Electronic and Photonics Packaging, Electrical Systems Design and Photonics, and Nanotechnology--[2004] PDF Download
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Author:
Publisher: American Society of Mechanical Engineers
ISBN: 9780791847077
Category : Electronic packaging
Languages : en
Pages : 586
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Book Description
![Electronic and Photonics Packaging, Electrical Systems Design and Photonics, and Nanotechnology--[2004] PDF](https://books.google.com/books/content/images/frontcover/LtBmQgAACAAJ?fife=w80-h100)
Author:
Publisher: American Society of Mechanical Engineers
ISBN: 9780791847077
Category : Electronic packaging
Languages : en
Pages : 586
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Book Description
Author: Kaufui V. Wong
Publisher: CRC Press
ISBN: 135167157X
Category : Science
Languages : en
Pages : 475
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Book Description
Nanotechnology is a vibrant research area and a growing industry. The properties of nanoparticles and nanofluids are different from those of macroparticles and macrofluids because the physical and chemical properties are very dissimilar when dimensions are at the nanometer range. The first successes in using nanofluids for cooling were achieved and commercialized for automobiles; hence, this subarea is rather profitable. Other nanotechnology research and developmental areas are cutting edge. The core scientific principles of all nanotechnology applications are based in physics, chemistry, and engineering. Nanotechnology is not taught in most programs of engineering yet, and this book on nanotechnology and energy includes a discussion of introducing nanotechnology to the curricula of engineering students. The book also introduces significant current research topics in nanoscience and nanotechnology. It is a textbook for advanced undergraduate- and graduate-level students of nanotechnology, as well as a useful reference book for researchers and professional engineers working in the fields of macromolecular science, nanotechnology, and chemistry, especially those with an interest in energy and the environment, and the automotive industry.
Author:
Publisher: American Society of Mechanical Engineers
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 560
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Book Description
Author: Amit Bandyopadhyay
Publisher: CRC Press
ISBN: 1482223600
Category : Technology & Engineering
Languages : en
Pages : 404
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Book Description
The field of additive manufacturing has seen explosive growth in recent years due largely in part to renewed interest from the manufacturing sector. Conceptually, additive manufacturing, or industrial 3D printing, is a way to build parts without using any part-specific tooling or dies from the computer-aided design (CAD) file of the part. Today, mo
Author: Hwaiyu Geng
Publisher: John Wiley & Sons
ISBN: 1118436636
Category : Computers
Languages : en
Pages : 720
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Book Description
Provides the fundamentals, technologies, and best practices in designing, constructing and managing mission critical, energy efficient data centers Organizations in need of high-speed connectivity and nonstop systems operations depend upon data centers for a range of deployment solutions. A data center is a facility used to house computer systems and associated components, such as telecommunications and storage systems. It generally includes multiple power sources, redundant data communications connections, environmental controls (e.g., air conditioning, fire suppression) and security devices. With contributions from an international list of experts, The Data Center Handbook instructs readers to: Prepare strategic plan that includes location plan, site selection, roadmap and capacity planning Design and build "green" data centers, with mission critical and energy-efficient infrastructure Apply best practices to reduce energy consumption and carbon emissions Apply IT technologies such as cloud and virtualization Manage data centers in order to sustain operations with minimum costs Prepare and practice disaster reovery and business continuity plan The book imparts essential knowledge needed to implement data center design and construction, apply IT technologies, and continually improve data center operations.
Author: Faquir C Jain
Publisher: World Scientific
ISBN: 981128377X
Category : Technology & Engineering
Languages : en
Pages : 256
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Book Description
This unique compendium consists of peer-reviewed articles spanning from novel growth of materials for nanoelectronic and nanophotonic devices, electronic nose sensor array, bio-nano-systems, artificial intelligence/machine learning, and emerging technologies, to applications in each of these fields.Systems implementing additively manufactured RF devices for communication, packaging, remote sensing, compact multi-bit FETs and memories are also included.Plasmonic nanostructures with electrical connections have potential applications as new electro-optic devices. Quantum dot-based devices are discussed with regard to optical logic gates, mid-infrared photodetectors, gain and index tailored external cavity high power lasers.Contributed by eminent researchers, this useful reference text broadly illustrates relevant aspects of high-performance materials and emerging nanodevices for implementing high-speed electronic systems.
Author:
Publisher:
ISBN:
Category : Books
Languages : en
Pages : 1426
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Book Description
Every 3rd issue is a quarterly cumulation.
Author: Ron Ho
Publisher: Springer Science & Business Media
ISBN: 1441965882
Category : Technology & Engineering
Languages : en
Pages : 214
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Book Description
Wafer-scale integration has long been the dream of system designers. Instead of chopping a wafer into a few hundred or a few thousand chips, one would just connect the circuits on the entire wafer. What an enormous capability wafer-scale integration would offer: all those millions of circuits connected by high-speed on-chip wires. Unfortunately, the best known optical systems can provide suitably ?ne resolution only over an area much smaller than a whole wafer. There is no known way to pattern a whole wafer with transistors and wires small enough for modern circuits. Statistical defects present a ?rmer barrier to wafer-scale integration. Flaws appear regularly in integrated circuits; the larger the circuit area, the more probable there is a ?aw. If such ?aws were the result only of dust one might reduce their numbers, but ?aws are also the inevitable result of small scale. Each feature on a modern integrated circuit is carved out by only a small number of photons in the lithographic process. Each transistor gets its electrical properties from only a small number of impurity atoms in its tiny area. Inevitably, the quantized nature of light and the atomic nature of matter produce statistical variations in both the number of photons de?ning each tiny shape and the number of atoms providing the electrical behavior of tiny transistors. No known way exists to eliminate such statistical variation, nor may any be possible.
Author: James E. Morris
Publisher: Springer Science & Business Media
ISBN: 0387473262
Category : Technology & Engineering
Languages : en
Pages : 553
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Book Description
This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.
Author: Frank Suli
Publisher: Woodhead Publishing
ISBN: 008102391X
Category : Technology & Engineering
Languages : en
Pages : 490
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Book Description
Electronic Enclosures, Housings and Packages considers the problem of heat management for electronics from an encasement perspective. It addresses enclosures and their applications for industrial electronics, as well as LED lighting solutions for stationary and mobile markets. The book introduces fundamental concepts and defines dimensions of success in electrical enclosures. Other chapters discuss environmental considerations, shielding, standardization, materials selection, thermal management, product design principles, manufacturing techniques and sustainability. Final chapters focus on business fundamentals by outlining successful technical propositions and potential future directions.
