VLSI-SOC: From Systems to Chips PDF Download
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Author: Manfred Glesner
Publisher: Springer
ISBN: 0387334033
Category : Computers
Languages : en
Pages : 315
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Book Description
This book contains extended and revised versions of the best papers that have been presented during the twelfth edition of the IFIP TC10/WG10.5 International Conference on Very Large Scale Integration, a Global System-on-a-Chip Design & CAD Conference. The 12* edition was held at the Lufthansa Training Center in Seeheim-Jugenheim, south of Darmstadt, Germany (December 1-3, 2003). Previous conferences have taken place in Edinburgh (81), Trondheim (83), Tokyo (85), Vancouver (87), Munich (89), Edinburgh (91), Grenoble (93), Tokyo (95), Gramado (97), Lisbon (99)andMontpellier(01). The purpose of this conference, sponsored by IFIP TC 10 Working Group 10.5, is to provide a forum to exchange ideas and show research results in the field of microelectronics design. The current trend toward increasing chip integration brings about exhilarating new challenges both at the physical and system-design levels: this conference aims to address these exciting new issues. The 2003 edition of VLSI-SoC conserved the traditional structure, which has been successful in previous editions. The quality of submissions (142 papers) made the selection process difficult, but finally 57 papers and 14 posters were accepted for presentation in VLSI-SoC 2003. Submissions came from Austria, Bulgaria, Brazil, Canada, Egypt, England, Estonia, Finland, France, Germany, Greece, Hungary, India, Iran, Israel, Italy, Japan, Korea, Malaysia, Mexico, Netherlands, Poland, Portugal, Romania, Spain, Sweden, Taiwan and the United States of America. From 57 papers presented at the conference, 18 were selected to have an extended and revised version included in this book.
Author: Manfred Glesner
Publisher: Springer
ISBN: 0387334033
Category : Computers
Languages : en
Pages : 315
Get Book Here
Book Description
This book contains extended and revised versions of the best papers that have been presented during the twelfth edition of the IFIP TC10/WG10.5 International Conference on Very Large Scale Integration, a Global System-on-a-Chip Design & CAD Conference. The 12* edition was held at the Lufthansa Training Center in Seeheim-Jugenheim, south of Darmstadt, Germany (December 1-3, 2003). Previous conferences have taken place in Edinburgh (81), Trondheim (83), Tokyo (85), Vancouver (87), Munich (89), Edinburgh (91), Grenoble (93), Tokyo (95), Gramado (97), Lisbon (99)andMontpellier(01). The purpose of this conference, sponsored by IFIP TC 10 Working Group 10.5, is to provide a forum to exchange ideas and show research results in the field of microelectronics design. The current trend toward increasing chip integration brings about exhilarating new challenges both at the physical and system-design levels: this conference aims to address these exciting new issues. The 2003 edition of VLSI-SoC conserved the traditional structure, which has been successful in previous editions. The quality of submissions (142 papers) made the selection process difficult, but finally 57 papers and 14 posters were accepted for presentation in VLSI-SoC 2003. Submissions came from Austria, Bulgaria, Brazil, Canada, Egypt, England, Estonia, Finland, France, Germany, Greece, Hungary, India, Iran, Israel, Italy, Japan, Korea, Malaysia, Mexico, Netherlands, Poland, Portugal, Romania, Spain, Sweden, Taiwan and the United States of America. From 57 papers presented at the conference, 18 were selected to have an extended and revised version included in this book.
Author: Andreas Burg
Publisher: Springer
ISBN: 3642450733
Category : Computers
Languages : en
Pages : 245
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Book Description
This book contains extended and revised versions of the best papers presented at the 20th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2012, held in Santa Cruz, CA, USA, in October 2012. The 12 papers included in the book were carefully reviewed and selected from the 33 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of these systems.
Author: Veena S. Chakravarthi
Publisher: Springer Nature
ISBN: 3031183630
Category : Technology & Engineering
Languages : en
Pages : 355
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Book Description
Now in a thoroughly revised second edition, this practical practitioner guide provides a comprehensive overview of the SoC design process. It explains end-to-end system on chip (SoC) design processes and includes updated coverage of design methodology, the design environment, EDA tool flow, design decisions, choice of design intellectual property (IP) cores, sign-off procedures, and design infrastructure requirements. The second edition provides new information on SOC trends and updated design cases. Coverage also includes critical advanced guidance on the latest UPF-based low power design flow, challenges of deep submicron technologies, and 3D design fundamentals, which will prepare the readers for the challenges of working at the nanotechnology scale. A Practical Approach to VLSI System on Chip (SoC) Design: A Comprehensive Guide, Second Edition provides engineers who aspire to become VLSI designers with all the necessary information and details of EDA tools. It will be a valuable professional reference for those working on VLSI design and verification portfolios in complex SoC designs
Author: Michail Maniatakos
Publisher: Springer
ISBN: 303015663X
Category : Computers
Languages : en
Pages : 271
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Book Description
This book contains extended and revised versions of the best papers presented at the 25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, held in Abu Dhabi, United Arab Emirates, in August 2017. The 11 papers included in this book were carefully reviewed and selected from the 33 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the latest scientific and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) Design. On the occasion of the silver jubilee of the VLSI-SoC conference series the book also includes a special chapter that presents the history of the VLSI-SoC series of conferences and its relation with VLSI-SoC evolution since the early 80s up to the present.
Author: Ming-Bo Lin
Publisher: CRC Press
ISBN: 1439897328
Category : Technology & Engineering
Languages : en
Pages : 890
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Book Description
With the advance of semiconductors and ubiquitous computing, the use of system-on-a-chip (SoC) has become an essential technique to reduce product cost. With this progress and continuous reduction of feature sizes, and the development of very large-scale integration (VLSI) circuits, addressing the harder problems requires fundamental understanding
Author: Michael Stefano Fritz Schaffner
Publisher: BoD – Books on Demand
ISBN: 3866286244
Category : Science
Languages : en
Pages : 294
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Book Description
Multiview autostereoscopic displays (MADs) make it possible to view video content in 3D without wearing special glasses, and such displays have recently become available. The main problem of MADs is that they require several (typically 8 or 9) views, while most of the 3D video content is in stereoscopic 3D today. To bridge this content-display gap, the research community started to devise automatic multiview synthesis (MVS) methods. Common MVS methods are based on depth-image-based rendering, where a dense depth map of the scene is used to reproject the image to new viewpoints. Although physically correct, this approach requires accurate depth maps and additional inpainting steps. Our work uses an alternative conversion concept based on image domain warping (IDW) which has been successfully applied to related problems such as aspect ratio retargeting for streaming video, and dispa- rity remapping for depth adjustments in stereoscopic 3D content. IDW shows promising performance in this context as it only requires robust, sparse point- correspondences and no inpainting steps. However, MVS, using IDW as well as alternative approaches, is computationally demanding and requires realtime processing - yet such methods should be portable to end-user and even mobile devices to develop their full potential. To this end, this thesis investigates efficient algorithms and hardware architectures for a variety of subproblems arising in the MVS pipeline.
Author: Kurt Hoffmann
Publisher: John Wiley & Sons
ISBN: 0470020695
Category : Technology & Engineering
Languages : en
Pages : 510
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Book Description
The development of large-scale integrated systems on a chip has had a dramatic effect on circuit design methodology. Recent years have seen an escalation of interest in systems level integration (system-on-a-chip) and the development of low power, high chip density circuits and systems. Kurt Hoffmann sets out to address a wide range of issues relating to the design and integration of integrated circuit components and provides readers with the methodology by which simple equations for the estimation of transistor geometries and circuit behaviour can be deduced. The broad coverage of this unique book ranges from field effect transistor design, MOS transistor modelling and the fundamentals of digital CMOS circuit design through to MOS memory architecture and design. Highlights the increasing requirement for information on system-on-a-chip design and integration. Combines coverage of semiconductor physics, digital VLSI design and analog integrated circuits in one volume for the first time. Written with the aim of bridging the gap between semiconductor device physics and practical circuit design. Introduces the basic behaviour of semiconductor components for ICs and covers the design of both digital and analog circuits in CMOS and BiCMOS technologies. Broad coverage will appeal to both students and practising engineers alike. Written by a respected expert in the field with a proven track record of publications in this field. Drawing upon considerable experience within both industry and academia, Hoffmann’s outstanding text, will prove an invaluable resource for designers, practising engineers in the semiconductor device field and electronics systems industry as well as Postgraduate students of microelectronics, electrical and computer engineering.
Author: Pascal Meinerzhagen
Publisher: Springer
ISBN: 3319604023
Category : Technology & Engineering
Languages : en
Pages : 151
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Book Description
This book pioneers the field of gain-cell embedded DRAM (GC-eDRAM) design for low-power VLSI systems-on-chip (SoCs). Novel GC-eDRAMs are specifically designed and optimized for a range of low-power VLSI SoCs, ranging from ultra-low power to power-aware high-performance applications. After a detailed review of prior-art GC-eDRAMs, an analytical retention time distribution model is introduced and validated by silicon measurements, which is key for low-power GC-eDRAM design. The book then investigates supply voltage scaling and near-threshold voltage (NTV) operation of a conventional gain cell (GC), before presenting novel GC circuit and assist techniques for NTV operation, including a 3-transistor full transmission-gate write port, reverse body biasing (RBB), and a replica technique for optimum refresh timing. Next, conventional GC bitcells are evaluated under aggressive technology and voltage scaling (down to the subthreshold domain), before novel bitcells for aggressively scaled CMOS nodes and soft-error tolerance as presented, including a 4-transistor GC with partial internal feedback and a 4-transistor GC with built-in redundancy.
Author: Andreas Burg
Publisher:
ISBN: 9783642450747
Category :
Languages : en
Pages : 248
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Book Description
Author: Wael Badawy
Publisher: Springer Science & Business Media
ISBN: 1461503515
Category : Technology & Engineering
Languages : en
Pages : 464
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Book Description
System-on-Chip for Real-Time Applications will be of interest to engineers, both in industry and academia, working in the area of SoC VLSI design and application. It will also be useful to graduate and undergraduate students in electrical and computer engineering and computer science. A selected set of papers from the 2nd International Workshop on Real-Time Applications were used to form the basis of this book. It is organized into the following chapters: -Introduction; -Design Reuse; -Modeling; -Architecture; -Design Techniques; -Memory; -Circuits; -Low Power; -Interconnect and Technology; -MEMS. System-on-Chip for Real-Time Applications contains many signal processing applications and will be of particular interest to those working in that community.
