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Author: Peter Marwedel
Publisher:
ISBN: 9780769505381
Category : Computer-aided design
Languages : en
Pages : 770
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Book Description
Author: Peter Marwedel
Publisher:
ISBN: 9780769505381
Category : Computer-aided design
Languages : en
Pages : 770
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Book Description
Author: Carlos Delgado Kloos
Publisher:
ISBN: 9780769514710
Category :
Languages : en
Pages : 1147
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Book Description
Author: Anirban Sengupta
Publisher: Springer
ISBN: 9813297670
Category : Computers
Languages : en
Pages : 775
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Book Description
This book constitutes the refereed proceedings of the 23st International Symposium on VLSI Design and Test, VDAT 2019, held in Indore, India, in July 2019. The 63 full papers were carefully reviewed and selected from 199 submissions. The papers are organized in topical sections named: analog and mixed signal design; computing architecture and security; hardware design and optimization; low power VLSI and memory design; device modelling; and hardware implementation.
Author: Dominique Borrione
Publisher: IEEE
ISBN: 9780769500782
Category : Computers
Languages : en
Pages : 798
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Book Description
This collection of essays provides a forum for the exchange of information on relevant issues and topics including: sequential circuits; architecture issues in low power design; mixed signal characterization and test; and testing regular structures and delay faults.
Author:
Publisher:
ISBN:
Category : Computer-aided design
Languages : en
Pages :
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Book Description
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 313
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Book Description
Author: Design, Automation, and Test in Europe Conference and Exhibition
Publisher:
ISBN:
Category : Computer-aided design
Languages : en
Pages :
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Book Description
Author: Luciano Lavagno
Publisher: CRC Press
ISBN: 1482254638
Category : Technology & Engineering
Languages : en
Pages : 644
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Book Description
The first of two volumes in the Electronic Design Automation for Integrated Circuits Handbook, Second Edition, Electronic Design Automation for IC System Design, Verification, and Testing thoroughly examines system-level design, microarchitectural design, logic verification, and testing. Chapters contributed by leading experts authoritatively discuss processor modeling and design tools, using performance metrics to select microprocessor cores for integrated circuit (IC) designs, design and verification languages, digital simulation, hardware acceleration and emulation, and much more. New to This Edition: Major updates appearing in the initial phases of the design flow, where the level of abstraction keeps rising to support more functionality with lower non-recurring engineering (NRE) costs Significant revisions reflected in the final phases of the design flow, where the complexity due to smaller and smaller geometries is compounded by the slow progress of shorter wavelength lithography New coverage of cutting-edge applications and approaches realized in the decade since publication of the previous edition—these are illustrated by new chapters on high-level synthesis, system-on-chip (SoC) block-based design, and back-annotating system-level models Offering improved depth and modernity, Electronic Design Automation for IC System Design, Verification, and Testing provides a valuable, state-of-the-art reference for electronic design automation (EDA) students, researchers, and professionals.
Author: Gabrièle Saucier
Publisher:
ISBN:
Category :
Languages : en
Pages :
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Book Description
Author: Rohit Sharma
Publisher: CRC Press
ISBN: 1351831593
Category : Technology & Engineering
Languages : en
Pages : 328
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Book Description
Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.
