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Author: K. M. Nair
Publisher: John Wiley & Sons
ISBN: 1118406761
Category : Technology & Engineering
Languages : en
Pages : 496
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Book Description
This volume contains a collection of 40 papers from two symposia: Advanced Dielectric Materials and Multilayer Electronic Devices and High Strain Piezoelectric Materials, Devices and Applications. Topics include fundamental and historical perspectives of dielectric materials; relaxor materials and devices; high strain piezoelectric devices; advanced aspects of powder preparation, characterization, and properties; thin films; materials for low and high frequency applications; processing-structure-property-relationships; and future applications. Proceedings of the symposium held at the 105th Annual Meeting of The American Ceramic Society, April 27-30, 2003, in Nashville, Tennessee; Ceramic Transactions, Volume 150.
Author: K. M. Nair
Publisher: John Wiley & Sons
ISBN: 1118406761
Category : Technology & Engineering
Languages : en
Pages : 496
Get Book Here
Book Description
This volume contains a collection of 40 papers from two symposia: Advanced Dielectric Materials and Multilayer Electronic Devices and High Strain Piezoelectric Materials, Devices and Applications. Topics include fundamental and historical perspectives of dielectric materials; relaxor materials and devices; high strain piezoelectric devices; advanced aspects of powder preparation, characterization, and properties; thin films; materials for low and high frequency applications; processing-structure-property-relationships; and future applications. Proceedings of the symposium held at the 105th Annual Meeting of The American Ceramic Society, April 27-30, 2003, in Nashville, Tennessee; Ceramic Transactions, Volume 150.
Author: Relva C. Buchanan
Publisher: CRC Press
ISBN: 1482293048
Category : Technology & Engineering
Languages : en
Pages : 693
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Book Description
The Third Edition of Ceramic Materials for Electronics studies a wide range of ceramic materials, including insulators, conductors, piezoelectrics, and ferroelectrics, through detailed discussion of their properties, characterization, fabrication, and applications in electronics. The author summarizes the latest trends and advancements in the field, and explores important topics such as ceramic thin film, functional device technology, and thick film technology. Edited by a leading expert on the subject, this new edition includes more than 150 pages of new information; restructured reference materials, figures, and tables; as well as additional device application-oriented segments.
Author: Jürgen G. Heinrich
Publisher: John Wiley & Sons
ISBN: 3527612777
Category : Technology & Engineering
Languages : en
Pages : 678
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Book Description
Several ceramic parts have already proven their suitability for serial application in automobile engines in very impressive ways, especially in Japan, the USA and in Germany. However, there is still a lack of economical quality assurance concepts. Recently, a new generation of ceramic components, for the use in energy, transportation and environment systems, has been developed. The efforts are more and more system oriented in this field. The only possibility to manage this complex issue in the future will be interdisciplinary cooperation. Chemists, physicists, material scientists, process engineers, mechanical engineers and engine manufacturers will have to cooperate in a more intensive way than ever before. The R&D activities are still concentrating on gas turbines and reciprocating engines, but also on brakes, bearings, fuel cells, batteries, filters, membranes, sensors and actuators as well as on shaping and cutting tools for low expense machining of ceramic components. This book summarizes the scientific papers of the 7th International Symposium "Ceramic Materials and Components for Engines". Some of the most fascinating new applications of ceramic meterials in energy, transportation and environment systems are presented. The proceedings shall lead to new ideas for interdisciplinary activities in the future.
Author:
Publisher: ASM International
ISBN: 9780871702852
Category : Technology & Engineering
Languages : en
Pages : 1234
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Book Description
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Author: K. M. Nair
Publisher: John Wiley & Sons
ISBN: 1118144457
Category : Technology & Engineering
Languages : en
Pages : 272
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Book Description
This book contains 26 papers from the Magnetoelectric Multiferroic Thin Films and Multilayers; Dielectric Ceramic Materials and Electronic Devices; Recent Developments in High-Temperature Superconductivity; and Multifunctional Oxides symposia held during the 2010 Materials Science and Technology (MS&T'10) meeting, October 17-21, 2010, Houston, Texas. Topics include: Properties; Structures; Synthesis; Characterization; Device Applications; Multiferroics and Magnetoelectrics; YBCO Pinning Methods and Properties; YBCO Processing and Reliability Related Issues; New Superconductors and MgB2.
Author: Zhigang Zak Fang
Publisher: Elsevier
ISBN: 1845699947
Category : Technology & Engineering
Languages : en
Pages : 502
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Book Description
Sintering is a method for manufacturing components from ceramic or metal powders by heating the powder until the particles adhere to form the component required. The resulting products are characterised by an enhanced density and strength, and are used in a wide range of industries. Sintering of advanced materials: fundamentals and processes reviews important developments in this technology and its applicationsPart one discusses the fundamentals of sintering with chapters on topics such as the thermodynamics of sintering, kinetics and mechanisms of densification, the kinetics of microstructural change and liquid phase sintering. Part two reviews advanced sintering processes including atmospheric sintering, vacuum sintering, microwave sintering, field/current assisted sintering and photonic sintering. Finally, Part three covers sintering of aluminium, titanium and their alloys, refractory metals, ultrahard materials, thin films, ultrafine and nanosized particles for advanced materials.With its distinguished editor and international team of contributors, Sintering of advanced materials: fundamentals and processes reviews the latest advances in sintering and is a standard reference for researchers and engineers involved in the processing of ceramics, powder metallurgy, net-shape manufacturing and those using advanced materials in such sectors as electronics, automotive and aerospace engineering. - Explores the thermodynamics of sintering including sinter bonding and densification - Chapters review a variety of sintering methods including atmosphere, vacuum, liquid phase and microwave sintering - Discusses sintering of a variety of materials featuring refractory metals, super hard materials and functionally graded materials
Author: Mickaël Lallart
Publisher: BoD – Books on Demand
ISBN: 9533074531
Category : Science
Languages : en
Pages : 670
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Book Description
Ferroelectric materials have been and still are widely used in many applications, that have moved from sonar towards breakthrough technologies such as memories or optical devices. This book is a part of a four volume collection (covering material aspects, physical effects, characterization and modeling, and applications) and focuses on the underlying mechanisms of ferroelectric materials, including general ferroelectric effect, piezoelectricity, optical properties, and multiferroic and magnetoelectric devices. The aim of this book is to provide an up-to-date review of recent scientific findings and recent advances in the field of ferroelectric systems, allowing a deep understanding of the physical aspect of ferroelectricity.
Author: United States. Patent and Trademark Office
Publisher:
ISBN:
Category : Patents
Languages : en
Pages : 1454
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Book Description
Author: Yoshihiko Imanaka
Publisher: Springer Science & Business Media
ISBN: 0387233148
Category : Technology & Engineering
Languages : en
Pages : 252
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Book Description
The only book to concentrate solely on low temperature cofired ceramics, an attractive technology for electronic components and substrates that are compact, light, and offer high-speed and functionality for portable electronic devices.
Author: K. M. M. Nair
Publisher:
ISBN:
Category :
Languages : en
Pages : 996
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Book Description
This volume contains a collection of 40 papers from two symposia: Advanced Dielectric Materials and Multilayer Electronic Devices and High Strain Piezoelectric Materials, Devices and Applications. Topics include fundamental and historical perspectives of dielectric materials; relaxor materials and devices; high strain piezoelectric devices; advanced aspects of powder preparation, characterization, and properties; thin films; materials for low and high frequency applications; processing-structure-property-relationships; and future applications.
