Author:
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ISBN:
Category :
Languages : en
Pages :
Book Description
Conference on Thermal Conductivity ; 20
Author:
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ISBN:
Category :
Languages : en
Pages :
Book Description
Publisher:
ISBN:
Category :
Languages : en
Pages :
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Thermal Conductivity 20
Author: J.R., Jr. Thomas
Publisher: Springer
ISBN: 9781461280699
Category : Technology & Engineering
Languages : en
Pages : 440
Book Description
The International Thermal Conductivity Conference was started in 1961 with the initiative of Mr. Charles F. Lucks and grew out of the needs of researchers in the field. The Conferences were held annually from 1961 to 1973 and have been held biennially since 1975 when our Center for Informa tion and Numerical Data Analysis and Synthesis (CINDAS) of Purdue University became the Permanent Sponsor of the Conferences. -These Conferences provide a broadly based forum for researchers actively working on the thermal con ductivity and closely related properties to convene on a regular basis to exchange their ideas and experiences and report their findings and results. The Conferences have been self-perpetuating and are an example of how a technical community with a common purpose can transcend the invisible. arti ficial barriers between disciplines and gather together in increasing num bers without the need of national publicity and continuing funding support. when they see something worthwhile going on. It is believed that this ser ies of Conferences not only will grow stronger. but will set an example for researchers in other fields on how to jointly attack their own problem areas.
Publisher: Springer
ISBN: 9781461280699
Category : Technology & Engineering
Languages : en
Pages : 440
Book Description
The International Thermal Conductivity Conference was started in 1961 with the initiative of Mr. Charles F. Lucks and grew out of the needs of researchers in the field. The Conferences were held annually from 1961 to 1973 and have been held biennially since 1975 when our Center for Informa tion and Numerical Data Analysis and Synthesis (CINDAS) of Purdue University became the Permanent Sponsor of the Conferences. -These Conferences provide a broadly based forum for researchers actively working on the thermal con ductivity and closely related properties to convene on a regular basis to exchange their ideas and experiences and report their findings and results. The Conferences have been self-perpetuating and are an example of how a technical community with a common purpose can transcend the invisible. arti ficial barriers between disciplines and gather together in increasing num bers without the need of national publicity and continuing funding support. when they see something worthwhile going on. It is believed that this ser ies of Conferences not only will grow stronger. but will set an example for researchers in other fields on how to jointly attack their own problem areas.
Thermal Conductivity 20
Author: D. P. H. Hasselman
Publisher: Plenum Publishing Corporation
ISBN: 9780306430978
Category : Science
Languages : en
Pages : 439
Book Description
Proceedings of the 20th International Thermal Conductivity Conference held in Blacksburg, Va. Oct. 1987. Over 40 papers present current reviews of international research. General topics discussed include insulation, metallic materials, high temperature materials, fluids, other materials and effects, methods, and composites. Annotation copyright Boo
Publisher: Plenum Publishing Corporation
ISBN: 9780306430978
Category : Science
Languages : en
Pages : 439
Book Description
Proceedings of the 20th International Thermal Conductivity Conference held in Blacksburg, Va. Oct. 1987. Over 40 papers present current reviews of international research. General topics discussed include insulation, metallic materials, high temperature materials, fluids, other materials and effects, methods, and composites. Annotation copyright Boo
Proceedings of the Sixth Conference on Thermal Conductivity, October 19-20-21, 1966
Author: Merrill Loren Minges
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 1181
Book Description
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 1181
Book Description
Thermal Conductivity 20
Author: J.R., Jr. Thomas
Publisher: Springer Science & Business Media
ISBN: 1461307619
Category : Technology & Engineering
Languages : en
Pages : 422
Book Description
The International Thermal Conductivity Conference was started in 1961 with the initiative of Mr. Charles F. Lucks and grew out of the needs of researchers in the field. The Conferences were held annually from 1961 to 1973 and have been held biennially since 1975 when our Center for Informa tion and Numerical Data Analysis and Synthesis (CINDAS) of Purdue University became the Permanent Sponsor of the Conferences. -These Conferences provide a broadly based forum for researchers actively working on the thermal con ductivity and closely related properties to convene on a regular basis to exchange their ideas and experiences and report their findings and results. The Conferences have been self-perpetuating and are an example of how a technical community with a common purpose can transcend the invisible. arti ficial barriers between disciplines and gather together in increasing num bers without the need of national publicity and continuing funding support. when they see something worthwhile going on. It is believed that this ser ies of Conferences not only will grow stronger. but will set an example for researchers in other fields on how to jointly attack their own problem areas.
Publisher: Springer Science & Business Media
ISBN: 1461307619
Category : Technology & Engineering
Languages : en
Pages : 422
Book Description
The International Thermal Conductivity Conference was started in 1961 with the initiative of Mr. Charles F. Lucks and grew out of the needs of researchers in the field. The Conferences were held annually from 1961 to 1973 and have been held biennially since 1975 when our Center for Informa tion and Numerical Data Analysis and Synthesis (CINDAS) of Purdue University became the Permanent Sponsor of the Conferences. -These Conferences provide a broadly based forum for researchers actively working on the thermal con ductivity and closely related properties to convene on a regular basis to exchange their ideas and experiences and report their findings and results. The Conferences have been self-perpetuating and are an example of how a technical community with a common purpose can transcend the invisible. arti ficial barriers between disciplines and gather together in increasing num bers without the need of national publicity and continuing funding support. when they see something worthwhile going on. It is believed that this ser ies of Conferences not only will grow stronger. but will set an example for researchers in other fields on how to jointly attack their own problem areas.
The Fifth Conference on Thermal Conductivity
Author:
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 572
Book Description
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 572
Book Description
Thermal Conductivity
Author: Daniel R. Flynn
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 832
Book Description
Contains the text or abstracts of ninety papers contributed to the conference.
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 832
Book Description
Contains the text or abstracts of ninety papers contributed to the conference.
Conference on Thermal Conductivity ; 16
Author:
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ISBN:
Category :
Languages : en
Pages :
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Publisher:
ISBN:
Category :
Languages : en
Pages :
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Conference on Thermal Conductivity ; 14
Author:
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Category :
Languages : en
Pages :
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Publisher:
ISBN:
Category :
Languages : en
Pages :
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32nd International Thermal Conductivity Conference and 20th International Thermal Expansion Symposium
Author: Timothy S. Fisher
Publisher:
ISBN: 9781626710504
Category :
Languages : en
Pages :
Book Description
Publisher:
ISBN: 9781626710504
Category :
Languages : en
Pages :
Book Description