ULSI Process Integration 9 PDF Download
Are you looking for read ebook online? Search for your book and save it on your Kindle device, PC, phones or tablets. Download ULSI Process Integration 9 PDF full book. Access full book title ULSI Process Integration 9 by C. Claeys. Download full books in PDF and EPUB format.
Author: C. Claeys
Publisher: The Electrochemical Society
ISBN: 1607686759
Category :
Languages : en
Pages : 335
Get Book Here
Book Description
Author: C. Claeys
Publisher: The Electrochemical Society
ISBN: 1607686759
Category :
Languages : en
Pages : 335
Get Book Here
Book Description
Author: Cor L. Claeys
Publisher: The Electrochemical Society
ISBN: 9781566772419
Category : Computers
Languages : en
Pages : 408
Get Book Here
Book Description
Author: C. Claeys
Publisher: The Electrochemical Society
ISBN: 1566777445
Category : Integrated circuits
Languages : en
Pages : 547
Get Book Here
Book Description
ULSI Process Integration 6 covers all aspects of process integration. Sections are devoted to 1) Device Technologies, 2) Front-end-of-line integration (gate stacks, shallow junctions, dry etching, etc.), 3) Back-end-of-line integration (CMP, low-k, Cu interconnect, air-gaps, 3D packaging, etc.), 4) Alternative channel technologies (Ge, III-V, hybrid integration), and 5) Emerging technologies (CNT, graphene, polymer electronics, nanotubes).
Author: Electrochemical Society. Meeting
Publisher: The Electrochemical Society
ISBN: 9781566773768
Category : Technology & Engineering
Languages : en
Pages : 620
Get Book Here
Book Description
Author: C. Claeys
Publisher: The Electrochemical Society
ISBN: 1607682613
Category :
Languages : en
Pages : 429
Get Book Here
Book Description
Author: Cor L. Claeys
Publisher: The Electrochemical Society
ISBN: 1566775728
Category : Integrated circuits
Languages : en
Pages : 509
Get Book Here
Book Description
The symposium provided a forum for reviewing and discussing all aspects of process integration, with special focus on nanoscaled technologies, 65 nm and beyond on DRAM, SRAM, flash memory, high density logic-low power, RF, mixed analog-digital, process integration yield, CMP chemistries, low-k processes, gate stacks, metal gates, rapid thermal processing, silicides, copper interconnects, carbon nanotubes, novel materials, high mobility substrates (SOI, sSi, SiGe, GeOI), strain engineering, and hybrid integration.
Author: Cor L. Claeys
Publisher: The Electrochemical Society
ISBN: 9781566773089
Category : Technology & Engineering
Languages : en
Pages : 636
Get Book Here
Book Description
Author: J. Murota
Publisher: The Electrochemical Society
ISBN: 1607688212
Category :
Languages : en
Pages : 325
Get Book Here
Book Description
Author: Q. Liu
Publisher: The Electrochemical Society
ISBN: 1607688530
Category : Science
Languages : en
Pages : 450
Get Book Here
Book Description
Author: Mikhail Baklanov
Publisher: John Wiley & Sons
ISBN: 1119966868
Category : Technology & Engineering
Languages : en
Pages : 616
Get Book Here
Book Description
Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.
