Copper Interconnects, New Contact Metallurgies/structures, and Low-k Interlevel Dielectrics PDF Download
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Author:
Publisher: The Electrochemical Society
ISBN: 9781566773799
Category : Electronic packaging
Languages : en
Pages : 364
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Book Description
Author:
Publisher: The Electrochemical Society
ISBN: 9781566773799
Category : Electronic packaging
Languages : en
Pages : 364
Get Book Here
Book Description
Author: G. S. Mathad
Publisher: The Electrochemical Society
ISBN: 9781566773904
Category : Science
Languages : en
Pages : 290
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Book Description
Author: G. Mathad
Publisher: The Electrochemical Society
ISBN: 1566776937
Category : Science
Languages : en
Pages : 71
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Book Description
The papers included in this issue of ECS Transactions were originally presented in the symposium ¿Low k Inter-Level Metal Dielectrics and New Contact and Barrier Metallurgies/Structures¿, held during the PRiME 2008 joint international meeting of The Electrochemical Society and The Electrochemical Society of Japan, with the technical cosponsorship of the Japan Society of Applied Physics, the Korean Electrochemical Society, the Electrochemistry Division of the Royal Australian Chemical Institute, and the Chinese Society of Electrochemistry. This meeting was held in Honolulu, Hawaii, from October 12 to 17, 2008.
Author: G. S. Mathad
Publisher: The Electrochemical Society
ISBN: 9781566772945
Category : Science
Languages : en
Pages : 262
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Author: Yosi Shacham-Diamand
Publisher: Springer Science & Business Media
ISBN: 0387958681
Category : Science
Languages : en
Pages : 545
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Book Description
In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.
Author: R. L. Opila
Publisher: The Electrochemical Society
ISBN: 9781566772938
Category : Technology & Engineering
Languages : en
Pages : 350
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Book Description
Author: Jerzy Rużyłło
Publisher: The Electrochemical Society
ISBN: 9781566774116
Category : Technology & Engineering
Languages : en
Pages : 452
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Author:
Publisher:
ISBN:
Category : Semiconductor wafers
Languages : en
Pages : 458
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Book Description
Author: Hariklia Deligianni
Publisher: The Electrochemical Society
ISBN: 9781566774727
Category : Computers
Languages : en
Pages : 494
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Book Description
Author: Electrochemical Society
Publisher:
ISBN:
Category : Electrochemistry
Languages : en
Pages : 1020
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Book Description
