Author: Aboul Ella Hassanien
Publisher: Springer Nature
ISBN: 3031277627
Category : Technology & Engineering
Languages : en
Pages : 616
Book Description
This book presents the proceedings of the 3rd International Conference on Artificial Intelligence and Computer Vision (AICV’2023) which will be held in Marrakesh, Morocco, during March 05–07, 2023. This international conference, which highlighted essential research and developments in the fields of artificial intelligence and computer visions, was organized by the computer, Networks, Mobility and Modeling Laboratory (IR2M), Faculty of Sciences and Techniques, Hassan First University, Settat, Morocco, the Scientific Research Group in Egypt (SRGE), Cairo University, and the Automated Systems & Soft Computing Lab (ASSCL), Prince Sultan University, Riyadh, Saudi Arabia. The book is divided into sections, covering the following topics: swarm-based optimization mining and data analysis, deep learning and applications, machine learning and applications, image processing and computer vision, sentiment analysis, and recommendation systems, and software-defined network and telecommunication.
The 3rd International Conference on Artificial Intelligence and Computer Vision (AICV2023), March 5–7, 2023
Author: Aboul Ella Hassanien
Publisher: Springer Nature
ISBN: 3031277627
Category : Technology & Engineering
Languages : en
Pages : 616
Book Description
This book presents the proceedings of the 3rd International Conference on Artificial Intelligence and Computer Vision (AICV’2023) which will be held in Marrakesh, Morocco, during March 05–07, 2023. This international conference, which highlighted essential research and developments in the fields of artificial intelligence and computer visions, was organized by the computer, Networks, Mobility and Modeling Laboratory (IR2M), Faculty of Sciences and Techniques, Hassan First University, Settat, Morocco, the Scientific Research Group in Egypt (SRGE), Cairo University, and the Automated Systems & Soft Computing Lab (ASSCL), Prince Sultan University, Riyadh, Saudi Arabia. The book is divided into sections, covering the following topics: swarm-based optimization mining and data analysis, deep learning and applications, machine learning and applications, image processing and computer vision, sentiment analysis, and recommendation systems, and software-defined network and telecommunication.
Publisher: Springer Nature
ISBN: 3031277627
Category : Technology & Engineering
Languages : en
Pages : 616
Book Description
This book presents the proceedings of the 3rd International Conference on Artificial Intelligence and Computer Vision (AICV’2023) which will be held in Marrakesh, Morocco, during March 05–07, 2023. This international conference, which highlighted essential research and developments in the fields of artificial intelligence and computer visions, was organized by the computer, Networks, Mobility and Modeling Laboratory (IR2M), Faculty of Sciences and Techniques, Hassan First University, Settat, Morocco, the Scientific Research Group in Egypt (SRGE), Cairo University, and the Automated Systems & Soft Computing Lab (ASSCL), Prince Sultan University, Riyadh, Saudi Arabia. The book is divided into sections, covering the following topics: swarm-based optimization mining and data analysis, deep learning and applications, machine learning and applications, image processing and computer vision, sentiment analysis, and recommendation systems, and software-defined network and telecommunication.
Photosynthesis-Assisted Energy Generation
Author: Sathish-Kumar Kamaraj
Publisher: John Wiley & Sons
ISBN: 139417232X
Category : Technology & Engineering
Languages : en
Pages : 420
Book Description
Photosynthesis-Assisted Energy Generation Describes the mechanisms of and potential for using microorganisms and plants as renewable power resources Bridging the knowledge gap between the fundamentals and the technological advances in biological photosynthesis-assisted energy generation, Photosynthesis-Assisted Energy Generation explores the various diverse light-harvesting biological systems for electricity generation and explains the fundamentals and applications from lab-scale to in-field. The text discusses the fundamentals of electron transfer mechanisms in photosynthetic systems, basic principles of bioelectricity generation, and materials involved in the construction of fuel cells, including not only the impact of higher plants, but also anoxygenic and oxygenic photosynthetic bacteria and microalgae on the performance of photosynthesis-assisted power generation systems. A timely resource, the text features case studies on emerging topics such as mosses in power generation on green roofs and photo-bioelectrochemical fuel cells for antibiotics and dyes removal, along with discussion of sustainability issues when scaling up bio-photo-electrochemical systems. Edited by two highly qualified and accomplished academics with significant research experience in the field, Photosynthesis-Assisted Energy Generation includes information on: Role of functional materials involved in photosynthesis-assisted power generation and non-noble electrocatalysts as air cathodes in biocells Electricity generation and intensified synthesis of nutrients by plant-based biofuel cells using duckweeds as biocatalysts Algae-based microbial fuel cells, photosynthetic bacteria-based microbial fuel cells, and bryophyte microbial fuel cell systems Progress and recent trends of application of low-energy consuming devices and IoT based on photosynthesis-assisted power generation Plant-based microbial fuel cells for bioremediation, biosensing, and plant health monitoring With full coverage of an attractive renewable energy generation system, Photosynthesis-Assisted Energy Generation is an essential resource on the subject for researchers and scientists interested in alternative renewable energetics and photosynthesis-assisted energy generation processes utilizing microorganisms, algae, plants, and other bioinspired materials.
Publisher: John Wiley & Sons
ISBN: 139417232X
Category : Technology & Engineering
Languages : en
Pages : 420
Book Description
Photosynthesis-Assisted Energy Generation Describes the mechanisms of and potential for using microorganisms and plants as renewable power resources Bridging the knowledge gap between the fundamentals and the technological advances in biological photosynthesis-assisted energy generation, Photosynthesis-Assisted Energy Generation explores the various diverse light-harvesting biological systems for electricity generation and explains the fundamentals and applications from lab-scale to in-field. The text discusses the fundamentals of electron transfer mechanisms in photosynthetic systems, basic principles of bioelectricity generation, and materials involved in the construction of fuel cells, including not only the impact of higher plants, but also anoxygenic and oxygenic photosynthetic bacteria and microalgae on the performance of photosynthesis-assisted power generation systems. A timely resource, the text features case studies on emerging topics such as mosses in power generation on green roofs and photo-bioelectrochemical fuel cells for antibiotics and dyes removal, along with discussion of sustainability issues when scaling up bio-photo-electrochemical systems. Edited by two highly qualified and accomplished academics with significant research experience in the field, Photosynthesis-Assisted Energy Generation includes information on: Role of functional materials involved in photosynthesis-assisted power generation and non-noble electrocatalysts as air cathodes in biocells Electricity generation and intensified synthesis of nutrients by plant-based biofuel cells using duckweeds as biocatalysts Algae-based microbial fuel cells, photosynthetic bacteria-based microbial fuel cells, and bryophyte microbial fuel cell systems Progress and recent trends of application of low-energy consuming devices and IoT based on photosynthesis-assisted power generation Plant-based microbial fuel cells for bioremediation, biosensing, and plant health monitoring With full coverage of an attractive renewable energy generation system, Photosynthesis-Assisted Energy Generation is an essential resource on the subject for researchers and scientists interested in alternative renewable energetics and photosynthesis-assisted energy generation processes utilizing microorganisms, algae, plants, and other bioinspired materials.
Neuromorphic Computing
Author:
Publisher: BoD – Books on Demand
ISBN: 1803561432
Category : Computers
Languages : en
Pages : 298
Book Description
Dive into the cutting-edge world of Neuromorphic Computing, a groundbreaking volume that unravels the secrets of brain-inspired computational paradigms. Spanning neuroscience, artificial intelligence, and hardware design, this book presents a comprehensive exploration of neuromorphic systems, empowering both experts and newcomers to embrace the limitless potential of brain-inspired computing. Discover the fundamental principles that underpin neural computation as we journey through the origins of neuromorphic architectures, meticulously crafted to mimic the brain’s intricate neural networks. Unlock the true essence of learning mechanisms – unsupervised, supervised, and reinforcement learning – and witness how these innovations are shaping the future of artificial intelligence.
Publisher: BoD – Books on Demand
ISBN: 1803561432
Category : Computers
Languages : en
Pages : 298
Book Description
Dive into the cutting-edge world of Neuromorphic Computing, a groundbreaking volume that unravels the secrets of brain-inspired computational paradigms. Spanning neuroscience, artificial intelligence, and hardware design, this book presents a comprehensive exploration of neuromorphic systems, empowering both experts and newcomers to embrace the limitless potential of brain-inspired computing. Discover the fundamental principles that underpin neural computation as we journey through the origins of neuromorphic architectures, meticulously crafted to mimic the brain’s intricate neural networks. Unlock the true essence of learning mechanisms – unsupervised, supervised, and reinforcement learning – and witness how these innovations are shaping the future of artificial intelligence.
Machine Learning Applications in Electronic Design Automation
Author: Haoxing Ren
Publisher: Springer Nature
ISBN: 303113074X
Category : Technology & Engineering
Languages : en
Pages : 585
Book Description
This book serves as a single-source reference to key machine learning (ML) applications and methods in digital and analog design and verification. Experts from academia and industry cover a wide range of the latest research on ML applications in electronic design automation (EDA), including analysis and optimization of digital design, analysis and optimization of analog design, as well as functional verification, FPGA and system level designs, design for manufacturing (DFM), and design space exploration. The authors also cover key ML methods such as classical ML, deep learning models such as convolutional neural networks (CNNs), graph neural networks (GNNs), generative adversarial networks (GANs) and optimization methods such as reinforcement learning (RL) and Bayesian optimization (BO). All of these topics are valuable to chip designers and EDA developers and researchers working in digital and analog designs and verification.
Publisher: Springer Nature
ISBN: 303113074X
Category : Technology & Engineering
Languages : en
Pages : 585
Book Description
This book serves as a single-source reference to key machine learning (ML) applications and methods in digital and analog design and verification. Experts from academia and industry cover a wide range of the latest research on ML applications in electronic design automation (EDA), including analysis and optimization of digital design, analysis and optimization of analog design, as well as functional verification, FPGA and system level designs, design for manufacturing (DFM), and design space exploration. The authors also cover key ML methods such as classical ML, deep learning models such as convolutional neural networks (CNNs), graph neural networks (GNNs), generative adversarial networks (GANs) and optimization methods such as reinforcement learning (RL) and Bayesian optimization (BO). All of these topics are valuable to chip designers and EDA developers and researchers working in digital and analog designs and verification.
Applications in Electronics Pervading Industry, Environment and Society
Author: Francesco Bellotti
Publisher: Springer Nature
ISBN: 3031481216
Category : Technology & Engineering
Languages : en
Pages : 523
Book Description
This book provides a thorough overview of cutting-edge research on electronics applications relevant to industry, the environment, and society at large. It covers a broad spectrum of application domains, from automotive to space and from health to security, while devoting special attention to the use of embedded devices and sensors for imaging, communication, and control. The book is based on the 2023 ApplePies Conference, held in Genoa, Italy, in September 2023, which brought together researchers and stakeholders to consider the most significant current trends in the field of applied electronics and to debate visions for the future. Areas addressed by the conference included information communication technology; biotechnology and biomedical imaging; space; secure, clean, and efficient energy; the environment; and smart, green, and integrated transport. As electronics technology continues to develop apace, constantly meeting previously unthinkable targets, further attention needs to be directed toward the electronics applications and the development of systems that facilitate human activities. This book, written by industrial and academic professionals, represents a valuable contribution in this endeavor.
Publisher: Springer Nature
ISBN: 3031481216
Category : Technology & Engineering
Languages : en
Pages : 523
Book Description
This book provides a thorough overview of cutting-edge research on electronics applications relevant to industry, the environment, and society at large. It covers a broad spectrum of application domains, from automotive to space and from health to security, while devoting special attention to the use of embedded devices and sensors for imaging, communication, and control. The book is based on the 2023 ApplePies Conference, held in Genoa, Italy, in September 2023, which brought together researchers and stakeholders to consider the most significant current trends in the field of applied electronics and to debate visions for the future. Areas addressed by the conference included information communication technology; biotechnology and biomedical imaging; space; secure, clean, and efficient energy; the environment; and smart, green, and integrated transport. As electronics technology continues to develop apace, constantly meeting previously unthinkable targets, further attention needs to be directed toward the electronics applications and the development of systems that facilitate human activities. This book, written by industrial and academic professionals, represents a valuable contribution in this endeavor.
Digital Twins
Author: Sunil Gupta
Publisher: Springer Nature
ISBN: 3031765648
Category :
Languages : en
Pages : 205
Book Description
Publisher: Springer Nature
ISBN: 3031765648
Category :
Languages : en
Pages : 205
Book Description
Proceeding of Fifth International Conference on Microelectronics, Computing and Communication Systems
Author: Vijay Nath
Publisher: Springer Nature
ISBN: 9811602751
Category : Technology & Engineering
Languages : en
Pages : 855
Book Description
This book presents high-quality papers from the Fifth International Conference on Microelectronics, Computing & Communication Systems (MCCS 2020). It discusses the latest technological trends and advances in MEMS and nanoelectronics, wireless communication, optical communication, instrumentation, signal processing, image processing, bioengineering, green energy, hybrid vehicles, environmental science, weather forecasting, cloud computing, renewable energy, RFID, CMOS sensors, actuators, transducers, telemetry systems, embedded systems and sensor network applications. It includes papers based on original theoretical, practical and experimental simulations, development, applications, measurements and testing. The applications and solutions discussed here provide excellent reference material for future product development.
Publisher: Springer Nature
ISBN: 9811602751
Category : Technology & Engineering
Languages : en
Pages : 855
Book Description
This book presents high-quality papers from the Fifth International Conference on Microelectronics, Computing & Communication Systems (MCCS 2020). It discusses the latest technological trends and advances in MEMS and nanoelectronics, wireless communication, optical communication, instrumentation, signal processing, image processing, bioengineering, green energy, hybrid vehicles, environmental science, weather forecasting, cloud computing, renewable energy, RFID, CMOS sensors, actuators, transducers, telemetry systems, embedded systems and sensor network applications. It includes papers based on original theoretical, practical and experimental simulations, development, applications, measurements and testing. The applications and solutions discussed here provide excellent reference material for future product development.
Direct Copper Interconnection for Advanced Semiconductor Technology
Author: Dongkai Shangguan
Publisher: CRC Press
ISBN: 1040028640
Category : Technology & Engineering
Languages : en
Pages : 463
Book Description
In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come. This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book. The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.
Publisher: CRC Press
ISBN: 1040028640
Category : Technology & Engineering
Languages : en
Pages : 463
Book Description
In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come. This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book. The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.
VLSI for Embedded Intelligence
Author: Anu Gupta
Publisher: Springer Nature
ISBN: 9819737567
Category :
Languages : en
Pages : 404
Book Description
Publisher: Springer Nature
ISBN: 9819737567
Category :
Languages : en
Pages : 404
Book Description
Sustainable Technology and Advanced Computing in Electrical Engineering
Author: Vasundhara Mahajan
Publisher: Springer Nature
ISBN: 9811943648
Category : Technology & Engineering
Languages : en
Pages : 1205
Book Description
The book includes peer-reviewed papers of the International Conference on Sustainable Technology and Advanced Computing in Electrical Engineering (ICSTACE 2021). The main focus of the book is electrical engineering. The conference aims to provide a global platform to the researchers for sharing and showcasing their discoveries/findings/innovations. The book focuses on the areas related to sustainable development and includes research works from academicians and industry experts. The book discusses new challenges and provides solutions at the interface of technology, information, complex systems, and future research directions.
Publisher: Springer Nature
ISBN: 9811943648
Category : Technology & Engineering
Languages : en
Pages : 1205
Book Description
The book includes peer-reviewed papers of the International Conference on Sustainable Technology and Advanced Computing in Electrical Engineering (ICSTACE 2021). The main focus of the book is electrical engineering. The conference aims to provide a global platform to the researchers for sharing and showcasing their discoveries/findings/innovations. The book focuses on the areas related to sustainable development and includes research works from academicians and industry experts. The book discusses new challenges and provides solutions at the interface of technology, information, complex systems, and future research directions.