Atomic Layer Deposition of Amorphous Thin Films in Surface Modification and Protection for Electrochemical and Electronic Applications

Atomic Layer Deposition of Amorphous Thin Films in Surface Modification and Protection for Electrochemical and Electronic Applications PDF Author: Yutao Dong
Publisher:
ISBN:
Category :
Languages : en
Pages : 0

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Book Description
Atomic layer deposition (ALD) is a powerful manufacturing approach for amorphous thin film growth. With the advantages of excellent conformity, pinhole-free and concise thickness control, ALD has been widely applied in many energy systems, including batteries, catalysts and photoelectrochemical (PEC) cells, to achieve surface modification and good protection performance. In this dissertation, a series of works will be exhibited to discuss ALD amorphous film coating on batteries electrode and separator, semiconductor photoelectrodes, demonstrating its enormous prospects to enable stable performance in electrochemical systems. Chapter 1 is an overview of photoelectrochemistry and ALD technique to provide principal background to inspire our ALD amorphous film studies in electrochemical systems. ALD protective coatings on batteries electrodes and semiconductor photoelectrodes have been reviewed to illustrate the advantage of homogenous amorphous ALD film. Structure inhomogeneity and chemical composition impurities in ALD amorphous film are discussed to present unsolved problems to optimize ALD amorphous film properties. Chapter 2 discusses the development of bioresorbable zinc anode coated by ALD amorphous Al2O3 film. With the protective ALD Al2O3 protective shell, the zinc anode filament exhibited directional dissolution behavior with a tunable lifetime and output, providing an effective pathway toward bioresorbable transient batteries powering biomedical implantable devices. Chapter 3 exhibited the surface modification performance of ALD amorphous Al2O3 film on ferroelectric P(VDF-TrFE) film, severing as dendrite-suppression separator in aqueous rechargeable zinc ions batteries. The separator surface hydrophilicity is largely improved with the ferroelectric properties maintained after ALD amorphous Al2O3 coating, generating uniform zinc ions diffusion during plating/stripping cycling. This works depicts ALD amorphous film modified ferroelectric film as promising separator candidates in aqueous rechargeable batteries systems. Chapter 4 discusses the ALD amorphous film protection on Si photoanode and reveals the detrimental role of unreacted Cl ligands to film stability in PEC water splitting. In addition to crystalline phase, the residual Cl impurities can become the weak point of ALD amorphous TiO2 film due to local high hole conductivity and discontinuous Ti-O-Ti networks. Furthermore, post-ALD in-situ water treatment approach is demonstrated to effectively decouple the ALD reaction completeness from crystallization. The as-processed TiO2 film has a much lower residual Cl concentration and thus an improved film stoichiometry, while its uniform amorphous phase is well preserved. Thus, this water-treated ALD amorphous TiO2 film enabled record-high protection stability with high photocurrent density, demonstrating a significant advancement toward sustainable hydrogen generation. Inspired by the stoichiometry influence on ALD amorphous TiO2 film properties, the residual ligands in plasmas-enhanced chemical vapor deposition (PECVD) amorphous silicon nitride (SiNx) film are also investigated and demonstrated to largely affect the film mechanical properties in Chapter 5. The high residual N-H ligands from the NH3 precursor induces excessive tensile strain at the SiNx/Si wafer interface and consequently aggravates SiNx film crack formation. With a long-soak pretreatment, residual H ligands are effectively reduced to achieve homogenous chemical composition in both thin and thick long-soak SiNx film. As a result, the crack number and the remaining crack length are substantially reduced in contrast to the original SiNx film. This work further demonstrates the crucial role of residual ligands on internal strain regulation and points out a pathway to achieve crack-free PECVD SiNx films in industrial manufacturing. Chapter 6 provides summaries of ALD amorphous film applications in electrochemical system and concludes the film stoichiometry influence on amorphous film chemical/mechanical stability. Based on the substantial performance enhancement with improved stoichiometry, promising research outlooks have been proposed for ALD amorphous film optimization.

Atomic Layer Deposition of Amorphous Thin Films in Surface Modification and Protection for Electrochemical and Electronic Applications

Atomic Layer Deposition of Amorphous Thin Films in Surface Modification and Protection for Electrochemical and Electronic Applications PDF Author: Yutao Dong
Publisher:
ISBN:
Category :
Languages : en
Pages : 0

Get Book Here

Book Description
Atomic layer deposition (ALD) is a powerful manufacturing approach for amorphous thin film growth. With the advantages of excellent conformity, pinhole-free and concise thickness control, ALD has been widely applied in many energy systems, including batteries, catalysts and photoelectrochemical (PEC) cells, to achieve surface modification and good protection performance. In this dissertation, a series of works will be exhibited to discuss ALD amorphous film coating on batteries electrode and separator, semiconductor photoelectrodes, demonstrating its enormous prospects to enable stable performance in electrochemical systems. Chapter 1 is an overview of photoelectrochemistry and ALD technique to provide principal background to inspire our ALD amorphous film studies in electrochemical systems. ALD protective coatings on batteries electrodes and semiconductor photoelectrodes have been reviewed to illustrate the advantage of homogenous amorphous ALD film. Structure inhomogeneity and chemical composition impurities in ALD amorphous film are discussed to present unsolved problems to optimize ALD amorphous film properties. Chapter 2 discusses the development of bioresorbable zinc anode coated by ALD amorphous Al2O3 film. With the protective ALD Al2O3 protective shell, the zinc anode filament exhibited directional dissolution behavior with a tunable lifetime and output, providing an effective pathway toward bioresorbable transient batteries powering biomedical implantable devices. Chapter 3 exhibited the surface modification performance of ALD amorphous Al2O3 film on ferroelectric P(VDF-TrFE) film, severing as dendrite-suppression separator in aqueous rechargeable zinc ions batteries. The separator surface hydrophilicity is largely improved with the ferroelectric properties maintained after ALD amorphous Al2O3 coating, generating uniform zinc ions diffusion during plating/stripping cycling. This works depicts ALD amorphous film modified ferroelectric film as promising separator candidates in aqueous rechargeable batteries systems. Chapter 4 discusses the ALD amorphous film protection on Si photoanode and reveals the detrimental role of unreacted Cl ligands to film stability in PEC water splitting. In addition to crystalline phase, the residual Cl impurities can become the weak point of ALD amorphous TiO2 film due to local high hole conductivity and discontinuous Ti-O-Ti networks. Furthermore, post-ALD in-situ water treatment approach is demonstrated to effectively decouple the ALD reaction completeness from crystallization. The as-processed TiO2 film has a much lower residual Cl concentration and thus an improved film stoichiometry, while its uniform amorphous phase is well preserved. Thus, this water-treated ALD amorphous TiO2 film enabled record-high protection stability with high photocurrent density, demonstrating a significant advancement toward sustainable hydrogen generation. Inspired by the stoichiometry influence on ALD amorphous TiO2 film properties, the residual ligands in plasmas-enhanced chemical vapor deposition (PECVD) amorphous silicon nitride (SiNx) film are also investigated and demonstrated to largely affect the film mechanical properties in Chapter 5. The high residual N-H ligands from the NH3 precursor induces excessive tensile strain at the SiNx/Si wafer interface and consequently aggravates SiNx film crack formation. With a long-soak pretreatment, residual H ligands are effectively reduced to achieve homogenous chemical composition in both thin and thick long-soak SiNx film. As a result, the crack number and the remaining crack length are substantially reduced in contrast to the original SiNx film. This work further demonstrates the crucial role of residual ligands on internal strain regulation and points out a pathway to achieve crack-free PECVD SiNx films in industrial manufacturing. Chapter 6 provides summaries of ALD amorphous film applications in electrochemical system and concludes the film stoichiometry influence on amorphous film chemical/mechanical stability. Based on the substantial performance enhancement with improved stoichiometry, promising research outlooks have been proposed for ALD amorphous film optimization.

Atomic Layer Deposition Applications 14

Atomic Layer Deposition Applications 14 PDF Author: F. Roozeboom
Publisher: The Electrochemical Society
ISBN: 1607688522
Category : Science
Languages : en
Pages : 83

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Book Description


Atomic Layer Deposition Applications 2

Atomic Layer Deposition Applications 2 PDF Author: Ana Londergan
Publisher: The Electrochemical Society
ISBN: 1566775426
Category : Atomic layer deposition
Languages : en
Pages : 300

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Book Description
This issue gives an overview of the cutting edge research in the various areas where Atomic Layer Deposition (ALD) can be used, enabling the identification of issues, challenges, and areas where further research is needed. Contributions include: Memory applications, Interconnects and contacts, ALD Productivity enhancement and precursor development, ALD for optical and photonic applications, and Applications in other areas, such as MEMs, nanotechnology, fabrication of sensors and catalysts, etc.

Atomic Layer Deposition Applications 7

Atomic Layer Deposition Applications 7 PDF Author: J. W. Elam
Publisher: The Electrochemical Society
ISBN: 1607682567
Category :
Languages : en
Pages : 353

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Book Description


Atomic Layer Deposition

Atomic Layer Deposition PDF Author: Tommi Kääriäinen
Publisher: John Wiley & Sons
ISBN: 1118062779
Category : Technology & Engineering
Languages : en
Pages : 274

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Book Description
Since the first edition was published in 2008, Atomic Layer Deposition (ALD) has emerged as a powerful, and sometimes preferred, deposition technology. The new edition of this groundbreaking monograph is the first text to review the subject of ALD comprehensively from a practical perspective. It covers ALD's application to microelectronics (MEMS) and nanotechnology; many important new and emerging applications; thermal processes for ALD growth of nanometer thick films of semiconductors, oxides, metals and nitrides; and the formation of organic and hybrid materials.

Atomic Layer Deposition Applications 5

Atomic Layer Deposition Applications 5 PDF Author: S. de Gendt
Publisher: The Electrochemical Society
ISBN: 1566777410
Category :
Languages : en
Pages : 425

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Book Description
Atomic Layer Deposition can enable precise deposition of ultra-thin, highly conformal coatings over complex 3D topography, with controlled composition and properties for a wide range of applications.

Atomic Layer Deposition

Atomic Layer Deposition PDF Author: David Cameron
Publisher: MDPI
ISBN: 3039366521
Category : Science
Languages : en
Pages : 142

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Book Description
Atomic layer deposition (ALD) is a thin film deposition process renowned for its ability to produce layers with unrivaled control of thickness and composition, conformability to extreme three-dimensional structures, and versatility in the materials it can produce. These range from multi-component compounds to elemental metals and structures with compositions that can be adjusted over the thickness of the film. It has expanded from a small-scale batch process to large scale production, also including continuous processing – known as spatial ALD. It has matured into an industrial technology essential for many areas of materials science and engineering from microelectronics to corrosion protection. Its attributes make it a key technology in studying new materials and structures over an enormous range of applications. This Special Issue contains six research articles and one review article that illustrate the breadth of these applications from energy storage in batteries or supercapacitors to catalysis via x-ray, UV, and visible optics.

Atomic Layer Deposition Applications 6

Atomic Layer Deposition Applications 6 PDF Author: J. W. Elam
Publisher: The Electrochemical Society
ISBN: 1566778212
Category : Science
Languages : en
Pages : 469

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Book Description
The continuously expanding realm of Atomic Layer Deposition (ALD) Applications is the focus of this reoccurring symposium. ALD can enable the precise deposition of ultra-thin, highly conformal coatings over complex 3D topographies with controlled thickness and composition. This issue of ECS Transactions contains peer reviewed papers presented at the symposium. A broad spectrum of ALD applications is featured, including novel nano-composites and nanostructures, dielectrics for state-of-the-art transistors and capacitors, optoelectronics, and a variety of other emerging applications.

Atomic Layer Deposition Applications 3

Atomic Layer Deposition Applications 3 PDF Author: Ana Londergan
Publisher: The Electrochemical Society
ISBN: 1566775736
Category : Atomic layer deposition
Languages : en
Pages : 300

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Book Description
The continuously expanding realm of Atomic Layer Deposition (ALD) Applications is the symposium focus. ALD can enable the precise deposition of ultra-thin, highly conformal coatings over complex 3D topography, with controlled composition and properties. Following two successful years, this symposium is well on its way to becoming a forum for the sharing of cutting edge research in the various areas where ALD is used.

Atomic Layer Deposition for Semiconductors

Atomic Layer Deposition for Semiconductors PDF Author: Cheol Seong Hwang
Publisher: Springer Science & Business Media
ISBN: 146148054X
Category : Science
Languages : en
Pages : 266

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Book Description
Offering thorough coverage of atomic layer deposition (ALD), this book moves from basic chemistry of ALD and modeling of processes to examine ALD in memory, logic devices and machines. Reviews history, operating principles and ALD processes for each device.