Ulsi Front-end Technology: Covering From The First Semiconductor Paper To Cmos Finfet Technology PDF Download
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Author: Wai Shing Lau
Publisher: World Scientific
ISBN: 9813222174
Category : Technology & Engineering
Languages : en
Pages : 247
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Book Description
The main focus of this book is ULSI front-end technology. It covers from the early history of semiconductor science & technology from 1874 to state-of-the-art FINFET technology in 2016. Some ULSI back-end technology is also covered, for example, the science and technology of MIM capacitors for analog CMOS has been included in this book.
Author: Wai Shing Lau
Publisher: World Scientific
ISBN: 9813222174
Category : Technology & Engineering
Languages : en
Pages : 247
Get Book Here
Book Description
The main focus of this book is ULSI front-end technology. It covers from the early history of semiconductor science & technology from 1874 to state-of-the-art FINFET technology in 2016. Some ULSI back-end technology is also covered, for example, the science and technology of MIM capacitors for analog CMOS has been included in this book.
Author: Ban Wong
Publisher: John Wiley & Sons
ISBN: 0471678864
Category : Technology & Engineering
Languages : en
Pages : 413
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Book Description
Based on the authors' expansive collection of notes taken over the years, Nano-CMOS Circuit and Physical Design bridges the gap between physical and circuit design and fabrication processing, manufacturability, and yield. This innovative book covers: process technology, including sub-wavelength optical lithography; impact of process scaling on circuit and physical implementation and low power with leaky transistors; and DFM, yield, and the impact of physical implementation.
Author: Marin Alexe
Publisher: Springer Science & Business Media
ISBN: 9783540210498
Category : Science
Languages : en
Pages : 524
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Book Description
During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
Author: Michael Quirk
Publisher: Pearson
ISBN: 9780130815200
Category : Electronic industries
Languages : en
Pages : 0
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Book Description
In this book, Quirk and Serda introduce the terminology, concepts, processes, products, and equipment commonly used in the manufacture of ultra large scale integrated (ULSI) semiconductors. The book provides helpful, up-to-date technical information about semiconductor manufacturing and strikes an effective balance between the process and equipment technology found in wafer fabrications. Topics include copper interconnect; dual damascene additive process for metallization; deep UV sub-micron photolithography (.18 micron and below); low-k dielectric processing; chemical mechanical planarization; a comprehensive model of manufacturing process; chemical-mechanical polish (CMP); and maintenance and troubleshooting. For practicing semiconductor manufacturing technicians or those interested in semiconductor manufacturing technology and processes.
Author: David L. Pulfrey
Publisher: Cambridge University Press
ISBN: 1139484672
Category : Technology & Engineering
Languages : en
Pages : 355
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Book Description
Written in a concise, easy-to-read style, this text for senior undergraduate and graduate courses covers all key topics thoroughly. It is also a useful self-study guide for practising engineers who need a complete, up-to-date review of the subject. Key features: • Rigorous theoretical treatment combined with practical detail • A theoretical framework built up systematically from the Schrödinger Wave Equation and the Boltzmann Transport Equation • Covers MOSFETS, HBTs and HJFETS • Uses the PSP model for MOSFETS • Rigorous treatment of device capacitance • Describes the operation of modern, high-performance transistors and diodes • Evaluates the suitability of various transistor types and diodes for specific modern applications • Covers solar cells and LEDs and their potential impact on energy generation and reduction • Includes a chapter on nanotransistors to prepare students and professionals for the future • Provides results of detailed numerical simulations to compare with analytical solutions • End-of-chapter exercises • Online lecture slides for undergraduate and graduate courses
Author: Akhtar Kalam
Publisher: Springer
ISBN: 9811047650
Category : Technology & Engineering
Languages : en
Pages : 797
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Book Description
This book is a compilation of research work in the interdisciplinary areas of electronics, communication, and computing. This book is specifically targeted at students, research scholars and academicians. The book covers the different approaches and techniques for specific applications, such as particle-swarm optimization, Otsu’s function and harmony search optimization algorithm, triple gate silicon on insulator (SOI)MOSFET, micro-Raman and Fourier Transform Infrared Spectroscopy (FTIR) analysis, high-k dielectric gate oxide, spectrum sensing in cognitive radio, microstrip antenna, Ground-penetrating radar (GPR) with conducting surfaces, and digital image forgery detection. The contents of the book will be useful to academic and professional researchers alike.
Author: Ajit Pal
Publisher: Springer
ISBN: 8132219376
Category : Technology & Engineering
Languages : en
Pages : 417
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Book Description
The book provides a comprehensive coverage of different aspects of low power circuit synthesis at various levels of design hierarchy; starting from the layout level to the system level. For a seamless understanding of the subject, basics of MOS circuits has been introduced at transistor, gate and circuit level; followed by various low-power design methodologies, such as supply voltage scaling, switched capacitance minimization techniques and leakage power minimization approaches. The content of this book will prove useful to students, researchers, as well as practicing engineers.
Author: Yoshio Nishi
Publisher: CRC Press
ISBN: 1351829823
Category : Technology & Engineering
Languages : en
Pages : 3276
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Book Description
Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
Author: Rabindranath Bera
Publisher: Springer
ISBN: 9811079013
Category : Technology & Engineering
Languages : en
Pages : 923
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Book Description
The book provides insights of International Conference in Communication, Devices and Networking (ICCDN 2017) organized by the Department of Electronics and Communication Engineering, Sikkim Manipal Institute of Technology, Sikkim, India during 3 – 4 June, 2017. The book discusses latest research papers presented by researchers, engineers, academicians and industry professionals. It also assists both novice and experienced scientists and developers, to explore newer scopes, collect new ideas and establish new cooperation between research groups and exchange ideas, information, techniques and applications in the field of electronics, communication, devices and networking.
Author: Paul Siffert
Publisher: Springer Science & Business Media
ISBN: 3662098970
Category : Technology & Engineering
Languages : en
Pages : 552
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Book Description
With topics ranging from epitaxy through lattice defects and doping to quantum computation, this book provides a personalized survey of the development and use of silicon, the basis for the revolutionary changes in our lives sometimes called "The Silicon Age." Beginning with the very first developments more than 50 years ago, this reports on all aspects of silicon and silicon technology up to its use in exciting new technologies, including a glance at possible future developments.
