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Author: Marc Heyns
Publisher: Trans Tech Publications Ltd
ISBN: 3035707200
Category : Technology & Engineering
Languages : en
Pages : 321
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Book Description
Proceedings of the 6h International Symposium on Ultra Clean Processing of Silicon Surfaces (UCPSS 2002), Held in Ostens, Belgium, September 2002
Author: Marc Heyns
Publisher: Trans Tech Publications Ltd
ISBN: 3035707200
Category : Technology & Engineering
Languages : en
Pages : 321
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Book Description
Proceedings of the 6h International Symposium on Ultra Clean Processing of Silicon Surfaces (UCPSS 2002), Held in Ostens, Belgium, September 2002
Author: Takeshi Hattori
Publisher: Springer Science & Business Media
ISBN: 3662035359
Category : Technology & Engineering
Languages : en
Pages : 634
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Book Description
A totally new concept for clean surface processing of Si wafers is introduced in this book. Some fifty distinguished researchers and engineers from the leading Japanese semiconductor companies, such as NEC, Hitachi, Toshiba, Sony and Panasonic as well as from several universities reveal to us for the first time the secrets of these highly productive institutions. They describe the techniques and equipment necessary for the preparation of clean high-quality semiconductor surfaces as a first step in high-yield/high-quality device production. This book thus opens the door to the manufacturing of reliable nanoscale devices and will be extremely useful for every engineer, physicist and technician involved in the production of silicon semiconductor devices.
Author: Marc Heyns
Publisher: Trans Tech Publications Ltd
ISBN: 3035707006
Category : Technology & Engineering
Languages : en
Pages : 332
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Book Description
UCPSS 2000
Author: Paul Mertens
Publisher: Trans Tech Publications Ltd
ISBN: 3038130257
Category : Technology & Engineering
Languages : en
Pages : 383
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Book Description
UCPSS 2004 Proceddings of the 7th International Symposium on Ultra Cleyn Processing of Silicon Surfaces (UCPSS), Brussels, Belgium, Sept. 20-22, 2004
Author:
Publisher:
ISBN:
Category : Contamination control
Languages : en
Pages : 426
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Book Description
Author: Paul Mertens
Publisher: Trans Tech Publications Ltd
ISBN: 3038131954
Category : Technology & Engineering
Languages : en
Pages : 383
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Book Description
Selected, peer reviewed papers from the 8th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS) held in Antwerp, Belgium, September 18-20, 2006
Author: Paul Mertens
Publisher: Trans Tech Publications Ltd
ISBN: 303641312X
Category : Science
Languages : en
Pages : 363
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Book Description
Selected peer-reviewed full text papers from the 16th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS 2023) Selected peer-reviewed full text papers from the 16th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS 2023), September 12-14, 2023, Brugge, Belgium
Author: Marc Heyns
Publisher:
ISBN: 9783908450573
Category : Technology & Engineering
Languages : en
Pages : 0
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Book Description
The proceedings of the Fifth International Symposium on Ultra Clean Processing of Silicon Surfaces cover all aspects of ultra-clean Si-technology: cleaning, contamination control, Si-surface chemistry and topography, and its relationship to device performance and process yield. New areas of concern include: cleaning at the interconnect level, resist strip and polymer removal (dry and wet), cleaning and contamination aspects of metallization, wafer backside cleaning and cleaning after Chemical-Mechanical-Polishing (CMP).
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 320
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Book Description
The issues addressed by the Sixth International Symposium on the Ultra Clean Processing of Silicon Surfaces included all aspects of ultra-clean Si-technology, cleaning and contamination control in both front-end-of-line (FEOL) and back-end-of-line (BEOL) processing. This covered studies of Si-surface chemistry and topography and its relationship to device performance and process yield, cleaning in relationship to new gate stacks, cleaning at the interconnect level, resist stripping and polymer removal, cleaning and contamination control of various new materials, wafer backside cleaning and cleaning following Chemical-Mechanical-Polishing (CMP). Judging from the large number of papers dealing with wet cleaning processes, it is clear that this is still the dominant cleaning technology at the moment. Various papers discussed simplified cleaning by the use of chelating additives, and single-wafer wet cleaning; which is expected to replace the more standard multi-step batch-type cleaning systems, in various applications, in the future. Several contributions dealt with new materials introduced into current process research and development: such as Cu, and especially (porous) low-k material, as well as high-k and metal gate stacks. Substantial progress had also been made in understanding the effects of megasonics, and in the area of cleaning following Chemical-Mechanical Polishing (CMP). Last, but not least, an encouraging number of contributions were presented on the relatively new topic of supercritical CO2 cleaning. Altogether, the 76 contributions presented at the symposium represent a timely and authoritative assessment of the state-of-the-art of this very interesting and essential field.
Author: Marc Heyns
Publisher:
ISBN:
Category : Contamination control
Languages : en
Pages : 388
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Book Description
