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Author:
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ISBN:
Category : Dissertations, Academic
Languages : en
Pages : 946
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Author:
Publisher:
ISBN:
Category : Dissertations, Academic
Languages : en
Pages : 946
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Book Description
Author: Pranav H. Darji
Publisher: Intechopen
ISBN: 953512742X
Category : Technology & Engineering
Languages : en
Pages : 280
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Book Description
In the major field of design and manufacturing of mechanical, production, automobile, and industrial engineering, typical and advance methodologies and processes are implemented for the best performance of product or machinery. Thus, the concept of tribology has come into practice for even better performance. Nowadays, it is very important that the tribological knowledge be implemented at each stage of design and manufacturing to minimize the frictional and wear losses, and ultimately these will serve as best preference for the economical growth of the nation. Currently, tribologists are playing vital role in the same direction. This book contains original and innovative research studies on recent applications of tribology, contributed by the group of selected researchers describing the best of their work. Through its 11 chapters, the reader will have access to work in 3 major areas of tribology. These are surface engineering and coating, friction and wear mechanism, and lubrication technology. The first part of the book from Chapters 1 to 4 deals with the surface treatment and coating through which component life can be improved by reducing wear rate. The second part of the book from Chapters 5 to 7 deals with tribo-testing and tribo-system monitoring for friction and wear mechanism presented with real-life case studies. The third part from Chapters 8 to 11 discusses the advances in lubrication, which also includes the role of nanolubricants and lubrication additives. This book may be of interest to research scholars, academicians, industrialists, professional engineers, and specialists in these related areas and would also be of immense help to various practicing engineers, technologists, managers, and supervisors engaged in the maintenance, operation, and upkeep of different machines, equipments, systems, and plants of various industries.
Author: M.R. Oliver
Publisher: Springer Science & Business Media
ISBN: 9783540431817
Category : Technology & Engineering
Languages : en
Pages : 444
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Book Description
This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.
Author: Toshiro Doi
Publisher: William Andrew
ISBN: 1437778593
Category : Science
Languages : en
Pages : 330
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Book Description
CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience. Building on the fundamentals of tribology - the science of friction, wear and lubrication - the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries. Demystifies scientific developments and technological innovations, opening them up for new applications and process improvements in the semiconductor industry and other areas of precision engineering Explores stock removal mechanisms in CMP and polishing, and the challenges involved in predicting the outcomes of abrasive processes in high-precision environments The authors bring together the latest innovations and research from the USA and Japan
Author: Babu Suryadevara
Publisher: Woodhead Publishing
ISBN: 0128218193
Category : Technology & Engineering
Languages : en
Pages : 650
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Book Description
Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. - Reviews the most relevant techniques and processes for CMP of dielectric and metal films - Includes chapters devoted to CMP for current and emerging materials - Addresses consumables and process control for improved CMP, including post-CMP
Author: Joseph M. Steigerwald
Publisher: John Wiley & Sons
ISBN: 3527617752
Category : Science
Languages : en
Pages : 337
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Book Description
Chemical Mechanical Planarization (CMP) plays an important role in today's microelectronics industry. With its ability to achieve global planarization, its universality (material insensitivity), its applicability to multimaterial surfaces, and its relative cost-effectiveness, CMP is the ideal planarizing medium for the interlayered dielectrics and metal films used in silicon integrated circuit fabrication. But although the past decade has seen unprecedented research and development into CMP, there has been no single-source reference to this rapidly emerging technology-until now. Chemical Mechanical Planarization of Microelectronic Materials provides engineers and scientists working in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP. Authors Steigerwald, Murarka, and Gutmann-all leading CMP pioneers-provide a historical overview of CMP, explain the various chemical and mechanical concepts involved, describe CMP materials and processes, review the latest scientific data on CMP worldwide, and offer examples of its uses in the microelectronics industry. They provide detailed coverage of the CMP of various materials used in the making of microcircuitry: tungsten, aluminum, copper, polysilicon, and various dielectric materials, including polymers. The concluding chapter describes post-CMP cleaning techniques, and most chapters feature problem sets to assist readers in developing a more practical understanding of CMP. The only comprehensive reference to one of the fastest growing integrated circuit manufacturing technologies, Chemical Mechanical Planarization of Microelectronic Materials is an important resource for research scientists and engineers working in the microelectronics industry. An indispensable resource for scientists and engineers working in the microelectronics industry Chemical Mechanical Planarization of Microelectronic Materials is the only comprehensive single-source reference to one of the fastest growing integrated circuit manufacturing technologies. It provides engineers and scientists who work in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP, including: * The history of CMP * Chemical and mechanical underpinnings of CMP * CMP materials and processes * Applications of CMP in the microelectronics industry * The CMP of tungsten, aluminum, copper, polysilicon, and various dielectrics, including polymers used in integrated circuit fabrication * Post-CMP cleaning techniques * Chapter-end problem sets are also included to assist readers in developing a practical understanding of CMP.
Author: Rainee N. Simons
Publisher: John Wiley & Sons
ISBN: 0471463930
Category : Technology & Engineering
Languages : zh-CN
Pages : 461
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Book Description
Up-to-date coverage of the analysis and applications of coplanar waveguides to microwave circuits and antennas The unique feature of coplanar waveguides, as opposed to more conventional waveguides, is their uniplanar construction, in which all of the conductors are aligned on the same side of the substrate. This feature simplifies manufacturing and allows faster and less expensive characterization using on-wafer techniques. Coplanar Waveguide Circuits, Components, and Systems is an engineer's complete resource, collecting all of the available data on the subject. Rainee Simons thoroughly discusses propagation parameters for conventional coplanar waveguides and includes valuable details such as the derivation of the fundamental equations, physical explanations, and numerical examples. Coverage also includes: Discontinuities and circuit elements Transitions to other transmission media Directional couplers, hybrids, and magic T Microelectromechanical systems based switches and phase shifters Tunable devices using ferroelectric materials Photonic bandgap structures Printed circuit antennas
Author: Jianfeng Luo
Publisher: Springer Science & Business Media
ISBN: 3662079283
Category : Science
Languages : en
Pages : 327
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Book Description
Chemical mechanical planarization, or chemical mechanical polishing as it is simultaneously referred to, has emerged as one of the critical processes in semiconductor manufacturing and in the production of other related products and devices, MEMS for example. Since its introduction some 15+ years ago CMP, as it is commonly called, has moved steadily into new and challenging areas of semiconductor fabrication. Demands on it for consistent, efficient and cost-effective processing have been steady. This has continued in the face of steadily decreasing feature sizes, impressive increases in wafer size and a continuing array of new materials used in devices today. There are a number of excellent existing references and monographs on CMP in circulation and we defer to them for detailed background information. They are cited in the text. Our focus here is on the important area of process mod els which have not kept pace with the tremendous expansion of applications of CMP. Preston's equation is a valuable start but represents none of the subtleties of the process. Specifically, we refer to the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. We call that an "integrated model" and, more specifically, we include the important role of the mechanical elements of the process.
Author:
Publisher:
ISBN:
Category : Electrical engineering
Languages : en
Pages : 1948
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Book Description
Author:
Publisher:
ISBN:
Category : Prosthodontics
Languages : en
Pages : 80
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Book Description
