Conference on Thermal Conductivity ; 16 PDF Download
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Languages : en
Pages :
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Author:
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Category :
Languages : en
Pages :
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Author: Ralph B. Dinwiddie
Publisher: DEStech Publications, Inc
ISBN: 1932078592
Category : Expansion (Heat)
Languages : en
Pages : 858
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Book Description
This book presents the most current research on heat flow in materials, ranging from metals to newer materials such as thin films and nanowires.
Author: David C. Larsen
Publisher: Springer Science & Business Media
ISBN: 1468442651
Category : Technology & Engineering
Languages : en
Pages : 606
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Book Description
The International Thermal Conductivity Conference was started in 1961 with the initiative of Mr. C. F. Lucks and grew out of the needs of researchers in the field. From 1961 to 1973 the Confer ences were held annually, and have been held biennially since 1975 when our Center for Information and Numerical Data Analysis and Synthesis (CINDAS) of Purdue University became the permanent Spon sor of the Conferences. These Conferences provide a broadly based forum for researchers actively working on the thermal conductivity and closely related properties to convene on a regular basis to ex change their ideas and experiences and report their findings and results. The Conferences have been self-perpetuating and are an example of how a technical community with a common purpose can transcend the invisible, artificial barriers between disciplines and gather togeth er in increasing numbers without the need of national publicity and continuing funding support, when they see something worthwi1e going on. It is believed that this series of Conferences not only will grow stronger, but will set an example for researchers in other fields on how to jointly attack their own problem areas.
Author:
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ISBN:
Category : Heat
Languages : en
Pages : 944
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Author: Daniel R. Flynn
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 832
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Book Description
Contains the text or abstracts of ninety papers contributed to the conference.
Author: David C. Larsen
Publisher: Springer
ISBN: 9781468442670
Category : Technology & Engineering
Languages : en
Pages : 624
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Book Description
The International Thermal Conductivity Conference was started in 1961 with the initiative of Mr. C. F. Lucks and grew out of the needs of researchers in the field. From 1961 to 1973 the Confer ences were held annually, and have been held biennially since 1975 when our Center for Information and Numerical Data Analysis and Synthesis (CINDAS) of Purdue University became the permanent Spon sor of the Conferences. These Conferences provide a broadly based forum for researchers actively working on the thermal conductivity and closely related properties to convene on a regular basis to ex change their ideas and experiences and report their findings and results. The Conferences have been self-perpetuating and are an example of how a technical community with a common purpose can transcend the invisible, artificial barriers between disciplines and gather togeth er in increasing numbers without the need of national publicity and continuing funding support, when they see something worthwi1e going on. It is believed that this series of Conferences not only will grow stronger, but will set an example for researchers in other fields on how to jointly attack their own problem areas.
Author: National Institute od Standards and Technology (U.S.)
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 801
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Book Description
Author: Oak Ridge National Laboratory. Metals and Ceramics Division
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 835
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Book Description
Author: Naval Radiological Defense Laboratory
Publisher:
ISBN:
Category : Heat
Languages : en
Pages :
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Book Description
Author: David C. Larsen
Publisher: Springer
ISBN: 9780306410321
Category : Technology & Engineering
Languages : en
Pages : 624
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Book Description
The International Thermal Conductivity Conference was started in 1961 with the initiative of Mr. C. F. Lucks and grew out of the needs of researchers in the field. From 1961 to 1973 the Confer ences were held annually, and have been held biennially since 1975 when our Center for Information and Numerical Data Analysis and Synthesis (CINDAS) of Purdue University became the permanent Spon sor of the Conferences. These Conferences provide a broadly based forum for researchers actively working on the thermal conductivity and closely related properties to convene on a regular basis to ex change their ideas and experiences and report their findings and results. The Conferences have been self-perpetuating and are an example of how a technical community with a common purpose can transcend the invisible, artificial barriers between disciplines and gather togeth er in increasing numbers without the need of national publicity and continuing funding support, when they see something worthwi1e going on. It is believed that this series of Conferences not only will grow stronger, but will set an example for researchers in other fields on how to jointly attack their own problem areas.
