Electronic Packaging Materials Science V: Volume 203 PDF Download
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Author: Edwin D. Lillie
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 488
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author: Edwin D. Lillie
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 488
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author:
Publisher:
ISBN:
Category : Electronic packaging
Languages : en
Pages : 464
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Book Description
Author: Edwin D. Lillie
Publisher: Cambridge University Press
ISBN: 9781107409996
Category : Technology & Engineering
Languages : en
Pages : 484
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 148
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Book Description
Author: National Institute of Standards and Technology (U.S.)
Publisher:
ISBN:
Category : Semiconductors
Languages : en
Pages : 160
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Author: National Semiconductor Metrology Program (U.S.)
Publisher:
ISBN:
Category : Semiconductors
Languages : en
Pages : 136
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Book Description
Author: Daryl Ann Doane
Publisher: Springer Science & Business Media
ISBN: 1461531004
Category : Computers
Languages : en
Pages : 895
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Book Description
Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance measured in picoseconds continues to improve, computer performance is expected to be in nanoseconds for the rest of this century -a factor of 1000 difference between on-chip and off-chip performance which is attributable to losses associated with the package. Thus the package, which interconnects all the chips to form a particular function such as a central processor, is likely to set the limits on how far computers can evolve. Multichip packaging, which can relax these limits and also improve the reliability and cost at the systems level, is expected to be the basis of all advanced computers in the future. In addition, since this technology allows chips to be spaced more closely, in less space and with less weight, it has the added advantage of being useful in portable consumer electronics as well as in medical, aerospace, automotive and telecommunications products. The multichip technologies with which these applications can be addressed are many. They range from ceramics to polymer-metal thin films to printed wiring boards for interconnections; flip chip, TAB or wire bond for chip-to-substrate connections; and air or water cooling for the removal of heat.
Author: P. S. Ho
Publisher:
ISBN:
Category : Composite materials
Languages : en
Pages : 464
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Author:
Publisher:
ISBN:
Category : Laser beams
Languages : en
Pages : 540
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Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 160
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Book Description
