Author: Han-Ming Wu
Publisher: The Electrochemical Society
ISBN: 1566778069
Category : Science
Languages : en
Pages : 1203
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Book Description
Our mission is to provide a forum for world experts to discuss technologies, address the growing needs associated with silicon technology, and exchange their discoveries and solutions for current issues of high interest. We encourage collaboration, open discussion, and critical reviews at this conference. Furthermore, we hope that this conference will also provide collaborative opportunities for those who are interested in the semiconductor industry in Asia, particularly in China.
Author: Gi-Chul Yang
Publisher: Springer Science & Business
ISBN: 9401788324
Category : Technology & Engineering
Languages : en
Pages : 688
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Book Description
This book contains revised and extended research articles written by prominent researchers participating in the international conference on Advances in Engineering Technologies and Physical Science (London, U.K., 3-5 July, 2013). Topics covered include mechanical engineering, bioengineering, internet engineering, image engineering, wireless networks, knowledge engineering, manufacturing engineering, and industrial applications. The book offers state of art of tremendous advances in engineering technologies and physical science and applications, and also serves as an excellent reference work for researchers and graduate students working with/on engineering technologies and physical science.
Author: Mauro Santos
Publisher: Springer
ISBN: 3030159787
Category : Technology & Engineering
Languages : en
Pages : 133
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Book Description
This book presents a novel logarithmic conversion architecture based on cross-coupled inverter. An overview of the current state of the art of logarithmic converters is given where most conventional logarithmic analog-to-digital converter architectures are derived or adapted from linear analog-to-digital converter architectures, implying the use of analog building blocks such as amplifiers. The conversion architecture proposed in this book differs from the conventional logarithmic architectures. Future possible studies on integrating calibration in the voltage to time conversion element and work on an improved conversion architecture derived from the architecture are also presented in this book.
Author: Daniele Ielmini
Publisher: John Wiley & Sons
ISBN: 3527680942
Category : Technology & Engineering
Languages : en
Pages : 784
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Book Description
With its comprehensive coverage, this reference introduces readers to the wide topic of resistance switching, providing the knowledge, tools, and methods needed to understand, characterize and apply resistive switching memories. Starting with those materials that display resistive switching behavior, the book explains the basics of resistive switching as well as switching mechanisms and models. An in-depth discussion of memory reliability is followed by chapters on memory cell structures and architectures, while a section on logic gates rounds off the text. An invaluable self-contained book for materials scientists, electrical engineers and physicists dealing with memory research and development.
Author: Maude Josée Blondin
Publisher: Springer Nature
ISBN: 3030254461
Category : Mathematics
Languages : en
Pages : 363
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Book Description
This volume presents some recent and principal developments related to computational intelligence and optimization methods in control. Theoretical aspects and practical applications of control engineering are covered by 14 self-contained contributions. Additional gems include the discussion of future directions and research perspectives designed to add to the reader’s understanding of both the challenges faced in control engineering and the insights into the developing of new techniques. With the knowledge obtained, readers are encouraged to determine the appropriate control method for specific applications.
Author: Massimo Rudan
Publisher: Springer Nature
ISBN: 3030798275
Category : Technology & Engineering
Languages : en
Pages : 1680
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Book Description
This Springer Handbook comprehensively covers the topic of semiconductor devices, embracing all aspects from theoretical background to fabrication, modeling, and applications. Nearly 100 leading scientists from industry and academia were selected to write the handbook's chapters, which were conceived for professionals and practitioners, material scientists, physicists and electrical engineers working at universities, industrial R&D, and manufacturers. Starting from the description of the relevant technological aspects and fabrication steps, the handbook proceeds with a section fully devoted to the main conventional semiconductor devices like, e.g., bipolar transistors and MOS capacitors and transistors, used in the production of the standard integrated circuits, and the corresponding physical models. In the subsequent chapters, the scaling issues of the semiconductor-device technology are addressed, followed by the description of novel concept-based semiconductor devices. The last section illustrates the numerical simulation methods ranging from the fabrication processes to the device performances. Each chapter is self-contained, and refers to related topics treated in other chapters when necessary, so that the reader interested in a specific subject can easily identify a personal reading path through the vast contents of the handbook.
Author: Achim Seidel
Publisher: Springer Nature
ISBN: 3030689409
Category : Technology & Engineering
Languages : en
Pages : 137
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Book Description
This book explores integrated gate drivers with emphasis on new gallium nitride (GaN) power transistors, which offer fast switching along with minimum switching losses. It serves as a comprehensive, all-in-one source for gate driver IC design, written in handbook style with systematic guidelines. The authors cover the full range from fundamentals to implementation details including topics like power stages, various kinds of gate drivers (resonant, non-resonant, current-source, voltage-source), gate drive schemes, driver supply, gate loop, gate driver power efficiency and comparison silicon versus GaN transistors. Solutions are presented on the system and circuit level for highly integrated gate drivers. Coverage includes miniaturization by higher integration of subfunctions onto the IC (buffer capacitors), as well as more efficient switching by a multi-level approach, which also improves robustness in case of extremely fast switching transitions. The discussion also includes a concept for robust operation in the highly relevant case that the gate driver is placed in distance to the power transistor. All results are widely applicable to achieve highly compact, energy efficient, and cost-effective power electronics solutions.
Author: Singh, Sushil Kumar
Publisher: IGI Global
ISBN:
Category : Political Science
Languages : en
Pages : 453
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Book Description
Smart cities are experiencing a rapid evolution. The integration of technologies such as 5G, Internet of Things (IoT), Artificial Intelligence (AI), and blockchain has ushered in transformative applications, enhancing the quality of urban life. However, this evolution comes with its own challenges, most notably in security and privacy. Secure and Intelligent IoT-Enabled Smart Cities addresses these concerns, exploring theoretical frameworks and empirical research findings. The book embarks on the foundational elements of the Internet of Things, delving into the convergence of IoT and smart city applications, elucidating the layered architecture of IoT, and highlighting the security issues inherent in IoT-enabled Smart Cities. This book pinpoints the challenges smart city infrastructures face and offers innovative and pragmatic solutions to fortify their security. This book targets professionals and researchers immersed in the dynamic field of secure and intelligent environments within IoT-enabled smart city applications. It is a valuable resource for executives grappling with the strategic implications of emerging technologies in smart healthcare, smart parking, smart manufacturing, smart transportation, and beyond.
Author: Zheng Cui (author)
Publisher: Springer Nature
ISBN: 3031625463
Category :
Languages : en
Pages : 418
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Book Description
Author: Karen Reinhardt
Publisher: William Andrew
ISBN: 032351085X
Category : Technology & Engineering
Languages : en
Pages : 794
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Book Description
Handbook of Silicon Wafer Cleaning Technology, Third Edition, provides an in-depth discussion of cleaning, etching and surface conditioning for semiconductor applications. The fundamental physics and chemistry associated with wet and plasma processing are reviewed, including surface and colloidal aspects. This revised edition includes the developments of the last ten years to accommodate a continually involving industry, addressing new technologies and materials, such as germanium and III-V compound semiconductors, and reviewing the various techniques and methods for cleaning and surface conditioning. Chapters include numerous examples of cleaning technique and their results. The book helps the reader understand the process they are using for their cleaning application and why the selected process works. For example, discussion of the mechanism and physics of contamination, metal, particle and organic includes information on particle removal, metal passivation, hydrogen-terminated silicon and other processes that engineers experience in their working environment. In addition, the handbook assists the reader in understanding analytical methods for evaluating contamination. The book is arranged in an order that segments the various cleaning techniques, aqueous and dry processing. Sections include theory, chemistry and physics first, then go into detail for the various methods of cleaning, specifically particle removal and metal removal, amongst others. - Focuses on cleaning techniques including wet, plasma and other surface conditioning techniques used to manufacture integrated circuits - Reliable reference for anyone that manufactures integrated circuits or supplies the semiconductor and microelectronics industries - Covers processes and equipment, as well as new materials and changes required for the surface conditioning process
