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Author: Karel Maria André Van Doorselaer
Publisher:
ISBN: 9789090071237
Category :
Languages : en
Pages : 202
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Book Description
Author: Karel Maria André Van Doorselaer
Publisher:
ISBN: 9789090071237
Category :
Languages : en
Pages : 202
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Book Description
Author: Lawrence C. Wagner
Publisher: Springer Science & Business Media
ISBN: 1461549191
Category : Technology & Engineering
Languages : en
Pages : 256
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Book Description
This "must have" reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits.
Author: Friedrich Beck
Publisher: John Wiley & Sons
ISBN: 9780471974017
Category : Technology & Engineering
Languages : en
Pages : 198
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Book Description
Funktionstests an integrierten Schaltungen sind für deren Zuverlässigkeit von herausragender Bedeutung. Erstmals werden in diesem Werk die speziellen Präparationstechniken für die Fehleranalyse beschrieben. Ausgehend von den theoretischen Grundlagen erläutert der Autor in praxisnahem Stil die verschiedenen Techniken, die das Zurückverfolgen von Ausfällen ermöglichen.
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 200
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Book Description
Author: Marius Bazu
Publisher: John Wiley & Sons
ISBN: 1119990009
Category : Technology & Engineering
Languages : en
Pages : 372
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Book Description
Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use. Inside you will find detailed coverage on: a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involved the reasons why failure analysis is an important tool for improving yield and reliability by corrective actions the design stage, highlighting the ‘concurrent engineering' approach and DfR (Design for Reliability) failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability reliability resting after fabrication, including reliability assessment at this stage and corrective actions a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methods new challenges in reliability testing, such as its use in microsystems and nanostructures This practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.
Author: Charles Cohn
Publisher: McGraw-Hill Professional Engin
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 392
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Book Description
The shrinking of integrated circuits (ICs) puts tremendous stress on overall device reliability. This unique treatment uses graphic illustration to clearly identify all major failure mode types, so engineers can spot failures before they occur.
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 12
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Book Description
Failure analysis is a critical element in the integrated circuit manufacturing industry. This paper reviews the changing role of failure analysis and describes major techniques employed in the industry today. Several advanced failure analysis techniques that meet the challenges imposed by advancements in integrated circuit technology are described and their applications are discussed. Future trends in failure analysis needed to keep pace with the continuing advancements in integrated circuit technology are anticipated.
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages :
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Book Description
Author:
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 368
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Book Description
Author: 王英樹
Publisher:
ISBN:
Category :
Languages : en
Pages : 100
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Book Description
