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Author: Marcello Coppola
Publisher: CRC Press
ISBN: 1420044729
Category : Technology & Engineering
Languages : en
Pages : 292
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Book Description
Streamlined Design Solutions Specifically for NoC To solve critical network-on-chip (NoC) architecture and design problems related to structure, performance and modularity, engineers generally rely on guidance from the abundance of literature about better-understood system-level interconnection networks. However, on-chip networks present several distinct challenges that require novel and specialized solutions not found in the tried-and-true system-level techniques. A Balanced Analysis of NoC Architecture As the first detailed description of the commercial Spidergon STNoC architecture, Design of Cost-Efficient Interconnect Processing Units: Spidergon STNoC examines the highly regarded, cost-cutting technology that is set to replace well-known shared bus architectures, such as STBus, for demanding multiprocessor system-on-chip (SoC) applications. Employing a balanced, well-organized structure, simple teaching methods, numerous illustrations, and easy-to-understand examples, the authors explain: how the SoC and NoC technology works why developers designed it the way they did the system-level design methodology and tools used to configure the Spidergon STNoC architecture differences in cost structure between NoCs and system-level networks From professionals in computer sciences, electrical engineering, and other related fields, to semiconductor vendors and investors – all readers will appreciate the encyclopedic treatment of background NoC information ranging from CMPs to the basics of interconnection networks. The text introduces innovative system-level design methodology and tools for efficient design space exploration and topology selection. It also provides a wealth of key theoretical and practical MPSoC and NoC topics, such as technological deep sub-micron effects, homogeneous and heterogeneous processor architectures, multicore SoC, interconnect processing units, generic NoC components, and embeddings of common communication patterns.
Author: Marcello Coppola
Publisher: CRC Press
ISBN: 1420044729
Category : Technology & Engineering
Languages : en
Pages : 292
Get Book Here
Book Description
Streamlined Design Solutions Specifically for NoC To solve critical network-on-chip (NoC) architecture and design problems related to structure, performance and modularity, engineers generally rely on guidance from the abundance of literature about better-understood system-level interconnection networks. However, on-chip networks present several distinct challenges that require novel and specialized solutions not found in the tried-and-true system-level techniques. A Balanced Analysis of NoC Architecture As the first detailed description of the commercial Spidergon STNoC architecture, Design of Cost-Efficient Interconnect Processing Units: Spidergon STNoC examines the highly regarded, cost-cutting technology that is set to replace well-known shared bus architectures, such as STBus, for demanding multiprocessor system-on-chip (SoC) applications. Employing a balanced, well-organized structure, simple teaching methods, numerous illustrations, and easy-to-understand examples, the authors explain: how the SoC and NoC technology works why developers designed it the way they did the system-level design methodology and tools used to configure the Spidergon STNoC architecture differences in cost structure between NoCs and system-level networks From professionals in computer sciences, electrical engineering, and other related fields, to semiconductor vendors and investors – all readers will appreciate the encyclopedic treatment of background NoC information ranging from CMPs to the basics of interconnection networks. The text introduces innovative system-level design methodology and tools for efficient design space exploration and topology selection. It also provides a wealth of key theoretical and practical MPSoC and NoC topics, such as technological deep sub-micron effects, homogeneous and heterogeneous processor architectures, multicore SoC, interconnect processing units, generic NoC components, and embeddings of common communication patterns.
Author: Michael Hübner
Publisher: Springer Science & Business Media
ISBN: 1441964606
Category : Technology & Engineering
Languages : en
Pages : 268
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Book Description
The purpose of this book is to evaluate strategies for future system design in multiprocessor system-on-chip (MPSoC) architectures. Both hardware design and integration of new development tools will be discussed. Novel trends in MPSoC design, combined with reconfigurable architectures are a main topic of concern. The main emphasis is on architectures, design-flow, tool-development, applications and system design.
Author: Ovidiu Vermesan
Publisher: CRC Press
ISBN: 1000881911
Category : Computers
Languages : en
Pages : 143
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Book Description
Recent technological developments in sensors, edge computing, connectivity, and artificial intelligence (AI) technologies have accelerated the integration of data analysis based on embedded AI capabilities into resource-constrained, energy-efficient hardware devices for processing information at the network edge. Embedded AI combines embedded machine learning (ML) and deep learning (DL) based on neural networks (NN) architectures such as convolutional NN (CNN), or spiking neural network (SNN) and algorithms on edge devices and implements edge computing capabilities that enable data processing and analysis without optimised connectivity and integration, allowing users to access data from various sources. Embedded AI efficiently implements edge computing and AI processes on resource-constrained devices to mitigate downtime and service latency, and it successfully merges AI processes as a pivotal component in edge computing and embedded system devices. Embedded AI also enables users to reduce costs, communication, and processing time by assembling data and by supporting user requirements without the need for continuous interaction with physical locations. This book provides an overview of the latest research results and activities in industrial embedded AI technologies and applications, based on close cooperation between three large-scale ECSEL JU projects, AI4DI, ANDANTE, and TEMPO. The book’s content targets researchers, designers, developers, academics, post-graduate students and practitioners seeking recent research on embedded AI. It combines the latest developments in embedded AI, addressing methodologies, tools, and techniques to offer insight into technological trends and their use across different industries.
Author: Georgios Kornaros
Publisher: CRC Press
ISBN: 1439811628
Category : Computers
Languages : en
Pages : 502
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Book Description
Details a real-world product that applies a cutting-edge multi-core architecture Increasingly demanding modern applications—such as those used in telecommunications networking and real-time processing of audio, video, and multimedia streams—require multiple processors to achieve computational performance at the rate of a few giga-operations per second. This necessity for speed and manageable power consumption makes it likely that the next generation of embedded processing systems will include hundreds of cores, while being increasingly programmable, blending processors and configurable hardware in a power-efficient manner. Multi-Core Embedded Systems presents a variety of perspectives that elucidate the technical challenges associated with such increased integration of homogeneous (processors) and heterogeneous multiple cores. It offers an analysis that industry engineers and professionals will need to understand the physical details of both software and hardware in embedded architectures, as well as their limitations and potential for future growth. Discusses the available programming models spread across different abstraction levels The book begins with an overview of the evolution of multiprocessor architectures for embedded applications and discusses techniques for autonomous power management of system-level parameters. It addresses the use of existing open-source (and free) tools originating from several application domains—such as traffic modeling, graph theory, parallel computing and network simulation. In addition, the authors cover other important topics associated with multi-core embedded systems, such as: Architectures and interconnects Embedded design methodologies Mapping of applications
Author: Massimo Conti
Publisher: Springer Science & Business Media
ISBN: 9400706383
Category : Technology & Engineering
Languages : en
Pages : 303
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Book Description
Embedded systems have an increasing importance in our everyday lives. The growing complexity of embedded systems and the emerging trend to interconnections between them lead to new challenges. Intelligent solutions are necessary to overcome these challenges and to provide reliable and secure systems to the customer under a strict time and financial budget. Solutions on Embedded Systems documents results of several innovative approaches that provide intelligent solutions in embedded systems. The objective is to present mature approaches, to provide detailed information on the implementation and to discuss the results obtained.
Author: Georgios Keramidas
Publisher: Springer
ISBN: 3319423045
Category : Technology & Engineering
Languages : en
Pages : 382
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Book Description
This book serves as a single-source reference to the state-of-the-art in Internet of Things (IoT) platforms, services, tools, programming languages, and applications. In particular, the authors focus on IoT-related requirements such as low-power, time-to-market, connectivity, reliability, interoperability, security, and privacy. Authors discuss the question of whether we need new IoT standardization bodies or initiatives, toward a fully connected, cyber-physical world. Coverage includes the research outcomes of several, current European projects related to IoT platforms, services, APIs, tools, and applications.
Author: Ovidiu Vermesan
Publisher: CRC Press
ISBN: 1000794318
Category : Medical
Languages : en
Pages : 435
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Book Description
This book provides in-depth insights into use cases implementing artificial intelligence (AI) applications at the edge. It covers new ideas, concepts, research, and innovation to enable the development and deployment of AI, the industrial internet of things (IIoT), edge computing, and digital twin technologies in industrial environments. The work is based on the research results and activities of the AI4DI project, including an overview of industrial use cases, research, technological innovation, validation, and deployment. This book’s sections build on the research, development, and innovative ideas elaborated for applications in five industries: automotive, semiconductor, industrial machinery, food and beverage, and transportation. The articles included under each of these five industrial sectors discuss AI-based methods, techniques, models, algorithms, and supporting technologies, such as IIoT, edge computing, digital twins, collaborative robots, silicon-born AI circuit concepts, neuromorphic architectures, and augmented intelligence, that are anticipating the development of Industry 5.0. Automotive applications cover use cases addressing AI-based solutions for inbound logistics and assembly process optimisation, autonomous reconfigurable battery systems, virtual AI training platforms for robot learning, autonomous mobile robotic agents, and predictive maintenance for machines on the level of a digital twin. AI-based technologies and applications in the semiconductor manufacturing industry address use cases related to AI-based failure modes and effects analysis assistants, neural networks for predicting critical 3D dimensions in MEMS inertial sensors, machine vision systems developed in the wafer inspection production line, semiconductor wafer fault classifications, automatic inspection of scanning electron microscope cross-section images for technology verification, anomaly detection on wire bond process trace data, and optical inspection. The use cases presented for machinery and industrial equipment industry applications cover topics related to wood machinery, with the perception of the surrounding environment and intelligent robot applications. AI, IIoT, and robotics solutions are highlighted for the food and beverage industry, presenting use cases addressing novel AI-based environmental monitoring; autonomous environment-aware, quality control systems for Champagne production; and production process optimisation and predictive maintenance for soybeans manufacturing. For the transportation sector, the use cases presented cover the mobility-as-a-service development of AI-based fleet management for supporting multimodal transport. This book highlights the significant technological challenges that AI application developments in industrial sectors are facing, presenting several research challenges and open issues that should guide future development for evolution towards an environment-friendly Industry 5.0. The challenges presented for AI-based applications in industrial environments include issues related to complexity, multidisciplinary and heterogeneity, convergence of AI with other technologies, energy consumption and efficiency, knowledge acquisition, reasoning with limited data, fusion of heterogeneous data, availability of reliable data sets, verification, validation, and testing for decision-making processes.
Author: Renato Rimolo-Donadio
Publisher: Logos Verlag Berlin GmbH
ISBN: 3832527761
Category : Science
Languages : en
Pages : 226
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Book Description
This thesis deals with the development of semi-analytical models for the electrical behavior of vias and traces in chip packages and printed circuit boards. A framework for automated simulation of multilayer structures is also proposed. The validation and evaluation of the models are thoroughly addressed with several test structures and application studies. It is shown that the models can provide good results up to 40 GHz, whereas the numerical efficiency is at least two orders of magnitude higher in comparison to general-purpose numerical methods.
Author: Konstantinos Tatas
Publisher: Springer Science & Business Media
ISBN: 1461442745
Category : Technology & Engineering
Languages : en
Pages : 271
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Book Description
This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies.
Author: Neeraj Kumar Goyal
Publisher: John Wiley & Sons
ISBN: 1119620597
Category : Computers
Languages : en
Pages : 240
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Book Description
This book presents novel and efficient tools, techniques and approaches for reliability evaluation, reliability analysis, and design of reliable communication networks using graph theoretic concepts. In recent years, human beings have become largely dependent on communication networks, such as computer communication networks, telecommunication networks, mobile switching networks etc., for their day-to-day activities. In today's world, humans and critical machines depend on these communication networks to work properly. Failure of these communication networks can result in situations where people may find themselves isolated, helpless and exposed to hazards. It is a fact that every component or system can fail and its failure probability increases with size and complexity. The main objective of this book is to devize approaches for reliability modeling and evaluation of such complex networks. Such evaluation helps to understand which network can give us better reliability by their design. New designs of fault-tolerant interconnection network layouts are proposed, which are capable of providing high reliability through path redundancy and fault tolerance through reduction of common elements in paths. This book covers the reliability evaluation of various network topologies considering multiple reliability performance parameters (two terminal reliability, broadcast reliability, all terminal reliability, and multiple sources to multiple destinations reliability).
