Author: Paul Mertens
Publisher: Trans Tech Publications Ltd
ISBN: 3038131954
Category : Technology & Engineering
Languages : en
Pages : 383
Book Description
Selected, peer reviewed papers from the 8th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS) held in Antwerp, Belgium, September 18-20, 2006
Ultra Clean Processing of Semiconductor Surfaces VIII
Author: Paul Mertens
Publisher: Trans Tech Publications Ltd
ISBN: 3038131954
Category : Technology & Engineering
Languages : en
Pages : 383
Book Description
Selected, peer reviewed papers from the 8th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS) held in Antwerp, Belgium, September 18-20, 2006
Publisher: Trans Tech Publications Ltd
ISBN: 3038131954
Category : Technology & Engineering
Languages : en
Pages : 383
Book Description
Selected, peer reviewed papers from the 8th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS) held in Antwerp, Belgium, September 18-20, 2006
Ultra Clean Processing of Silicon Surfaces VII
Author: Paul Mertens
Publisher: Trans Tech Publications Ltd
ISBN: 3038130257
Category : Technology & Engineering
Languages : en
Pages : 383
Book Description
UCPSS 2004 Proceddings of the 7th International Symposium on Ultra Cleyn Processing of Silicon Surfaces (UCPSS), Brussels, Belgium, Sept. 20-22, 2004
Publisher: Trans Tech Publications Ltd
ISBN: 3038130257
Category : Technology & Engineering
Languages : en
Pages : 383
Book Description
UCPSS 2004 Proceddings of the 7th International Symposium on Ultra Cleyn Processing of Silicon Surfaces (UCPSS), Brussels, Belgium, Sept. 20-22, 2004
Cleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing 10
Author: Takeshi Hattori
Publisher: The Electrochemical Society
ISBN: 156677568X
Category : Microelectronics
Languages : en
Pages : 497
Book Description
This issue covers topics related to the removal of contaminants from and conditioning of Si (SOI), SiC, Ge, SiGe, and III-V semiconductor surfaces; cleaning media, including non-aqueous cleaning methods and tools; front- and back-end cleaning operations; integrated cleaning; cleaning of MEMS; photomasks (reticles); porous low-k dielectrics; post-CMP cleaning; wafer bevel cleaning and polishing; characterization, evaluation, and monitoring of cleaning; correlation with device performance as well as cleaning of equipment and storage and handling hardware. The hardcover edition includes a bonus CD-ROM of Cleaning Technology in Semiconductor Device Manufacturing 1989?2007: Proceedings from the ECS Semiconductor Cleaning Symposia 1?10. This bonus material is not available with the PDF edition.
Publisher: The Electrochemical Society
ISBN: 156677568X
Category : Microelectronics
Languages : en
Pages : 497
Book Description
This issue covers topics related to the removal of contaminants from and conditioning of Si (SOI), SiC, Ge, SiGe, and III-V semiconductor surfaces; cleaning media, including non-aqueous cleaning methods and tools; front- and back-end cleaning operations; integrated cleaning; cleaning of MEMS; photomasks (reticles); porous low-k dielectrics; post-CMP cleaning; wafer bevel cleaning and polishing; characterization, evaluation, and monitoring of cleaning; correlation with device performance as well as cleaning of equipment and storage and handling hardware. The hardcover edition includes a bonus CD-ROM of Cleaning Technology in Semiconductor Device Manufacturing 1989?2007: Proceedings from the ECS Semiconductor Cleaning Symposia 1?10. This bonus material is not available with the PDF edition.
Ultraclean Surface Processing of Silicon Wafers
Author: Takeshi Hattori
Publisher: Springer Science & Business Media
ISBN: 3662035359
Category : Technology & Engineering
Languages : en
Pages : 634
Book Description
A totally new concept for clean surface processing of Si wafers is introduced in this book. Some fifty distinguished researchers and engineers from the leading Japanese semiconductor companies, such as NEC, Hitachi, Toshiba, Sony and Panasonic as well as from several universities reveal to us for the first time the secrets of these highly productive institutions. They describe the techniques and equipment necessary for the preparation of clean high-quality semiconductor surfaces as a first step in high-yield/high-quality device production. This book thus opens the door to the manufacturing of reliable nanoscale devices and will be extremely useful for every engineer, physicist and technician involved in the production of silicon semiconductor devices.
Publisher: Springer Science & Business Media
ISBN: 3662035359
Category : Technology & Engineering
Languages : en
Pages : 634
Book Description
A totally new concept for clean surface processing of Si wafers is introduced in this book. Some fifty distinguished researchers and engineers from the leading Japanese semiconductor companies, such as NEC, Hitachi, Toshiba, Sony and Panasonic as well as from several universities reveal to us for the first time the secrets of these highly productive institutions. They describe the techniques and equipment necessary for the preparation of clean high-quality semiconductor surfaces as a first step in high-yield/high-quality device production. This book thus opens the door to the manufacturing of reliable nanoscale devices and will be extremely useful for every engineer, physicist and technician involved in the production of silicon semiconductor devices.
Cleaning Technology in Semiconductor Device Manufacturing VIII
Author: Jerzy Rużyłło
Publisher: The Electrochemical Society
ISBN: 9781566774116
Category : Technology & Engineering
Languages : en
Pages : 452
Book Description
Publisher: The Electrochemical Society
ISBN: 9781566774116
Category : Technology & Engineering
Languages : en
Pages : 452
Book Description
Ultra Clean Processing of Silicon Surfaces ...
Author:
Publisher:
ISBN:
Category : Contamination control
Languages : en
Pages : 426
Book Description
Publisher:
ISBN:
Category : Contamination control
Languages : en
Pages : 426
Book Description
Ultra Clean Processing of Silicon Surfaces VI
Author: Marc Heyns
Publisher: Trans Tech Publications Ltd
ISBN: 3035707200
Category : Technology & Engineering
Languages : en
Pages : 321
Book Description
Proceedings of the 6h International Symposium on Ultra Clean Processing of Silicon Surfaces (UCPSS 2002), Held in Ostens, Belgium, September 2002
Publisher: Trans Tech Publications Ltd
ISBN: 3035707200
Category : Technology & Engineering
Languages : en
Pages : 321
Book Description
Proceedings of the 6h International Symposium on Ultra Clean Processing of Silicon Surfaces (UCPSS 2002), Held in Ostens, Belgium, September 2002
Eighth Electronic Materials and Processing
Author: Srinivas T. Rao
Publisher: ASM International(OH)
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 256
Book Description
Publisher: ASM International(OH)
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 256
Book Description
Cleaning Technology in Semiconductor Device Manufacturing
Author:
Publisher: The Electrochemical Society
ISBN: 9781566772594
Category : Technology & Engineering
Languages : en
Pages : 636
Book Description
Publisher: The Electrochemical Society
ISBN: 9781566772594
Category : Technology & Engineering
Languages : en
Pages : 636
Book Description
Handbook of Semiconductor Manufacturing Technology
Author: Yoshio Nishi
Publisher: CRC Press
ISBN: 1420017667
Category : Technology & Engineering
Languages : en
Pages : 1722
Book Description
Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
Publisher: CRC Press
ISBN: 1420017667
Category : Technology & Engineering
Languages : en
Pages : 1722
Book Description
Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.