Author: Paul W. Mertens
Publisher: Trans Tech Publications Ltd
ISBN: 3035730849
Category : Technology & Engineering
Languages : en
Pages : 395
Book Description
Selected, peer reviewed papers from the 13th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS), September 12-14, 2016, Knokke, Belgium
Ultra Clean Processing of Semiconductor Surfaces XIII
Author: Paul W. Mertens
Publisher: Trans Tech Publications Ltd
ISBN: 3035730849
Category : Technology & Engineering
Languages : en
Pages : 395
Book Description
Selected, peer reviewed papers from the 13th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS), September 12-14, 2016, Knokke, Belgium
Publisher: Trans Tech Publications Ltd
ISBN: 3035730849
Category : Technology & Engineering
Languages : en
Pages : 395
Book Description
Selected, peer reviewed papers from the 13th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS), September 12-14, 2016, Knokke, Belgium
Ultraclean Surface Processing of Silicon Wafers
Author: Takeshi Hattori
Publisher: Springer Science & Business Media
ISBN: 3662035359
Category : Technology & Engineering
Languages : en
Pages : 634
Book Description
A totally new concept for clean surface processing of Si wafers is introduced in this book. Some fifty distinguished researchers and engineers from the leading Japanese semiconductor companies, such as NEC, Hitachi, Toshiba, Sony and Panasonic as well as from several universities reveal to us for the first time the secrets of these highly productive institutions. They describe the techniques and equipment necessary for the preparation of clean high-quality semiconductor surfaces as a first step in high-yield/high-quality device production. This book thus opens the door to the manufacturing of reliable nanoscale devices and will be extremely useful for every engineer, physicist and technician involved in the production of silicon semiconductor devices.
Publisher: Springer Science & Business Media
ISBN: 3662035359
Category : Technology & Engineering
Languages : en
Pages : 634
Book Description
A totally new concept for clean surface processing of Si wafers is introduced in this book. Some fifty distinguished researchers and engineers from the leading Japanese semiconductor companies, such as NEC, Hitachi, Toshiba, Sony and Panasonic as well as from several universities reveal to us for the first time the secrets of these highly productive institutions. They describe the techniques and equipment necessary for the preparation of clean high-quality semiconductor surfaces as a first step in high-yield/high-quality device production. This book thus opens the door to the manufacturing of reliable nanoscale devices and will be extremely useful for every engineer, physicist and technician involved in the production of silicon semiconductor devices.
Ultra Clean Processing of Silicon Surfaces VII
Author: Paul Mertens
Publisher: Trans Tech Publications Ltd
ISBN: 3038130257
Category : Technology & Engineering
Languages : en
Pages : 383
Book Description
UCPSS 2004 Proceddings of the 7th International Symposium on Ultra Cleyn Processing of Silicon Surfaces (UCPSS), Brussels, Belgium, Sept. 20-22, 2004
Publisher: Trans Tech Publications Ltd
ISBN: 3038130257
Category : Technology & Engineering
Languages : en
Pages : 383
Book Description
UCPSS 2004 Proceddings of the 7th International Symposium on Ultra Cleyn Processing of Silicon Surfaces (UCPSS), Brussels, Belgium, Sept. 20-22, 2004
Ultra Clean Processing of Silicon Surfaces VI
Author: Marc Heyns
Publisher: Trans Tech Publications Ltd
ISBN: 3035707200
Category : Technology & Engineering
Languages : en
Pages : 321
Book Description
Proceedings of the 6h International Symposium on Ultra Clean Processing of Silicon Surfaces (UCPSS 2002), Held in Ostens, Belgium, September 2002
Publisher: Trans Tech Publications Ltd
ISBN: 3035707200
Category : Technology & Engineering
Languages : en
Pages : 321
Book Description
Proceedings of the 6h International Symposium on Ultra Clean Processing of Silicon Surfaces (UCPSS 2002), Held in Ostens, Belgium, September 2002
Handbook of Semiconductor Manufacturing Technology
Author: Yoshio Nishi
Publisher: CRC Press
ISBN: 1351829823
Category : Technology & Engineering
Languages : en
Pages : 3276
Book Description
Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
Publisher: CRC Press
ISBN: 1351829823
Category : Technology & Engineering
Languages : en
Pages : 3276
Book Description
Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
Handbook for Cleaning for Semiconductor Manufacturing
Author: Karen A. Reinhardt
Publisher: John Wiley & Sons
ISBN: 1118099516
Category : Technology & Engineering
Languages : en
Pages : 596
Book Description
Provides an In-depth discussion of surface conditioning for semiconductor applications The Handbook of Cleaning for Semiconductor Manufacturing: Fundamentals and Applications provides an in-depth discussion of surface conditioning for semiconductor applications. The fundamental physics and chemistry associated with wet processing is reviewed as well as surface and colloidal aspects of cleaning and etching. Topics covered in this new reference include: Front end line (FEOL) and back end of line (BEOL) cleaning applications such as high-k/metal gate post-etch cleaning and pore sealing, high-dose implant stripping and cleaning, and germanium, and silicon passivation Formulation development practices, methodology and a new directions are presented including chemicals used for preventing corrosion of copper lines, cleaning aluminium lines, reclaiming wafers, and water bonding, as well as the filtering and recirculating of chemicals including reuse and recycling Wetting, cleaning, and drying of features, such as high aspect ratio features and hydrophilic surface states, especially how to dry without watermarks, the abilities to wet hydrophobic surfaces and to remove liquid from deep features The chemical reactions and mechanisms of silicon dioxide etching with hydrofluoric acid, particle removal with ammonium hydroxide/hydrogen peroxide mixture, and metal removal with hydrochloric acid The Handbook of Cleaning for Semiconductor Manufacturing: Fundamentals and Applications is a valuable resource for any engineer or manager associated with using or supplying cleaning and contamination free technologies for semiconductor manufacturing. Engineers working for semiconductor manufacturing, capital equipment, chemicals, or other industries that assures cleanliness of chemicals, material, and equipment in the manufacturing area will also find this handbook an indispensible reference.
Publisher: John Wiley & Sons
ISBN: 1118099516
Category : Technology & Engineering
Languages : en
Pages : 596
Book Description
Provides an In-depth discussion of surface conditioning for semiconductor applications The Handbook of Cleaning for Semiconductor Manufacturing: Fundamentals and Applications provides an in-depth discussion of surface conditioning for semiconductor applications. The fundamental physics and chemistry associated with wet processing is reviewed as well as surface and colloidal aspects of cleaning and etching. Topics covered in this new reference include: Front end line (FEOL) and back end of line (BEOL) cleaning applications such as high-k/metal gate post-etch cleaning and pore sealing, high-dose implant stripping and cleaning, and germanium, and silicon passivation Formulation development practices, methodology and a new directions are presented including chemicals used for preventing corrosion of copper lines, cleaning aluminium lines, reclaiming wafers, and water bonding, as well as the filtering and recirculating of chemicals including reuse and recycling Wetting, cleaning, and drying of features, such as high aspect ratio features and hydrophilic surface states, especially how to dry without watermarks, the abilities to wet hydrophobic surfaces and to remove liquid from deep features The chemical reactions and mechanisms of silicon dioxide etching with hydrofluoric acid, particle removal with ammonium hydroxide/hydrogen peroxide mixture, and metal removal with hydrochloric acid The Handbook of Cleaning for Semiconductor Manufacturing: Fundamentals and Applications is a valuable resource for any engineer or manager associated with using or supplying cleaning and contamination free technologies for semiconductor manufacturing. Engineers working for semiconductor manufacturing, capital equipment, chemicals, or other industries that assures cleanliness of chemicals, material, and equipment in the manufacturing area will also find this handbook an indispensible reference.
Properties of Crystalline Silicon
Author: Robert Hull
Publisher: IET
ISBN: 9780852969335
Category : Science
Languages : en
Pages : 1054
Book Description
A unique and well-organized reference, this book provides illuminating data, distinctive insight and expert guidance on silicon properties.
Publisher: IET
ISBN: 9780852969335
Category : Science
Languages : en
Pages : 1054
Book Description
A unique and well-organized reference, this book provides illuminating data, distinctive insight and expert guidance on silicon properties.
Analytical and Diagnostic Techniques for Semiconductor Materials, Devices and Processes
Author: Bernd O. Kolbesen (Chemiker.)
Publisher: The Electrochemical Society
ISBN: 9781566772396
Category : Technology & Engineering
Languages : en
Pages : 568
Book Description
Publisher: The Electrochemical Society
ISBN: 9781566772396
Category : Technology & Engineering
Languages : en
Pages : 568
Book Description
The Physics and Chemistry of SiO2 and the Si-SiO2 Interface-3, 1996
Author: Hisham Z. Massoud
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 804
Book Description
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 804
Book Description
CleanRooms
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 48
Book Description
A central resource of technology and methods for environments where the control of contamination is critical.
Publisher:
ISBN:
Category :
Languages : en
Pages : 48
Book Description
A central resource of technology and methods for environments where the control of contamination is critical.