Design, Fabrication and Testing of High-performance Capacitive Microaccelerometers PDF Download
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Author: Arvind Sanjiva Salian
Publisher:
ISBN:
Category :
Languages : en
Pages : 406
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Author: Arvind Sanjiva Salian
Publisher:
ISBN:
Category :
Languages : en
Pages : 406
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Author: Fatemeh Edalatfar
Publisher:
ISBN:
Category :
Languages : en
Pages : 125
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This thesis presents the development of capacitive high-performance accelerometers for sonar wave detection. Two different designs of in-plane and out-of-plane accelerometers are developed, micro-fabricated, and experimentally tested.The out-of-plane accelerometer is designed based on a continuous membrane suspension element. In comparison to beam-type suspension elements, the new design provides uniform displacement of the proof mass, lower cross-axis sensitivity, and lower stress concentration in suspension elements which could result in higher yield in the fabrication process. The out-of-plane accelerometer is fabricated using a novel microfabrication method which facilitates developing continuous membrane type suspension elements and full wafer thick proof mass for accelerometers. The designed accelerometer is fabricated on a silicon-on-insulator wafer with an 8 μm device layer, 1.5 μm buried-oxide layer, and 500 μm handle wafer. The developed accelerometer is proven to have resonance frequency of 5.2 kHz, sensitivity of ~0.9 pF/g, mechanical noise equivalent acceleration of less than 450 ng/√Hz, and an open loop dynamic range of higher than 130 dB while operating at atmospheric pressure.The in-plane single-axis accelerometer is designed based on a proposed mode-tuned modified structure. In this modified structure, the proof mass is substituted with a moving frame which also provides the area for increasing the number of sensing electrodes. This substitution contributes to widening the bandwidth of the accelerometer by locating the anchors and elastic elements both inside and outside of the moving frame. The designed accelerometer is fabricated on a silicon-on-insulator wafer with a 100μm device layer and high aspect ratio capacitive gaps of ~2 μm. The sensitivity of the accelerometer is measured as ~0.7 pF/g with the total noise equivalent acceleration of less than 500 ng/√Hz in the flat band region of the bandwidth. The resonance frequency of the devices is 4.2 kHz while maintaining a linearity of better than 0.7%. The open loop dynamic range of the accelerometer, while operating at atmospheric pressure, is higher than 135 dB, and the cross-axis sensitivity is less than -30 dB.
Author: Hamed Farahani
Publisher:
ISBN: 9780494527009
Category :
Languages : en
Pages : 352
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This thesis reports the design and fabrication of MEMS based capacitive accelerometers for detection of defective equipment in automotive applications using PolyMUMPs fabrication technology. A design was developed denoting further improvements in accelerometer topologies based on the SOIMUMPs fabrication process. This research obtained accelerometers with sensitivities of 521 fF/mum and 0% cross-axis sensitivities. A prototype with 5 fF/mum sensitivity, 2.05% nonlinearity and an estimated effective bandwidth of 1.858 kHz for 1% response error with mechanical resolutions of 19.3 mug/√Hz was developed. A new approach to accelerometers configuration analysis is introduced, and future design based on this approach was developed to detect accelerations less than +/-25.9 mg with mechanical resolution of 3.45 mug for 1 kHz bandwidth and a readout circuitry of minimum accuracy of +/-4 fF. This work focuses on developing high performance accelerometers and exploring MEMS technology with contributions made to obtain higher performance devices from the fabrication processes.
Author: Md Sohel Mahmood
Publisher:
ISBN:
Category : Accelerometers
Languages : en
Pages : 156
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The work presented in this dissertation describes the design, fabrication and characterization of a Micro Electro Mechanical System (MEMS) capacitive accelerometer on a flexible substrate. To facilitate the bending of the accelerometers and make them mountable on a curved surface, polyimide was used as a flexible substrate. Considering its high glass transition temperature and low thermal expansion coefficient, PI5878G was chosen as the underlying flexible substrate. Three different sizes of accelerometers were designed in CoventorWare® software which utilizes Finite Element Method (FEM) to numerically perform various analyses. Capacitance simulation under acceleration, modal analysis, stress and pull-in study were performed in CoventorWare®. A double layer UV-LIGA technique was deployed to electroplate the proof mass for increased sensitivity. The proof mass of the accelerometers was perforated to lower the damping force as well as to facilitate the ashing process of the underlying sacrificial layer. Three different sizes of accelerometers were fabricated and subsequently characterized. The largest accelerometer demonstrated a sensitivity of 187 fF/g at its resonant frequency of 800 Hz. It also showed excellent noise performance with a signal to noise ratio (SNR) of 100:1. The accelerometers were also placed on curved surfaces having radii of 3.8 cm, 2.5 cm and 2.0 cm for flexibility analysis. The sensitivity of the largest device was obtained to be 168 fF/g on a curved surface of 2.0 cm radius. The radii of robotic index and thumb fingertips are 1.0 cm and 3.5 cm, respectively. Therefore, these accelerometers are fully compatible with robotics as well as prosthetics. The accelerometers were later encapsulated by Kapton® superstrate in vacuum environment. Kapton® is a polyimide film which possesses similar glass transition temperature and thermal expansion coefficient to that of the underlying substrate PI5878G. The thickness of the superstrate was optimized to place the intermediate accelerometer on a plane of zero stress. The Kapton® films were pre-etched before bonding to the device wafer, thus avoiding spin-coating a photoresist layer at high rpm and possibly damaging the already released micro-accelerometers in the device wafer. The packaged accelerometers were characterized in the same way the open accelerometers were characterized on both flat and curved surfaces. After encapsulation, the sensitivity of the largest accelerometer on a flat and a curved surface with 2.0 cm radius were obtained to be 195 fF/g and 174 fF/f, respectively. All three accelerometers demonstrated outstanding noise performance after vacuum packaging with an SNR of 100:1. Further analysis showed that the contribution from the readout circuitry is the most dominant noise component followed by the Brownian noise of the accelerometers. The developed stresses in different layers of the accelerometers upon bending the substrates were analyzed. The stresses in all cases were below the yield strength of the respective layer materials. AlN cantilevers as tactile sensors were also fabricated and characterized on a flexible substrate. Ti was utilized as the bottom and the top electrode for its smaller lattice mismatch to AlN compared to Pt and Al. The piezoelectric layer of AlN was annealed after sputtering which resulted in excellent crystalline orientation. The XRD peak corresponding to AlN (002) plane was obtained at 36.54o. The fabricated AlN cantilevers were capable of sensing pressures from 100 kPa to 850 kPa which includes soft touching of human index finger and grasping of an object. The sensitivities of the cantilevers were between 1.90 × 10-4 V/kPa and 2.04 × 10-4 V/kPa. The stresses inside the AlN and Ti layer, developed upon full bending, were below the yield strength of the respective layer materials.
Author: Ankesh Todi
Publisher:
ISBN:
Category :
Languages : en
Pages : 0
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In this thesis, a high-frequency resonant accelerometer is presented. This novel sensor was designed to operate in 10’s of MHz frequency range utilizing an out-of-plane capacitive mechanism for acceleration sensing. The sensor is comprised of a 2-port RF MEMS piezoelectric resonator, operating at 27MHz, and a Capacitive Mass-spring structure. One of the resonator ports is electrically connected to the variable capacitor in the mass-spring structure. The acceleration is measured utilizing a piezoelectric stiffening mechanism, where a change in the termination impedance of a piezoelectric resonant body would result in a shift in the resonance frequency of the resonator. The acceleration is extracted from the frequency-modulated output signal of the resonator. The sensors were fabricated on a silicon-on-insulator wafer coated with a thin film of sputtered aluminum nitride as the piezoelectric transducer. Initial test results show a ~600Hz shift in resonance frequency in response to ±1g of acceleration (~300Hz/g sensitivity).
Author: Haluk Kulah
Publisher:
ISBN:
Category :
Languages : en
Pages : 328
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Author: Saroj Aryal
Publisher:
ISBN:
Category :
Languages : en
Pages : 142
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Author: Dongning Zhao
Publisher:
ISBN:
Category : Accelerometers
Languages : en
Pages :
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The high-performance accelerometers with micro-gravity resolution and large dynamic range at very low frequencies are not only used in GPS-augmented inertial navigation, monitoring of aircrafts and space station, but also used in monitoring wind turbines for green energy. This dissertation presents the design and development of a mixed-signal, low-noise, and fourth-order sigma-delta interface circuit for the MEMS capacitive micro-gravity accelerometer. A fully-differential switched-capacitor (SC) amplifier architecture is developed with the low-frequency noise reduction through the integration of chopper-stabilization technique with lateral BJT at input stage. The effectiveness of different noise reduction techniques is also compared and verified. The application of fourth-order SC sigma-delta modulation concept to the inertial-grade accelerometer is to achieve the benefits of the digitization of the accelerometer output without compromising the resolution of the analog front-end. This open-loop interface provides 1-bit digital output stream and has the versatility of interfacing sensors with different sensitivities while maintaining minimum power dissipation and maximum dynamic range. The micromechanical accelerometers are fabricated in thick silicon-on-insulator (SOI) substrates. The accelerometer operates in air and is designed for non-peaking response with a bandwidth of 500 Hz.
Author: Patty Pei-Ling Chang-Chien
Publisher:
ISBN:
Category : Electrical engineering
Languages : en
Pages : 422
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Author:
Publisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 980
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