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Author: Alex Orailoglu
Publisher: Springer
ISBN: 3319237993
Category : Computers
Languages : en
Pages : 279
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Book Description
This book contains extended and revised versions of the best papers presented at the 21st IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2013, held in Istanbul, Turkey, in October 2013. The 11 papers included in the book were carefully reviewed and selected from the 48 full papers presented at the conference. An extended version of a previously unpublished high-quality paper from VLSI-SoC 2012 is also included. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of these systems.
Author: Alex Orailoglu
Publisher: Springer
ISBN: 3319237993
Category : Computers
Languages : en
Pages : 279
Get Book Here
Book Description
This book contains extended and revised versions of the best papers presented at the 21st IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2013, held in Istanbul, Turkey, in October 2013. The 11 papers included in the book were carefully reviewed and selected from the 48 full papers presented at the conference. An extended version of a previously unpublished high-quality paper from VLSI-SoC 2012 is also included. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of these systems.
Author: Alex Orailoglu
Publisher:
ISBN: 9783319238005
Category :
Languages : en
Pages :
Get Book Here
Book Description
This book contains extended and revised versions of the best papers presented at the 21st IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2013, held in Istanbul, Turkey, in October 2013. The 11 papers included in the book were carefully reviewed and selected from the 48 full papers presented at the conference. An extended version of a previously unpublished high-quality paper from VLSI-SoC 2012 is also included. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of these systems.
Author: Michail Maniatakos
Publisher: Springer
ISBN: 303015663X
Category : Computers
Languages : en
Pages : 257
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Book Description
This book contains extended and revised versions of the best papers presented at the 25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, held in Abu Dhabi, United Arab Emirates, in August 2017. The 11 papers included in this book were carefully reviewed and selected from the 33 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the latest scientific and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) Design. On the occasion of the silver jubilee of the VLSI-SoC conference series the book also includes a special chapter that presents the history of the VLSI-SoC series of conferences and its relation with VLSI-SoC evolution since the early 80s up to the present.
Author: Michael Stefano Fritz Schaffner
Publisher: BoD – Books on Demand
ISBN: 3866286244
Category : Science
Languages : en
Pages : 294
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Book Description
Multiview autostereoscopic displays (MADs) make it possible to view video content in 3D without wearing special glasses, and such displays have recently become available. The main problem of MADs is that they require several (typically 8 or 9) views, while most of the 3D video content is in stereoscopic 3D today. To bridge this content-display gap, the research community started to devise automatic multiview synthesis (MVS) methods. Common MVS methods are based on depth-image-based rendering, where a dense depth map of the scene is used to reproject the image to new viewpoints. Although physically correct, this approach requires accurate depth maps and additional inpainting steps. Our work uses an alternative conversion concept based on image domain warping (IDW) which has been successfully applied to related problems such as aspect ratio retargeting for streaming video, and dispa- rity remapping for depth adjustments in stereoscopic 3D content. IDW shows promising performance in this context as it only requires robust, sparse point- correspondences and no inpainting steps. However, MVS, using IDW as well as alternative approaches, is computationally demanding and requires realtime processing - yet such methods should be portable to end-user and even mobile devices to develop their full potential. To this end, this thesis investigates efficient algorithms and hardware architectures for a variety of subproblems arising in the MVS pipeline.
Author: Victor Champac
Publisher: Springer
ISBN: 3319754653
Category : Technology & Engineering
Languages : en
Pages : 195
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Book Description
This book discusses the digital design of integrated circuits under process variations, with a focus on design-time solutions. The authors describe a step-by-step methodology, going from logic gates to logic paths to the circuit level. Topics are presented in comprehensively, without overwhelming use of analytical formulations. Emphasis is placed on providing digital designers with understanding of the sources of process variations, their impact on circuit performance and tools for improving their designs to comply with product specifications. Various circuit-level “design hints” are highlighted, so that readers can use then to improve their designs. A special treatment is devoted to unique design issues and the impact of process variations on the performance of FinFET based circuits. This book enables readers to make optimal decisions at design time, toward more efficient circuits, with better yield and higher reliability.
Author: Andrea Calimera
Publisher:
ISBN: 9783030816421
Category :
Languages : en
Pages : 0
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Book Description
This book contains extended and revised versions of the best papers presented at the 28th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2020, held in Salt Lake City, UT, USA, in October 2020.* The 16 full papers included in this volume were carefully reviewed and selected from the 38 papers (out of 74 submissions) presented at the conference. The papers discuss the latest academic and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) design, considering the challenges of nano-scale, state-of-the-art and emerging manufacturing technologies. In particular they address cutting-edge research fields like low-power design of RF, analog and mixed-signal circuits, EDA tools for the synthesis and verification of heterogenous SoCs, accelerators for cryptography and deep learning and on-chip Interconnection system, reliability and testing, and integration of 3D-ICs. *The conference was held virtually.
Author: Vladan Popovic
Publisher: Springer
ISBN: 331959057X
Category : Technology & Engineering
Languages : en
Pages : 263
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Book Description
This book discusses the design of multi-camera systems and their application to fields such as the virtual reality, gaming, film industry, medicine, automotive industry, drones, etc. The authors cover the basics of image formation, algorithms for stitching a panoramic image from multiple cameras, and multiple real-time hardware system architectures, in order to have panoramic videos. Several specific applications of multi-camera systems are presented, such as depth estimation, high dynamic range imaging, and medical imaging.
Author: Andrea Calimera
Publisher: Springer Nature
ISBN: 3030816419
Category : Computers
Languages : en
Pages : 372
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Book Description
This book contains extended and revised versions of the best papers presented at the 28th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2020, held in Salt Lake City, UT, USA, in October 2020.* The 16 full papers included in this volume were carefully reviewed and selected from the 38 papers (out of 74 submissions) presented at the conference. The papers discuss the latest academic and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) design, considering the challenges of nano-scale, state-of-the-art and emerging manufacturing technologies. In particular they address cutting-edge research fields like low-power design of RF, analog and mixed-signal circuits, EDA tools for the synthesis and verification of heterogenous SoCs, accelerators for cryptography and deep learning and on-chip Interconnection system, reliability and testing, and integration of 3D-ICs. *The conference was held virtually.
Author: Giovanni De Micheli
Publisher: Springer
ISBN: 0387749098
Category : Computers
Languages : en
Pages : 397
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Book Description
This book contains extended and revised versions of the best papers presented during the fourteenth IFIP TC 10/WG 10.5 International Conference on Very Large Scale Integration. This conference provides a forum to exchange ideas and show industrial and academic research results in microelectronics design. The current trend toward increasing chip integration and technology process advancements brings about stimulating new challenges both at the physical and system-design levels.
Author: Jose L. Ayala
Publisher: Springer
ISBN: 9783642285677
Category : Computers
Languages : en
Pages : 358
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Book Description
This book contains extended and revised versions of the best papers presented at the 18th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2010, held in Madrid, Spain, in September 2010. The 14 papers included in the book were carefully reviewed and selected from the 52 full papers presented at the conference. The papers cover a wide variety of excellence in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems.
