Author: Riza Esa
Publisher: Trans Tech Publications Ltd
ISBN: 3038136271
Category : Technology & Engineering
Languages : en
Pages : 2898

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Book Description
Volume is indexed by Thomson Reuters CPCI-S (WoS). This second collection on “Advanced Measurement and Test II” is dedicated to the electronic testing of devices, boards and systems; covering the complete cycle from design verification, design-for-testing, design-for-manufacturing, silicon de-bugging, manufacturing testing, system testing, diagnosis, failure analysis ... and back to process and design improvement. This will be an invaluable guide to the topics.

Author: Andy Wu
Publisher: Trans Tech Publications Ltd
ISBN: 3038260975
Category : Technology & Engineering
Languages : en
Pages : 2702

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Book Description
The primary aim of the proceeding is the combined coverage of the electronic test of devices, boards and systems—covering the complete cycle from design verification, design-for-test, design-for-manufacturing, silicon debug, manufacturing test, system test, diagnosis, failure analysis and back to process and design improvement at the advanced level. Such an approach enables the engineer to take into account the essential mechanical properties of the material itself and special features of practical implementation, including manufacturing technology, experimental results, and design characteristics.

Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 15

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Book Description
This second collection on "Advanced Measurement and Test II" is dedicated to the electronic testing of devices, boards and systems; covering the complete cycle from design verification, design-for-testing, design-for-manufacturing, silicon de-bugging, manufacturing testing, system testing, diagnosis, failure analysis ... and back to process and design improvement. This will be an invaluable guide to the topics. Three hundred and twenty-four papers from the June 2011 conference are arranged into three volumes on material science and technology, measuring and testing techniques, and mechanical and electrical engineering. Many of the Chinese researchers have multiple papers in the proceedings. For example, six papers from a Tianjin Polytechnic team report on the synthesis of PEG2000 lauric acid diester and polyamic acid, the performance of a polysiloxane antifoaming agent, the properties of modified co-polyester fibers, and analysis of a strongly acidic alkyl phosphate. Other topics include a laser measuring instrument for tunnel surfaces, the ERP detection of mental arithmetic strategies, fault diagnosis on telecommunication networks, a photovoltaic supercapacitor and battery hybrid storage system, and a sunlight intensity measurement device.

Author: Yanwen Wu
Publisher: Trans Tech Publications
ISBN: 9780878492718
Category : Electric measurements
Languages : en
Pages : 0

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Book Description
A collection on Advanced Measurement and Test that is dedicated to the electronic testing of devices, boards and systems and covers the complete cycle: from design verification, design-for-testing, design-for-manufacturing, silicon debug, manufacturing test, system test, diagnosis, failure analysis and back to process and design improvement.

Author: Ankdrew Parvel
Publisher: Trans Tech Publications Ltd
ISBN: 3038267597
Category : Technology & Engineering
Languages : en
Pages : 230

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Book Description
Collection of selected, peer reviewed papers from the 2014 4th International Conference on Advanced Measurement and Test, (AMT 2014), November 1-2, 2014, Wuhan, China. The 37 papers are grouped as follows: Chapter 1: Materials Science; Chapter 2: Material Processing and Testing Technology; Chapter 3: Monitoring, Detection, Testing and Measurement Systems and Technologies

Author: Yanwen Wu
Publisher: Trans Tech Publications Ltd
ISBN: 3038133531
Category : Technology & Engineering
Languages : en
Pages : 1730

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Book Description
This special collection on Advanced Measurement and Test is dedicated to the electronic testing of devices, boards and systems and covers the complete cycle: from design verification, design-for-testing, design-for-manufacturing, silicon debug, manufacturing test, system test, diagnosis, failure analysis and back to process and design improvement. Design, testing and yield professionals were invited to confront the challenges which the industry faces, and to learn how these challenges are being addressed by the combined efforts of academia, design tool and equipment suppliers, designers and test engineers.

Author: Joel P. Dunsmore
Publisher: John Wiley & Sons
ISBN: 1119477131
Category : Technology & Engineering
Languages : en
Pages : 852

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Book Description
Handbook of Microwave Component Measurements Second Edition is a fully updated, complete reference to this topic, focusing on the modern measurement tools, such as a Vector Network Analyzer (VNA), gathering in one place all the concepts, formulas, and best practices of measurement science. It includes basic concepts in each chapter as well as appendices which provide all the detail needed to understand the science behind microwave measurements. The book offers an insight into the best practices for ascertaining the true nature of the device-under-test (DUT), optimizing the time to setup and measure, and to the greatest extent possible, remove the effects of the measuring equipment from that result. Furthermore, the author writes with a simplicity that is easily accessible to the student or new engineer, yet is thorough enough to provide details of measurement science for even the most advanced applications and researchers. This welcome new edition brings forward the most modern techniques used in industry today, and recognizes that more new techniques have developed since the first edition published in 2012. Whilst still focusing on the VNA, these techniques are also compatible with other vendor's advanced equipment, providing a comprehensive industry reference.

Author:
Publisher:
ISBN:
Category : Aerodynamics
Languages : en
Pages : 578

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Book Description

Author: Yanwen Wu
Publisher: Trans Tech Publications Ltd
ISBN: 3038134074
Category : Technology & Engineering
Languages : en
Pages : 1586

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Book Description
The volume consists of a collection of 124 peer-reviewed papers contributed by experts from all over the world. The topics covered include: new developments and applications in materials forming, subtractive, additive and joining processes, processing of advanced materials such as composites, polymers, semiconductors and bio-materials, and new development in the micro/nano-fabrication of engineering materials.

Author: Dennis Derickson
Publisher: Pearson Education
ISBN: 0132797216
Category : Technology & Engineering
Languages : en
Pages : 1240

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Book Description
A Comprehensive Guide to Physical Layer Test and Measurement of Digital Communication Links Today's new data communication and computer interconnection systems run at unprecedented speeds, presenting new challenges not only in the design, but also in troubleshooting, test, and measurement. This book assembles contributions from practitioners at top test and measurement companies, component manufacturers,and universities. It brings together information that has never been broadly accessible before—information that was previously buried in application notes, seminar and conference presentations, short courses, and unpublished works. Readers will gain a thorough understanding of the inner workings of digital high-speed systems, and learn how the different aspects of such systems can be tested. The editors and contributors cover key areas in test and measurement of transmitters (digital waveform and jitter analysis and bit error ratio), receivers (sensitivity, jitter tolerance, and PLL/CDR characterization), and high-speed channel characterization (in time and frequency domain). Extensive illustrations are provided throughout. Coverage includes Signal integrity from a measurement point of view Digital waveform analysis using high bandwidth real-time and sampling (equivalent time) oscilloscopes Bit error ratio measurements for both electrical and optical links Extensive coverage on the topic of jitter in high-speed networks State-of-the-art optical sampling techniques for analysis of 100 Gbit/s + signals Receiver characterization: clock recovery, phase locked loops, jitter tolerance and transfer functions, sensitivity testing, and stressed-waveform receiver testing Channel and system characterization: TDR/T and frequency domain-based alternatives Testing and measuring PC architecture communication links: PCIexpress, SATA, and FB DIMM