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Author: K. M. M. Nair
Publisher:
ISBN:
Category :
Languages : en
Pages : 996
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Book Description
This volume contains a collection of 40 papers from two symposia: Advanced Dielectric Materials and Multilayer Electronic Devices and High Strain Piezoelectric Materials, Devices and Applications. Topics include fundamental and historical perspectives of dielectric materials; relaxor materials and devices; high strain piezoelectric devices; advanced aspects of powder preparation, characterization, and properties; thin films; materials for low and high frequency applications; processing-structure-property-relationships; and future applications.
Author: K. M. M. Nair
Publisher:
ISBN:
Category :
Languages : en
Pages : 996
Get Book Here
Book Description
This volume contains a collection of 40 papers from two symposia: Advanced Dielectric Materials and Multilayer Electronic Devices and High Strain Piezoelectric Materials, Devices and Applications. Topics include fundamental and historical perspectives of dielectric materials; relaxor materials and devices; high strain piezoelectric devices; advanced aspects of powder preparation, characterization, and properties; thin films; materials for low and high frequency applications; processing-structure-property-relationships; and future applications.
Author: K. M. Nair
Publisher: Wiley-American Ceramic Society
ISBN: 9781574982053
Category : Technology & Engineering
Languages : en
Pages : 0
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Book Description
This volume contains a collection of 40 papers from two symposia: Advanced Dielectric Materials and Multilayer Electronic Devices and High Strain Piezoelectric Materials, Devices and Applications. Topics include fundamental and historical perspectives of dielectric materials; relaxor materials and devices; high strain piezoelectric devices; advanced aspects of powder preparation, characterization, and properties; thin films; materials for low and high frequency applications; processing-structure-property-relationships; and future applications. Proceedings of the symposium held at the 105th Annual Meeting of The American Ceramic Society, April 27-30, 2003, in Nashville, Tennessee; Ceramic Transactions, Volume 150.
Author: K. M. Nair
Publisher: John Wiley & Sons
ISBN: 1118406761
Category : Technology & Engineering
Languages : en
Pages : 496
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Book Description
This volume contains a collection of 40 papers from two symposia: Advanced Dielectric Materials and Multilayer Electronic Devices and High Strain Piezoelectric Materials, Devices and Applications. Topics include fundamental and historical perspectives of dielectric materials; relaxor materials and devices; high strain piezoelectric devices; advanced aspects of powder preparation, characterization, and properties; thin films; materials for low and high frequency applications; processing-structure-property-relationships; and future applications. Proceedings of the symposium held at the 105th Annual Meeting of The American Ceramic Society, April 27-30, 2003, in Nashville, Tennessee; Ceramic Transactions, Volume 150.
Author: Relva C. Buchanan
Publisher: CRC Press
ISBN: 1482293048
Category : Technology & Engineering
Languages : en
Pages : 692
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Book Description
The Third Edition of Ceramic Materials for Electronics studies a wide range of ceramic materials, including insulators, conductors, piezoelectrics, and ferroelectrics, through detailed discussion of their properties, characterization, fabrication, and applications in electronics. The author summarizes the latest trends and advancements in the field, and explores important topics such as ceramic thin film, functional device technology, and thick film technology. Edited by a leading expert on the subject, this new edition includes more than 150 pages of new information; restructured reference materials, figures, and tables; as well as additional device application-oriented segments.
Author: Ruyan Guo
Publisher: John Wiley & Sons
ISBN: 1118405749
Category : Technology & Engineering
Languages : en
Pages : 584
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Book Description
Proceedings of the Symposium on Dielectric Materials and Multilayer Electronic Devices and the Symposium on Morphotropic Phase Boundary Phenomena and Perovskite Materials, held April 28 - May 1, 2002, in St. Louis, Missouri, during the 104th Annual Meeting of the American Ceramic Society, and the Focused Session on High Strain Piezoelectrics, held April 22-25, 2001, in Indianapolis, Indiana, during the 103rd Annual Meeting of the American Ceramic Society.
Author: K. M. Nair
Publisher: John Wiley & Sons
ISBN: 1118511360
Category : Technology & Engineering
Languages : en
Pages : 258
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Book Description
With contributed papers from the 2011 Materials Science & Technology symposia, this is a useful one-stop resource for understanding the most important issues in the advances and applications of electroceramics. Logically organized and carefully selected, the articles cover the themes of the symposia: Magnetoelectric Multiferroic Thin Films and Multilayers; Dielectric Ceramic Materials and Electronic Devices; and Multifunctional Oxide. An essential reference for government labs and academics in mechanical and chemical engineering, materials and or ceramics, and chemistry.
Author: K. M. Nair
Publisher: John Wiley & Sons
ISBN: 1118408179
Category : Technology & Engineering
Languages : en
Pages : 323
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Book Description
This proceedings contains papers presented at the Advanced Dielectric Materials: Design, Preparation, Processing and Applications; and Advanced Dielectrics for Wireless Communications symposia. Topics include design of material, materials synthesis and processing, processing-microstructure-property relationship, multilayer device materials, thin and thick films, device applications, low temperature co-fired ceramics (LTCC)for multilayer devices, microwave dielectric materials and much more.
Author: Yoshihiko Imanaka
Publisher: Springer Science & Business Media
ISBN: 0387233148
Category : Technology & Engineering
Languages : en
Pages : 252
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Book Description
The only book to concentrate solely on low temperature cofired ceramics, an attractive technology for electronic components and substrates that are compact, light, and offer high-speed and functionality for portable electronic devices.
Author: K. M. Nair
Publisher: John Wiley & Sons
ISBN: 1118408195
Category : Technology & Engineering
Languages : en
Pages : 416
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Book Description
Papers in this volume include topics such as materials synthesis and processing; relaxors; novel compositions; material design; materials for multilayer electronic devices; processing-microstructure-property relationship; applications; environmental issues; and economic/cost analysis of tomorrow's electronic devices. Includes 38 papers.
Author: Fred D. Barlow, III
Publisher: CRC Press
ISBN: 1351837176
Category : Technology & Engineering
Languages : en
Pages : 373
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Book Description
Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies. Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates. Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications.
