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Author: Guy Rabilloud
Publisher: Editions OPHRYS
ISBN: 9782710810940
Category :
Languages : en
Pages : 382
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Book Description
Author: Guy Rabilloud
Publisher: Editions OPHRYS
ISBN: 9782710810940
Category :
Languages : en
Pages : 382
Get Book Here
Book Description
Author: Yi (Grace) Li
Publisher: Springer Science & Business Media
ISBN: 0387887830
Category : Technology & Engineering
Languages : en
Pages : 445
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Book Description
“Electrical Conductive Adhesives with Nanotechnologies” begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied to conductive adhesives is discussed, including recent research and development of nano component adhesives/nano component films, their electrical properties, thermal performance, bonding pressure and assembly and reliability.
Author: Rao Tummala
Publisher: Springer Science & Business Media
ISBN: 9780412084515
Category : Computers
Languages : en
Pages : 662
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Book Description
This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables. Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development. Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail. Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.
Author: Dongkai Shangguan
Publisher: ASM International
ISBN: 161503093X
Category : Technology & Engineering
Languages : en
Pages : 292
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Book Description
Author: Ken Gilleo
Publisher: Springer Science & Business Media
ISBN: 9780442012205
Category : Computers
Languages : en
Pages : 450
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Book Description
Ken Gilleo's Polymer Thick Film provides you with all the essential concepts, process descriptions, performance data, and general information you will need to reach your own conclusions. The focus will be on polymer thick film's major subsets, which include conductive inks, printed resistors, dielectric films or pastes, and polymer assembly material.
Author: Daniel Lu
Publisher: Springer
ISBN: 3319450980
Category : Technology & Engineering
Languages : en
Pages : 974
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Book Description
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Author: K. L. Mittal
Publisher: John Wiley & Sons
ISBN: 1118831349
Category : Technology & Engineering
Languages : en
Pages : 293
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Book Description
This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesion Surface (physical or chemical) characterization of materials as it pertains to adhesion Surface cleaning as it pertains to adhesion Ways to improve adhesion Unraveling of interfacial interactions using an array of pertinent techniques Characterization of interfaces / interphases Polymer-polymer adhesion Metal-polymer adhesion (metallized polymers) Polymer adhesion to various substrates Adhesion of thin films Adhesion of underfills Adhesion of molding compounds Adhesion of different dielectric materials Delamination and reliability issues in packaged devices Interface mechanics and crack propagation Adhesion measurement of thin films and coatings
Author: Philippe Cognard
Publisher: Elsevier
ISBN: 0080534090
Category : Technology & Engineering
Languages : en
Pages : 511
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Book Description
Handbook of Adhesives and Sealants is the most comprehensive Adhesives and Sealants Handbook ever published, with the cooperation of around 35 authors from all over the world – each one a specialist in their field. It will include 80 chapters dealing with general information, theory of bonding and sealing, design of bonding parts, technical characteristics, chemistry, types of adhesives, application, equipment, controls, standards etc. Industrial applications such as automotive, aeronautics, building and civil engineering, electronics, packaging, wood, furniture, metals, plastics and composites, textiles, footwear etc. - Over 1,000 real-life examples illustrate the do's and don'ts of using adhesives - Every scientific and technical issue concerning every chemical type in every industry - Designed to help solve problems quickly, the content is structured to allow readers to navigate this comprehensive resource in 4 different ways
Author:
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 498
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Book Description
Topics covered by this title include: flip chip running; solder join reliability; emerging technologies; solder materials; delimitation; polymers for packaging; design and process; modelling and testing; material characterization; and package reliability.
Author: Ray Prasad
Publisher: Springer Science & Business Media
ISBN: 1461540844
Category : Technology & Engineering
Languages : en
Pages : 791
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Book Description
A foreword is usually prepared by someone who knows the author or who knows enough to provide additional insight on the purpose of the work. When asked to write this foreword, I had no problem with what I wanted to say about the work or the author. I did, however, wonder why people read a foreword. It is probably of value to know the background of the writer of a book; it is probably also of value to know the background of the individual who is commenting on the work. I consider myself a good friend of the author, and when I was asked to write a few words I felt honored to provide my view of Ray Prasad, his expertise, and the contribution that he has made to our industry. This book is about the industry, its technology, and its struggle to learn and compete in a global market bursting with new ideas to satisfy a voracious appetite for new and innovative electronic products. I had the good fortune to be there at the beginning (or almost) and have witnessed the growth and excitement in the opportunities and challenges afforded the electronic industries' engineering and manufacturing talents. In a few years my involve ment will span half a century.
