An Experimental Study on Pool Boiling Performance Enhancement and Effect of Aging PDF Download
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Author: Aniket M. Rishi
Publisher:
ISBN:
Category : Ebullition
Languages : en
Pages : 194
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Book Description
"The miniaturization of electronic devices requires advanced thermal management techniques. The two-phase heat transfer process offers more effective and sustainable approach compared to the presently used single-phase cooling techniques. The boiling heat transfer is a two-phase cooling technique, that dissipates a high heat flux while maintaining the low surface temperature thereby, offering an efficient heat transfer mechanism compared to the single-phase process. Furthermore, the surface enhancement techniques such as micro/nano porous coatings help to maintain the low surface temperature thus improving the overall heat transfer performance. Electrodeposition is a simple technique that enhances this performance by creating the porous structure on the surface. This research focuses on developing an enhanced microscale structures on plain copper surfaces to improve the pool boiling performance. Additionally, the longevity (or the long-term stability) and aging of these enhanced structures, and their effects on the pool-boiling performance is also investigated. Initially the pool boiling performance of enhanced surfaces is studied. The enhanced surfaces were prepared using electrodeposition of copper and graphene oxide. Later, the effects of repetitive boiling on the morphology of the surfaces were examined using various characterization techniques such as Scanning Electron Microscope (SEM), X-Ray Diffraction (XRD), and Fourier Transform Infrared (FTIR). The chips coated with electrodeposition method rendered a high pool boiling performance for GS-4 (2.5% GO-Cu electrodeposited chip) with CHF of 220 W/cm2 at wall superheat of 14°C, giving ~76% improvement in CHF compared to plain copper chip. While, copper on copper electrodeposited chip, deposited with a different technique, performed better in both CHF and aging. CHF of 192 W/cm2 at wall superheat of 18.8°C was achieved for copper electrodeposited chip, giving ~30% enhancement compared to literature and ~54% enhancement when compared to plain copper chip. Moreover, surface characterization techniques including Scanning Electron Microscope (SEM) with Energy- Dispersive X-Ray Spectroscopy (EDS), Fourier Transform Infrared (FTIR), and X-Ray Diffraction (XRD) were employed to study the morphologies, elemental species, and to confirm the presence of graphene and graphene oxide on the test surfaces."--Abstract.
Author: Aniket M. Rishi
Publisher:
ISBN:
Category : Ebullition
Languages : en
Pages : 194
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Book Description
"The miniaturization of electronic devices requires advanced thermal management techniques. The two-phase heat transfer process offers more effective and sustainable approach compared to the presently used single-phase cooling techniques. The boiling heat transfer is a two-phase cooling technique, that dissipates a high heat flux while maintaining the low surface temperature thereby, offering an efficient heat transfer mechanism compared to the single-phase process. Furthermore, the surface enhancement techniques such as micro/nano porous coatings help to maintain the low surface temperature thus improving the overall heat transfer performance. Electrodeposition is a simple technique that enhances this performance by creating the porous structure on the surface. This research focuses on developing an enhanced microscale structures on plain copper surfaces to improve the pool boiling performance. Additionally, the longevity (or the long-term stability) and aging of these enhanced structures, and their effects on the pool-boiling performance is also investigated. Initially the pool boiling performance of enhanced surfaces is studied. The enhanced surfaces were prepared using electrodeposition of copper and graphene oxide. Later, the effects of repetitive boiling on the morphology of the surfaces were examined using various characterization techniques such as Scanning Electron Microscope (SEM), X-Ray Diffraction (XRD), and Fourier Transform Infrared (FTIR). The chips coated with electrodeposition method rendered a high pool boiling performance for GS-4 (2.5% GO-Cu electrodeposited chip) with CHF of 220 W/cm2 at wall superheat of 14°C, giving ~76% improvement in CHF compared to plain copper chip. While, copper on copper electrodeposited chip, deposited with a different technique, performed better in both CHF and aging. CHF of 192 W/cm2 at wall superheat of 18.8°C was achieved for copper electrodeposited chip, giving ~30% enhancement compared to literature and ~54% enhancement when compared to plain copper chip. Moreover, surface characterization techniques including Scanning Electron Microscope (SEM) with Energy- Dispersive X-Ray Spectroscopy (EDS), Fourier Transform Infrared (FTIR), and X-Ray Diffraction (XRD) were employed to study the morphologies, elemental species, and to confirm the presence of graphene and graphene oxide on the test surfaces."--Abstract.
Author: Colin Charles Thomas
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 192
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Author: John Richard Saylor
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 184
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Book Description
Author: Camil-Daniel Ghiu
Publisher:
ISBN:
Category : Ebullition
Languages : en
Pages :
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Book Description
A study of pool boiling of a dielectric liquid (PF 5060) from single-layered enhanced structures was conducted. The parameters investigated were the heat flux, the width of the microchannels and the microchannel pitch. The boiling performance of the enhanced structures increases with increase in channel width and decrease in channel pitch. Simple single line curve fits are provided as a practical way of predicting the data over the entire nucleate boiling regime. The influence of confinement on the thermal performance of the enhanced structures was also assessed. The main parameter investigated was the top space (0 mm 3{13 mm). High-speed visualization was used as a tool . For the total confinement (= 0 mm), the heat transfer performance of the enhanced structures was found to depend weakly on the channel width. For>0 mm, the enhancement observed for plain surfaces in the low heat fluxes regime is not present for the present enhanced structure. The maximum heat flux for a prescribed 85 °C surface temperature limit increased with the increase of the top spacing, similar to the plain surfaces case. Two characteristic regimes of pool boiling have been identified and described: isolated flattened bubbles regime and coalesced bubbles regime. A semi-analytical predictive model applicable to pool boiling under confinement is developed. The model requires a limited number of empirical constants and is capable of predicting the experimental heat flux within 30%.
Author: Joo Han Kim
Publisher:
ISBN: 9780542979903
Category : Mechanical engineering
Languages : en
Pages :
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The present research is an experimental study of the enhancement of boiling heat transfer using microporous coating techniques. The current research is divided into four major phases. During the first phase, the effects of different metal particle sizes in the coating compound for thermally non-conductive microporous coating on pool boiling performance of refrigerants and water are investigated. The test surfaces were solid copper blocks with 1-cm2 base at atmospheric pressure in saturated FC-72, R-123, and water. Results showed that the surface treatment by non-conductive microporous coating significantly enhanced both nucleate boiling and critical heat flux of FC-72 and R-123. However, the enhancement of boiling performance for water was merely shown. In the second phase, thermally conductive microporous coatings to enhance boiling performance of water were developed. The first phase motivated efforts to fabricate microporous coatings with conducting binder options. The second phase was stemmed from an effort to combine the advantages of both a mixture batch type (inexpensive & easy process) and sintering/machining method (low thermal resistance of conduction). Two categories of surface treatment processes were considered in the current research. The first can be achieved by a chemical process, Multi-Staged Electroplating (MSE), which uses electricity in a chemical bath to deposit a microporous structure on the surface. The second is a soldering process, Multi-Temperature Soldering Process (MTSP), which binds the metal particles to generate optimum microporous cavities. Scanning Electron Microscope (SEM) and optical microscope images were obtained for thermally conductive microporous coated surfaces. During the third phase, the pool boiling performance of developed MSE and MTSP from second phase was confirmed for water. Results showed that the MSE and MTSP augmented the boiling performance not only for refrigerants but also for water significantly compared to non-conductive microporous coatings. Further investigation for possible future industrial applications of microporous coatings, such as indirect cooling for electronic chips, nanofluids for high power generation industries, and freezing problem of water, were conducted in the final phase.
Author: Ephraim M. Sparrow
Publisher: Academic Press
ISBN: 0323850820
Category : Technology & Engineering
Languages : en
Pages : 414
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Book Description
Advances in Heat Transfer, Volume 53 in this long-running serial, highlights new advances in the field, with this new volume presenting interesting chapters written by an international board of authors. Provides the authority and expertise of leading contributors from an international board of authors Presents the latest release in the Advances in Heat Transfer series
Author:
Publisher: Elsevier
ISBN: 0443193134
Category : Science
Languages : en
Pages : 598
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Book Description
Advances in Heat Transfer, Volume 56, presents the latest in a serial that highlights new advances in the field, with this updated volume presenting interesting chapters written by an international board of authors. - Provides the authority and expertise of leading contributors from an international board of authors - Presents the latest release in Advances in Heat Transfer serials
Author: N. Zuber
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 216
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Author: Chia-Hsiang Hsu
Publisher:
ISBN:
Category :
Languages : en
Pages :
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Book Description
Pool boiling is an effective method used in many technical applications for a long time. Its highly efficient heat transfer performance results from not only the convection effect but also the phase change process in pool boiling. Pool boiling enhancement has been studied in the past decade. However, the mechanisms of pool boiling has not yet been fully understood because of the many parameters that affect its behavior including the latent heat of vaporization, nucleation density, bubble and fluid motion, interaction at the interface, and the physical properties of surface. Among the current studies, bubble departure rate is viewed as one of the dominant factors that affect heat transfer. This research considers the effect of bubble confinement on pool boiling. In the study, confinement was achieved by placing a flat plate over heated surface. The flat plate has a hole in the middle, and there is a gap between the flat plate and the heater. The diameters of hole are 2 mm, 3 mm, and 4 mm; the gap distances are 2.3 mm, 3.6 mm, and 5 mm. The heater consists of an indium-tin-oxide layer deposited on a silicon wafer. An IR camera and high speed cameras are used to acquire the surface temperature distribution and bubble image. By controlling the plate hole size and the gap distance, the effect of confinement on heat transfer performance can be evaluated. Moreover, heat transfer performance of pool boiling with three-2mm-holes plate was investigated and compared with that of single-2mm-hole plate with the smallest gap size. At the lower heat flux values, heat transfer enhancement in confined space was experimentally observed. Surface temperature can be reduced by 4 °C at most. Results indicate that higher bubble departure rate and coalescence effect might be the dominant factor for improving heat transfer performance in a confined space caused by induced shear flow. The electronic version of this dissertation is accessible from http://hdl.handle.net/1969.1/152843
Author: Lance Austin Brumfield
Publisher:
ISBN:
Category :
Languages : en
Pages : 346
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