Advanced Interconnects and Contact Materials and Processes for Future Integrated Circuits: Volume 514

Advanced Interconnects and Contact Materials and Processes for Future Integrated Circuits: Volume 514 PDF Author: S. P. Murarka
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 596

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Book Description
Comprising the proceedings of an MRS symposium held in April of 1998, contributions in this volume are divided into ten sections: interconnection frontiers; aluminum interconnects; cobalt and other silicides; titanium silicide; MOSFET, source, drain, and interconnect engineering; copper interconnects and barriers; a poster session on advanced interconnects and contacts; contacts to compound semiconductor devices; novel interconnect materials and schemes; and diffusion barriers. Annotation copyrighted by Book News, Inc., Portland, OR