ELECTROCHEMICAL KINETICS AND TRANSPORT PROPERTIES OF PARTIAL PROCESSES IN ELECTROLESS COPPER PLATING (DIFFUSIVITY, RATE LAW, MECHANISM). PDF Download
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Author: RAMONA YUN-CHING YING
Publisher:
ISBN:
Category :
Languages : en
Pages : 250
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Book Description
Based on the rate laws obtained in this study and mechanisms proposed in the literature, mechanisms for formaldehyde oxidation and copper deposition were suggested.
Author: RAMONA YUN-CHING YING
Publisher:
ISBN:
Category :
Languages : en
Pages : 250
Get Book Here
Book Description
Based on the rate laws obtained in this study and mechanisms proposed in the literature, mechanisms for formaldehyde oxidation and copper deposition were suggested.
Author:
Publisher:
ISBN:
Category : Dissertations, Academic
Languages : en
Pages : 654
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Book Description
Author:
Publisher:
ISBN:
Category : Dissertation abstracts
Languages : en
Pages : 574
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Book Description
Author:
Publisher:
ISBN:
Category : Dissertations, Academic
Languages : en
Pages : 1116
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Book Description
Author: Kazuo Kondo
Publisher: Springer Science & Business Media
ISBN: 1461491762
Category : Science
Languages : en
Pages : 280
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Book Description
This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: • ULSI wiring material based upon copper nanowiring • Printed circuit boards • Stacked semiconductors • Through Silicon Via • Smooth copper foil for Lithium-Ion battery electrodes. This book is ideal for nanotechnologists, industry professionals, and practitioners.
Author: G. S. Mathad
Publisher: The Electrochemical Society
ISBN: 9781566773904
Category : Science
Languages : en
Pages : 290
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Book Description
Author: Eric R. Logan
Publisher:
ISBN:
Category : Copper plating
Languages : en
Pages : 156
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Book Description
Author:
Publisher:
ISBN:
Category : Metallurgy
Languages : en
Pages : 1306
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Book Description
Author: Bangwei Zhang
Publisher: Elsevier
ISBN: 0128027061
Category : Technology & Engineering
Languages : en
Pages : 774
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Book Description
Amorphous and Nano Alloys Electroless Depositions: Technology, Theory, Structure and Property describes the whole development and the most important subjects (technology, theory, structure and property) up to date of electroless plating (EP). The author concentrates on the fundamental scientific and academic problems (principle, mechanism and theory) in EP today.Based on the history of EP, this valuable reference describes lots of new EP processes, including electroless Fe based alloy system deposits, formation and theoretical description of electroless alloys, microscopic theory of electroless plating deposits, microscopic structures and surface morphology of electroless deposits, and weldability property of electroless deposits. - Focus on the fundamental scientific and academic problems (principles, mechanisms and theory) in electroless plating - The book gives a very good overview of the research and development in this field and each chapter is fully referenced - Detailed analysis and review of the current data, logically structured for ease of use
Author: Minghua Zhou
Publisher: Springer
ISBN: 9811064067
Category : Science
Languages : en
Pages : 437
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Book Description
This volume discusses the theoretical fundamentals and potential applications of the original electro-Fenton (EF) process and its most innovative and promising versions, all of which are classified as electrochemical advanced oxidation processes. It consists of 15 chapters that review the latest advances and trends, material selection, reaction and reactor modeling and EF scale-up. It particularly focuses on the applications of EF process in the treatment of toxic and persistent organic pollutants in water and soil, showing highly efficient removal for both lab-scale and pre-pilot setups. Indeed, the EF technology is now mature enough to be brought to market, and this collection of contributions from leading experts in the field constitutes a timely milestone for scientists and engineers.
