VLSI Fabrication Principles PDF Download
Are you looking for read ebook online? Search for your book and save it on your Kindle device, PC, phones or tablets. Download VLSI Fabrication Principles PDF full book. Access full book title VLSI Fabrication Principles by Sorab Khushro Ghandhi. Download full books in PDF and EPUB format.
Author: Sorab Khushro Ghandhi
Publisher: Wiley-Interscience
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 876
Get Book Here
Book Description
In some places, the order of presentation has been changed to fine-tune the book's effectiveness as a senior and graduate-level teaching text. Fabrication principles covered include those for such circuits as CMOS, BIPOLAR, BICMOS, FET, and more.
Author: Sorab Khushro Ghandhi
Publisher: Wiley-Interscience
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 876
Get Book Here
Book Description
In some places, the order of presentation has been changed to fine-tune the book's effectiveness as a senior and graduate-level teaching text. Fabrication principles covered include those for such circuits as CMOS, BIPOLAR, BICMOS, FET, and more.
Author: Sorab K. Ghandhi
Publisher: John Wiley & Sons
ISBN: 0471580058
Category : Technology & Engineering
Languages : en
Pages : 870
Get Book Here
Book Description
Fully updated with the latest technologies, this edition covers thefundamental principles underlying fabrication processes forsemiconductor devices along with integrated circuits made fromsilicon and gallium arsenide. Stresses fabrication criteria forsuch circuits as CMOS, bipolar, MOS, FET, etc. These diversetechnologies are introduced separately and then consolidated intocomplete circuits. An Instructor's Manual presenting detailed solutions to all theproblems in the book is available from the Wiley editorialdepartment.
Author: Prem Pal
Publisher: CRC Press
ISBN: 1315341271
Category : Science
Languages : en
Pages : 315
Get Book Here
Book Description
Microelectromechanical systems (MEMS)-based sensors and actuators have become remarkably popular in the past few decades. Rapid advances have taken place in terms of both technologies and techniques of fabrication of MEMS structures. Wet chemical–based silicon bulk micromachining continues to be a widely used technique for the fabrication of microstructures used in MEMS devices. Researchers all over the world have contributed significantly to the advancement of wet chemical–based micromachining, from understanding the etching mechanism to exploring its application to the fabrication of simple to complex MEMS structures. In addition to its various benefits, one of the unique features of wet chemical–based bulk micromachining is the ability to fabricate slanted sidewalls, such as 45° walls as micromirrors, as well as freestanding structures, such as cantilevers and diaphragms. This makes wet bulk micromachining necessary for the fabrication of structures for myriad applications. This book provides a comprehensive understating of wet bulk micromachining for the fabrication of simple to advanced microstructures for various applications in MEMS. It includes introductory to advanced concepts and covers research on basic and advanced topics on wet chemical–based silicon bulk micromachining. The book thus serves as an introductory textbook for undergraduate- and graduate-level students of physics, chemistry, electrical and electronic engineering, materials science, and engineering, as well as a comprehensive reference for researchers working or aspiring to work in the area of MEMS and for engineers working in microfabrication technology.
Author: John E. Ayers
Publisher: CRC Press
ISBN: 1482254360
Category : Technology & Engineering
Languages : en
Pages : 660
Get Book Here
Book Description
In the past ten years, heteroepitaxy has continued to increase in importance with the explosive growth of the electronics industry and the development of a myriad of heteroepitaxial devices for solid state lighting, green energy, displays, communications, and digital computing. Our ever-growing understanding of the basic physics and chemistry underlying heteroepitaxy, especially lattice relaxation and dislocation dynamic, has enabled an ever-increasing emphasis on metamorphic devices. To reflect this focus, two all-new chapters have been included in this new edition. One chapter addresses metamorphic buffer layers, and the other covers metamorphic devices. The remaining seven chapters have been revised extensively with new material on crystal symmetry and relationships, III-nitride materials, lattice relaxation physics and models, in-situ characterization, and reciprocal space maps.
Author: Richard C. Dorf
Publisher: CRC Press
ISBN: 9781420049763
Category : Technology & Engineering
Languages : en
Pages : 2758
Get Book Here
Book Description
In 1993, the first edition of The Electrical Engineering Handbook set a new standard for breadth and depth of coverage in an engineering reference work. Now, this classic has been substantially revised and updated to include the latest information on all the important topics in electrical engineering today. Every electrical engineer should have an opportunity to expand his expertise with this definitive guide. In a single volume, this handbook provides a complete reference to answer the questions encountered by practicing engineers in industry, government, or academia. This well-organized book is divided into 12 major sections that encompass the entire field of electrical engineering, including circuits, signal processing, electronics, electromagnetics, electrical effects and devices, and energy, and the emerging trends in the fields of communications, digital devices, computer engineering, systems, and biomedical engineering. A compendium of physical, chemical, material, and mathematical data completes this comprehensive resource. Every major topic is thoroughly covered and every important concept is defined, described, and illustrated. Conceptually challenging but carefully explained articles are equally valuable to the practicing engineer, researchers, and students. A distinguished advisory board and contributors including many of the leading authors, professors, and researchers in the field today assist noted author and professor Richard Dorf in offering complete coverage of this rapidly expanding field. No other single volume available today offers this combination of broad coverage and depth of exploration of the topics. The Electrical Engineering Handbook will be an invaluable resource for electrical engineers for years to come.
Author: Stanisław Grundas
Publisher: BoD – Books on Demand
ISBN: 9533075228
Category : Science
Languages : en
Pages : 770
Get Book Here
Book Description
The book offers comprehensive coverage of the broad range of scientific knowledge in the fields of advances in induction and microwave heating of mineral and organic materials. Beginning with industry application in many areas of practical application to mineral materials and ending with raw materials of agriculture origin the authors, specialists in different scientific area, present their results in the two sections: Section 1-Induction and Microwave Heating of Mineral Materials, and Section 2-Microwave Heating of Organic Materials.
Author: Albert G. Baca
Publisher: IET
ISBN: 9780863413537
Category : Technology & Engineering
Languages : en
Pages : 372
Get Book Here
Book Description
This book provides fundamental and practical information on all aspects of GaAs processing and gives pragmatic advice on cleaning and passivation, wet and dry etching and photolithography. Other topics covered include device performance for HBTs (Heterojunction Bipolar Transistors) and FETs (Field Effect Transistors), how these relate to processing choices, and special processing issues such as wet oxidation, which are especially important in optoelectronic devices. This book is suitable for both new and practising engineers.
Author: William S. Rees, Jr.
Publisher: John Wiley & Sons
ISBN: 352761480X
Category : Technology & Engineering
Languages : en
Pages : 441
Get Book Here
Book Description
Written by leading experts in the field, this practical reference handbook offers an up-to-date, critical survey of the chemical vapor deposition (CVD) of nonmetals, a key technology in semiconductor electronics, finishing, and corrosion protection. The basics necessary for any CVD process are discussed in the introduction. In the following chapters, precursor requirements, with an emphasis on materials chemistry, common structures of reactants and substrates, as well as reaction control are discussed for a broad range of compositions including superconducting, conducting, semiconducting, insulating and structural materials. Technological issues, such as reactor geometries and operation parameters, are assessed and the viability of the method, both technically and economically, is compared with other techniques for the preparation of thin films. Relevant materials and technical data are collected in tables throughout. An extensive glossary, list of abbreviations and acronyms, and over 1400 references round off this impressive work. The 'CVD of Nonmetals' offers a stimulating combination of basic concepts and practical applications. Materials scientists, solid-state and organometallic chemists, physicists, engineer, as well as graduate students will find this book of enomous value.
Author: Fabian Florek
Publisher: Cuvillier Verlag
ISBN: 3736983514
Category : Technology & Engineering
Languages : en
Pages : 155
Get Book Here
Book Description
Diese Arbeit untersucht das Konzept von gestapelten Fotodioden basierend auf einem MESA Prozess. Eine Fotodiode mit einer vertikalen MESA Struktur ist eine neue Herangehensweise für die Detektion von farbigem Licht. Die Ergebnisse dieser Arbeit zeigen, dass ein Sensor zur Farbdetektion, basierend auf einer MESA Struktur, möglich ist. Durch chemische Gasphasenabscheidungen wird ein n-i-p-n-i-p Stapel gewachsen, der sehr dünne p-n Übergänge besitzt. Danach werden die unterschiedlichen p-i-n Dioden mit Hilfe eines neu entwickelten Ätzprozesses separat kontaktiert. Eine freistehende MESA Struktur wird dadurch erzeugt, dass alle überflüssigen Teile der Struktur durch einen hochselektiven RIE Ätzprozess entfernt werden. Diese neu geschaffene Struktur wird dann mit einer Passivierung und Metallkontakten versehen. Dadurch ist es möglich, sehr dünne und separat kontaktierte p-n Übergänge zu schaffen. Die hergestellten Prototypen wurden einzeln und gleichzeitig spektral vermessen um eine spektrale Antwort der Dioden zu erhalten. Diese spektrale Antwort wurde durch Simulationen sowie theoretische Berechnungen bestätigt.
Author: Richard B. Fair
Publisher: Academic Press
ISBN: 0323139809
Category : Technology & Engineering
Languages : en
Pages : 441
Get Book Here
Book Description
This is the first definitive book on rapid thermal processing (RTP), an essential namufacturing technology for single-wafer processing in highly controlled environments. Written and edited by nine experts in the field, this book covers a range of topics for academics and engineers alike, moving from basic theory to advanced technology for wafer manufacturing. The book also provides new information on the suitability or RTP for thin film deposition, junction formation, silicides, epitaxy, and in situ processing. Complete discussions on equipment designs and comparisons between RTP and other processing approaches also make this book useful for supplemental information on silicon processing, VLSI processing, and integrated circuit engineering.
