nucleation sites also increases. (Modified author abstract).
Author:
Publisher: Springer
ISBN: 9783319266947
Category : Science
Languages : en
Pages : 0
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Book Description
This Handbook provides researchers, faculty, design engineers in industrial R&D, and practicing engineers in the field concise treatments of advanced and more-recently established topics in thermal science and engineering, with an important emphasis on micro- and nanosystems, not covered in earlier references on applied thermal science, heat transfer or relevant aspects of mechanical/chemical engineering. Major sections address new developments in heat transfer, transport phenomena, single- and multiphase flows with energy transfer, thermal-bioengineering, thermal radiation, combined mode heat transfer, coupled heat and mass transfer, and energy systems. Energy transport at the macro-scale and micro/nano-scales is also included. The internationally recognized team of authors adopt a consistent and systematic approach and writing style, including ample cross reference among topics, offering readers a user-friendly knowledgebase greater than the sum of its parts, perfect for frequent consultation. The Handbook of Thermal Science and Engineering is ideal for academic and professional readers in the traditional and emerging areas of mechanical engineering, chemical engineering, aerospace engineering, bioengineering, electronics fabrication, energy, and manufacturing concerned with the influence thermal phenomena.
Author: Felix H. Rojas M.
Publisher:
ISBN:
Category : Nucleate boiling
Languages : en
Pages : 94
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Book Description
Author: Robert R. Sharp
Publisher:
ISBN:
Category : Evaporation
Languages : en
Pages : 40
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Author: Vijaykumar Sathyamurthi
Publisher:
ISBN:
Category :
Languages : en
Pages :
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Book Description
Subcooled pool boiling on nanotextured surfaces is explored in this study. The experiments are performed in an enclosed viewing chamber. Two silicon wafers are coated with Multiwalled Carbon Nanotubes (MWCNT), 9 microns (Type-A) and 25 microns (Type-B) in height. A third bare silicon wafer is used for control experiments. The test fluid is PF-5060, a fluoroinert with a boiling point of 56°C (Manufacturer: 3M Co.). The apparatus is of the constant heat flux type. Pool boiling experiments in nucleate and film boiling regimes are reported in this study. Experiments are carried out under low subcooling (5 °C and 10 °C) and high subcooling conditions (20°C to ~ 38°C). At approximately 38°C, a non-departing bubble configuration is obtained on a bare silicon wafer. Increase in subcooling is found to enhance the critical heat flux (CHF) and the CHF is found to shift towards higher wall superheats. Presence of MWCNT on the test surface led to an enhancement in heat flux. Potential factors responsible for boiling heat transfer enhancement on heater surfaces coated with MWCNT are identified as follows: a. Enhanced surface area or nano - fin effect b. Higher thermal conductivity of MWCNT than the substrate c. Disruption of vapor-liquid vapor interface in film boiling, and of the "microlayer" region in nucleate boiling d. Enhanced transient heat transfer caused by local quasi-periodic transient liquid-solid contacts due to presence of the "hair like" protrusion of the MWCNT e. Enhancement in the size of cold spots f. Pinning of contact line, leading to enhanced surface area underneath the bubble leading to enhanced heat transfer Presence of MWCNT is found to enhance the phase change heat transfer by approximately 400% in nucleate boiling for conditions of low subcooling. The heat transfer enhancement is found to be independent of the height of MWCNT in nucleate boiling regime in the low subcooling cases. About 75%-120% enhancement in heat transfer is observed for surfaces coated with MWCNT under conditions of high subcooling in the nucleate boiling regime. Surfaces coated with Type-B MWCNT show a 75% enhancement in heat transfer in the film boiling regime under conditions of low subcooling.
Author: Guy A. Rupp
Publisher:
ISBN:
Category :
Languages : en
Pages : 296
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Book Description
Author: Krishna Prasad A. K.
Publisher:
ISBN:
Category : Ebullition
Languages : en
Pages : 254
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Book Description
Author: John R Thome
Publisher: World Scientific
ISBN: 9814623296
Category : Technology & Engineering
Languages : en
Pages : 1321
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Book Description
The aim of the two-set series is to present a very detailed and up-to-date reference for researchers and practicing engineers in the fields of mechanical, refrigeration, chemical, nuclear and electronics engineering on the important topic of two-phase heat transfer and two-phase flow. The scope of the first set of 4 volumes presents the fundamentals of the two-phase flows and heat transfer mechanisms, and describes in detail the most important prediction methods, while the scope of the second set of 4 volumes presents numerous special topics and numerous applications, also including numerical simulation methods.Practicing engineers will find extensive coverage to applications involving: multi-microchannel evaporator cold plates for electronics cooling, boiling on enhanced tubes and tube bundles, flow pattern based methods for predicting boiling and condensation inside horizontal tubes, pressure drop methods for singularies (U-bends and contractions), boiling in multiport tubes, and boiling and condensation in plate heat exchangers. All of these chapters include the latest methods for predicting not only local heat transfer coefficients but also pressure drops.Professors and students will find this 'Encyclopedia of Two-Phase Heat Transfer and Flow' particularly exciting, as it contains authored books and thorough state-of-the-art reviews on many basic and special topics, such as numerical modeling of two-phase heat transfer and adiabatic bubbly and slug flows, the unified annular flow boiling model, flow pattern maps, condensation and boiling theories, new emerging topics, etc.
Author: Ming-Chang Lu
Publisher:
ISBN:
Category :
Languages : en
Pages : 218
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Book Description
This dissertation presents a study exploring the limits of phase-change heat transfer with the aim of enhancing critical heat flux (CHF) in pool boiling and enhancing thermal conductance in heat pipes. The state-of-the-art values of the CHF in pool boiling and the thermal conductance in heat pipes are about two orders of magnitudes smaller than the limits predicted by kinetic theory. Consequently, there seems to be plenty of room for improvement. Pool boiling refers to boiling at a surface immersed in an extensive motionless pool of liquid. Its process includes heterogeneous nucleation, growth, mergence and detachment of vapor bubbles on a heating surface. It is generally agreed that the high heat transfer coefficient of boiling could be explained by the concept of single-phase forced convection, i.e., the motion of bubbles agitating surrounding liquid is similar to the process in single-phase forced convection. The occurrence of CHF results from a formation of a vapor film on the heater surface, which reduces the thermal conductance drastically and causes a huge temperature rise on the surface. Over the past few decades, researchers were struggling to identify the exact mechanism causing CHF. General observations are that both surface properties and pool hydrodynamics could affect the values of CHF. Nanowire array-coated surfaces having a large capillary force are employed to enhance the CHF. It has been shown that CHFs on the nanowire array-coated surface could be doubled compared to the values on a plain surface. The obtained CHF of 224 ± 6.60 W/cm̂2 on the nanowire-array coated surface is one of the highest values reported in the boiling heat transfer. To further enhance CHF, the mechanisms that govern CHF have been systematically explored. Experimental results show that the CHF on the nanowire array-coated surface are not limited by the capillary force. Instead, the CHF are dependent on the heater size. Corresponding experiments on plain surfaces with various heater sizes also exhibits similar heater-size dependence. The CHFs on nanowire array-coated surfaces and plain surfaces are consistent with the predictions of the hydrodynamic theory while a higher CHF is obtained on the nanowire array-coated surface as compared to the plain Si surface. This suggests that the CHFs are a result of the pool hydrodynamics while surface properties modify the corresponding hydrodynamic limits. A heat pipe is a device that transports thermal energy in a very small temperature difference and thereby producing a very large thermal conductance. It relies on evaporation of liquid at the heated end of the pipe, flow of vapor between the heated and cooled end, condensation at the other end, and capillary-driven liquid flow through a porous wick between the condenser and the evaporation. The large latent heat involved in evaporation and condensation leads to very large heat flows for a small temperature drop along the heat pipe. Despite the large thermal conductance, their operation is limited by such factors as capillary limit, boiling limit, sonic limit and entrainment limit, etc. Among these operational limits, capillary and boiling limits are most frequently encountered. The capillary limit determines the maximum flow rate provided by the capillary force of the wick structure whereas boiling limit is referred to a condition that liquid supply is blocked by vapor bubbles in the wick. Consequently, the wick structure is the key component in a heat pipe, which determines the maximum capillary force and the dominant thermal resistance. In a heat pipe using evaporation as the dominant heat transfer mechanism, a thin liquid film (̃ a few microns) extended from the solid structure in the wick causes the dominant thermal resistance. Therefore, if one reduces the pore size of a porous media, the thermal conductance could be enhanced by increasing the surface area of the thin liquid film. On the other hand, the classical thermodynamics depicts that the superheat required for evaporation is inversely proportional to the equilibrium radius of the meniscus. Consequently, enhancing thermal conductance via increasing the thin film area is contradictory to the effect of evaporation suppression for small pores. A hierarchical wick structure with multiple length scales that enhances dry-out heat flux and thermal conductance simultaneously in heat pipes was demonstrated. This hierarchical wick structure is composed of a large microchannel array to reduce flow resistance and small pin-fin arrays to provide a large capillary force. The enhancement of thermal conductance is achieved via a large number of pin-fins for increasing the total thin film area. A thermal conductance defined by the slope of the curve of ̃16.28 ± 1.33 W/cm̂2-K and a dry-out heat flux of 228.85 ± 10.73 W/cm̂2 were achieved by this design. Further, vapor transport resistance is minimized within the aligned-multi-scale wick structure. As a result, this wick does not pose a boiling limit. Artificial cavities were created in the wick structure to take the advantage of the high heat transfer coefficient of boiling heat transfer. The wick with artificial cavities successfully triggers boiling at a lower wall temperature resulting in a conductance of 9.02 ± 0.04 W/cm̂2-K compared to an evaporation mode of 3.54 ± 0.01 W/cm̂2-K. For a given heat flux, the wick with cavities effectively reduce wall temperature compared to a wick without cavities. Our experimental results display an enhancement of thermal conductance by using boiling heat transfer. This opens up a new direction for further enhancing thermal conductance in heat pipes by circumventing the limit in the evaporative heat transfer regime, in which further increase in surface area will eventually result in evaporation suppression in small pores.
