Author: Milton Ohring
Publisher: Elsevier
ISBN: 0080491782
Category : Technology & Engineering
Languages : en
Pages : 817
Book Description
This is the first book that can be considered a textbook on thin film science, complete with exercises at the end of each chapter. Ohring has contributed many highly regarded reference books to the AP list, including Reliability and Failure of Electronic Materials and the Engineering Science of Thin Films. The knowledge base is intended for science and engineering students in advanced undergraduate or first-year graduate level courses on thin films and scientists and engineers who are entering or require an overview of the field. Since 1992, when the book was first published, the field of thin films has expanded tremendously, especially with regard to technological applications. The second edition will bring the book up-to-date with regard to these advances. Most chapters have been greatly updated, and several new chapters have been added.
Materials Science of Thin Films
Author: Milton Ohring
Publisher: Elsevier
ISBN: 0080491782
Category : Technology & Engineering
Languages : en
Pages : 817
Book Description
This is the first book that can be considered a textbook on thin film science, complete with exercises at the end of each chapter. Ohring has contributed many highly regarded reference books to the AP list, including Reliability and Failure of Electronic Materials and the Engineering Science of Thin Films. The knowledge base is intended for science and engineering students in advanced undergraduate or first-year graduate level courses on thin films and scientists and engineers who are entering or require an overview of the field. Since 1992, when the book was first published, the field of thin films has expanded tremendously, especially with regard to technological applications. The second edition will bring the book up-to-date with regard to these advances. Most chapters have been greatly updated, and several new chapters have been added.
Publisher: Elsevier
ISBN: 0080491782
Category : Technology & Engineering
Languages : en
Pages : 817
Book Description
This is the first book that can be considered a textbook on thin film science, complete with exercises at the end of each chapter. Ohring has contributed many highly regarded reference books to the AP list, including Reliability and Failure of Electronic Materials and the Engineering Science of Thin Films. The knowledge base is intended for science and engineering students in advanced undergraduate or first-year graduate level courses on thin films and scientists and engineers who are entering or require an overview of the field. Since 1992, when the book was first published, the field of thin films has expanded tremendously, especially with regard to technological applications. The second edition will bring the book up-to-date with regard to these advances. Most chapters have been greatly updated, and several new chapters have been added.
Handbook of Thin Film Deposition
Author: Krishna Seshan
Publisher: William Andrew
ISBN: 0815517785
Category : Technology & Engineering
Languages : en
Pages : 659
Book Description
New second edition of the popular book on deposition (first edition by Klaus Schruegraf) for engineers, technicians, and plant personnel in the semiconductor and related industries. This book traces the technology behind the spectacular growth in the silicon semiconductor industry and the continued trend in miniaturization over the last 20 years. This growth has been fueled in large part by improved thin film deposition techniques and the development of highly specialized equipment to enable this deposition. The book includes much cutting-edge material. Entirely new chapters on contamination and contamination control describe the basics and the issues—as feature sizes shrink to sub-micron dimensions, cleanliness and particle elimination has to keep pace. A new chapter on metrology explains the growth of sophisticated, automatic tools capable of measuring thickness and spacing of sub-micron dimensions. The book also covers PVD, laser and e-beam assisted deposition, MBE, and ion beam methods to bring together all the physical vapor deposition techniques.Two entirely new areas receive full treatment: chemical mechanical polishing which helps attain the flatness that is required by modern lithography methods, and new materials used for interconnect dielectric materials, specifically organic polyimide materials.
Publisher: William Andrew
ISBN: 0815517785
Category : Technology & Engineering
Languages : en
Pages : 659
Book Description
New second edition of the popular book on deposition (first edition by Klaus Schruegraf) for engineers, technicians, and plant personnel in the semiconductor and related industries. This book traces the technology behind the spectacular growth in the silicon semiconductor industry and the continued trend in miniaturization over the last 20 years. This growth has been fueled in large part by improved thin film deposition techniques and the development of highly specialized equipment to enable this deposition. The book includes much cutting-edge material. Entirely new chapters on contamination and contamination control describe the basics and the issues—as feature sizes shrink to sub-micron dimensions, cleanliness and particle elimination has to keep pace. A new chapter on metrology explains the growth of sophisticated, automatic tools capable of measuring thickness and spacing of sub-micron dimensions. The book also covers PVD, laser and e-beam assisted deposition, MBE, and ion beam methods to bring together all the physical vapor deposition techniques.Two entirely new areas receive full treatment: chemical mechanical polishing which helps attain the flatness that is required by modern lithography methods, and new materials used for interconnect dielectric materials, specifically organic polyimide materials.
Processing of 'Wide Band Gap Semiconductors
Author: S. J. Pearton
Publisher: Cambridge University Press
ISBN: 0080946755
Category : Technology & Engineering
Languages : en
Pages : 593
Book Description
Wide bandgap semiconductors, made from such materials as GaN, SiC, diamond, and ZnSe, are undergoing a strong resurgence in recent years, principally because of their direct bandgaps, which give them a huge advantage over the indirect gap Sic As an example, more than 10 million blue LEDs using this technology are sold each month, and new, high brightness (15 lumens per watt), long-life white LEDs are under development with the potential to replace incandescent bulbs in many situations. This book provides readers with a broad overview of this rapidly expanding technology, bringing them up to speed on new discoveries and commercial applications. It provides specific technical applications of key processes such as laser diodes, LEDs, and very high temperature electronic controls on engines, focusing on doping, etching, oxidation passivation, growth techniques and more.
Publisher: Cambridge University Press
ISBN: 0080946755
Category : Technology & Engineering
Languages : en
Pages : 593
Book Description
Wide bandgap semiconductors, made from such materials as GaN, SiC, diamond, and ZnSe, are undergoing a strong resurgence in recent years, principally because of their direct bandgaps, which give them a huge advantage over the indirect gap Sic As an example, more than 10 million blue LEDs using this technology are sold each month, and new, high brightness (15 lumens per watt), long-life white LEDs are under development with the potential to replace incandescent bulbs in many situations. This book provides readers with a broad overview of this rapidly expanding technology, bringing them up to speed on new discoveries and commercial applications. It provides specific technical applications of key processes such as laser diodes, LEDs, and very high temperature electronic controls on engines, focusing on doping, etching, oxidation passivation, growth techniques and more.
Hermeticity of Electronic Packages
Author: Hal Greenhouse
Publisher: Elsevier
ISBN: 0815517882
Category : Technology & Engineering
Languages : en
Pages : 417
Book Description
This is a book about the integrity of sealed packages to resist foreign gases and liquids penetrating the seal or an opening (crack) in the package—especially critical to the reliability and longevity of electronics. The author explains how to predict the reliability and the longevity of the packages based on leak rate measurements and the assumptions of impurities. Non-specialists in particular will benefit from the author's long involvement in the technology. Hermeticity is a subject that demands practical experience, and solving one problem does not necessarily give one the background to solve another. Thus, the book provides a ready reference to help deal with day to day issues as they arise.The book gathers in a single volume a great many issues previously available only in journals—or only in the experience of working engineers. How to define the ""goodness"" of a seal? How is that seal measured? How does the integrity of the seal affect circuit reliability? What is the significance of the measured integrity of the seal? What is the relationship of Residual Gas Analysis and the seal integrity? The handbook answers these questions and more, providing an analysis of nearly 100 problems representative of the wide variety of challenges that actually occur in industry today.
Publisher: Elsevier
ISBN: 0815517882
Category : Technology & Engineering
Languages : en
Pages : 417
Book Description
This is a book about the integrity of sealed packages to resist foreign gases and liquids penetrating the seal or an opening (crack) in the package—especially critical to the reliability and longevity of electronics. The author explains how to predict the reliability and the longevity of the packages based on leak rate measurements and the assumptions of impurities. Non-specialists in particular will benefit from the author's long involvement in the technology. Hermeticity is a subject that demands practical experience, and solving one problem does not necessarily give one the background to solve another. Thus, the book provides a ready reference to help deal with day to day issues as they arise.The book gathers in a single volume a great many issues previously available only in journals—or only in the experience of working engineers. How to define the ""goodness"" of a seal? How is that seal measured? How does the integrity of the seal affect circuit reliability? What is the significance of the measured integrity of the seal? What is the relationship of Residual Gas Analysis and the seal integrity? The handbook answers these questions and more, providing an analysis of nearly 100 problems representative of the wide variety of challenges that actually occur in industry today.
Handbook of Chemical Vapor Deposition
Author: Hugh O. Pierson
Publisher: William Andrew
ISBN: 0815517432
Category : Technology & Engineering
Languages : en
Pages : 507
Book Description
Turn to this new second edition for an understanding of the latest advances in the chemical vapor deposition (CVD) process. CVD technology has recently grown at a rapid rate, and the number and scope of its applications and their impact on the market have increased considerably. The market is now estimated to be at least double that of a mere seven years ago when the first edition of this book was published. The second edition is an update with a considerably expanded and revised scope. Plasma CVD and metallo-organic CVD are two major factors in this rapid growth. Readers will find the latest data on both processes in this volume. Likewise, the book explains the growing importance of CVD in production of semiconductor and related applications.
Publisher: William Andrew
ISBN: 0815517432
Category : Technology & Engineering
Languages : en
Pages : 507
Book Description
Turn to this new second edition for an understanding of the latest advances in the chemical vapor deposition (CVD) process. CVD technology has recently grown at a rapid rate, and the number and scope of its applications and their impact on the market have increased considerably. The market is now estimated to be at least double that of a mere seven years ago when the first edition of this book was published. The second edition is an update with a considerably expanded and revised scope. Plasma CVD and metallo-organic CVD are two major factors in this rapid growth. Readers will find the latest data on both processes in this volume. Likewise, the book explains the growing importance of CVD in production of semiconductor and related applications.
CVD XV
Author: Mark Donald Allendorf
Publisher: The Electrochemical Society
ISBN: 9781566772785
Category : Technology & Engineering
Languages : en
Pages : 826
Book Description
Publisher: The Electrochemical Society
ISBN: 9781566772785
Category : Technology & Engineering
Languages : en
Pages : 826
Book Description
Adhesion Measurement of Films and Coatings
Author: K. L. MIttal
Publisher: Walter de Gruyter GmbH & Co KG
ISBN: 311231896X
Category : Language Arts & Disciplines
Languages : en
Pages : 468
Book Description
Publisher: Walter de Gruyter GmbH & Co KG
ISBN: 311231896X
Category : Language Arts & Disciplines
Languages : en
Pages : 468
Book Description
Adhesion Measurement of Films and Coatings
Author: Kash L. Mittal
Publisher: CRC Press
ISBN: 1466563427
Category : Science
Languages : en
Pages : 467
Book Description
This book chronicles the proceedings of the International Symposium on Adhesion Measurement of Films and Coatings, held in Boston. The articles in this book were previously published in three special issues of the Journal of Adhesion Science and Technology. Films and coatings are used for a variety of purposes and their adequate adhesion to the und
Publisher: CRC Press
ISBN: 1466563427
Category : Science
Languages : en
Pages : 467
Book Description
This book chronicles the proceedings of the International Symposium on Adhesion Measurement of Films and Coatings, held in Boston. The articles in this book were previously published in three special issues of the Journal of Adhesion Science and Technology. Films and coatings are used for a variety of purposes and their adequate adhesion to the und
Compound Semiconductor Power Transistors and
Author: Electrochemical Society. Meeting
Publisher: The Electrochemical Society
ISBN: 9781566772228
Category : Technology & Engineering
Languages : en
Pages : 338
Book Description
Publisher: The Electrochemical Society
ISBN: 9781566772228
Category : Technology & Engineering
Languages : en
Pages : 338
Book Description
Numerical Mathematics and Advanced Applications 2011
Author: Andrea Cangiani
Publisher: Springer Science & Business Media
ISBN: 3642331343
Category : Mathematics
Languages : en
Pages : 811
Book Description
The European Conferences on Numerical Mathematics and Advanced Applications (ENUMATH) are a series of conferences held every two years to provide a forum for discussion of new trends in numerical mathematics and challenging scientific and industrial applications at the highest level of international expertise. ENUMATH 2011 was hosted by the University of Leicester (UK) from the 5th to 9th September 2011. This proceedings volume contains more than 90 papers by speakers of the conference and gives an overview of recent developments in scientific computing, numerical analysis, and practical use of modern numerical techniques and algorithms in various applications. New results on finite element methods, multiscale methods, numerical linear algebra, and finite difference schemes are presented. A range of applications include computational problems from fluid dynamics, materials, image processing, and molecular dynamics.
Publisher: Springer Science & Business Media
ISBN: 3642331343
Category : Mathematics
Languages : en
Pages : 811
Book Description
The European Conferences on Numerical Mathematics and Advanced Applications (ENUMATH) are a series of conferences held every two years to provide a forum for discussion of new trends in numerical mathematics and challenging scientific and industrial applications at the highest level of international expertise. ENUMATH 2011 was hosted by the University of Leicester (UK) from the 5th to 9th September 2011. This proceedings volume contains more than 90 papers by speakers of the conference and gives an overview of recent developments in scientific computing, numerical analysis, and practical use of modern numerical techniques and algorithms in various applications. New results on finite element methods, multiscale methods, numerical linear algebra, and finite difference schemes are presented. A range of applications include computational problems from fluid dynamics, materials, image processing, and molecular dynamics.