Author: Society of Vacuum Coaters
Publisher:
ISBN:
Category :
Languages : en
Pages : 626

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Book Description

Author: Society of Vacuum Coaters. Annual Technical Conference
Publisher:
ISBN:
Category : Vapor-plating
Languages : en
Pages : 626

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Book Description

Author: Society of Vacuum Coaters. Technical Conference
Publisher:
ISBN:
Category : Vapor-plating
Languages : en
Pages : 626

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Book Description

Author: Jehuda Greener
Publisher: John Wiley & Sons
ISBN: 1119163803
Category : Technology & Engineering
Languages : en
Pages : 426

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Book Description
A single-volume resource featuring state-of-the art reviews of key elements of the roll-to-roll manufacturing processing methodology Roll-to-roll (R2R) manufacturing is an important manufacturing technology platform used extensively for mass-producing a host of film-type products in several traditional industries such as printing, silver-halide photography, and paper. Over the last two decades, some of the methodologies and know-how of R2R manufacturing have been extended and adapted in many new technology areas, including microelectronics, display, photovoltaics, and microfluidics. This comprehensive book presents the state-of-the-art unit operations of the R2R manufacturing technology, providing a practical resource for scientists, engineers, and practitioners not familiar with the fundamentals of R2R technology. Roll-to-Roll Manufacturing: Process Elements and Recent Advances reviews new developments in areas such as flexible glass, display, and photovoltaics and covers a number of process innovations implemented recently to extend and improve the capabilities of traditional R2R lines. It covers such topics as: coating and solidification processes, in-line vacuum deposition, drying, web handling and winding, polymer film substrates, novel hybrid composite films, flexible solar cells and more. Additionally, this book: Examines key elements (unit operations) of the R2R technology, and discusses how these elements are utilized and integrated to achieve desired process efficiencies in a host of applications. Illustrates several established and novel application areas where R2R processing is utilized in current or future products. Discusses process design methodology and key advantages of R2R manufacturing technology over batch or sheet-to-sheet operations. Roll-to-Roll Manufacturing: Process Elements and Recent Advances is an ideal book for undergraduate and graduate students in various science and engineering disciplines, as well as for scientists, engineers, and technical and business leaders associated in any way with the development, commercialization, and manufacture of a variety of film products.

Author: Albano Cavaleiro
Publisher: Springer Science & Business Media
ISBN: 0387487565
Category : Technology & Engineering
Languages : en
Pages : 671

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Book Description
This book delivers practical insight into a broad range of fields related to hard coatings, from their deposition and characterization up to the hardening and deformation mechanisms allowing the interpretation of results. The text examines relationships between structure/microstructure and mechanical properties from fundamental concepts, through types of coatings, to characterization techniques. The authors explore the search for coatings that can satisfy the criteria for successful implementation in real mechanical applications.

Author:
Publisher:
ISBN:
Category : Electroplating
Languages : en
Pages : 516

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Book Description

Author:
Publisher:
ISBN:
Category : Materials
Languages : en
Pages : 944

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Book Description

Author:
Publisher:
ISBN:
Category : Conference proceedings
Languages : en
Pages : 862

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Book Description

Author: B.S. Murty
Publisher: Elsevier
ISBN: 0128160683
Category : Technology & Engineering
Languages : en
Pages : 390

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Book Description
High-Entropy Alloys, Second Edition provides a complete review of the current state of the field of high entropy alloys (HEA). Building upon the first edition, this fully updated release includes new theoretical understandings of these materials, highlighting recent developments on modeling and new classes of HEAs, such as Eutectic HEAs and Dual phase HEAs. Due to their unique properties, high entropy alloys have attracted considerable attention from both academics and technologists. This book presents the fundamental knowledge, the spectrum of various alloy systems and their characteristics, key focus areas, and the future scope of the field in terms of research and technological applications. - Provides an up-to-date, comprehensive understanding on the current status of HEAs in terms of theoretical understanding and modeling efforts - Gives a complete idea on alloy design criteria of various classes of HEAs developed so far - Discusses the microstructure property correlations in HEAs in terms of structural and functional properties - Presents a comparison of HEAs with other multicomponent systems, like intermetallics and bulk metallic glasses

Author: F. Patrick McCluskey
Publisher: CRC Press
ISBN: 9780849396236
Category : Technology & Engineering
Languages : en
Pages : 354

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Book Description
The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.