Tin and Solder Plating in the Semiconductor Industry PDF Download
Are you looking for read ebook online? Search for your book and save it on your Kindle device, PC, phones or tablets. Download Tin and Solder Plating in the Semiconductor Industry PDF full book. Access full book title Tin and Solder Plating in the Semiconductor Industry by A.C. Tan. Download full books in PDF and EPUB format.
Author: A.C. Tan
Publisher: Springer Science & Business Media
ISBN: 9780412482403
Category : Technology & Engineering
Languages : en
Pages : 358
Get Book Here
Book Description
The object of this book is to provide balanced coverage of the theory and practice of plating semiconductor devices. The principal concepts of plating are introduced and best practice discussed. The book is designed to help electroplaters achieve `zero-defect' plating by providing an understanding of the plating chemistry and the handling of the plated parts.
Author: A.C. Tan
Publisher: Springer Science & Business Media
ISBN: 9780412482403
Category : Technology & Engineering
Languages : en
Pages : 358
Get Book Here
Book Description
The object of this book is to provide balanced coverage of the theory and practice of plating semiconductor devices. The principal concepts of plating are introduced and best practice discussed. The book is designed to help electroplaters achieve `zero-defect' plating by providing an understanding of the plating chemistry and the handling of the plated parts.
Author: A. C. Tan
Publisher:
ISBN: 9780442317126
Category : Electroplating
Languages : en
Pages : 326
Get Book Here
Book Description
Resume på engelsk.
Author: Mahmood Aliofkhazraei
Publisher: BoD – Books on Demand
ISBN: 9535122134
Category : Science
Languages : en
Pages : 320
Get Book Here
Book Description
The electroplating was widely used to electrodeposit the nanostructures because of its relatively low deposition temperature, low cost and controlling the thickness of the coatings. With advances in electronics and microprocessor, the amount and form of the electrodeposition current applied can be controlled. The pulse electrodeposition has the interesting advantages such as higher current density application, higher efficiency and more variable parameters compared to direct current density. This book collects new developments about electroplating and its use in nanotechnology.
Author: Mordechay Schlesinger
Publisher: John Wiley & Sons
ISBN: 0470167785
Category : Science
Languages : en
Pages : 755
Get Book Here
Book Description
The definitive resource for electroplating, now completely up to date With advances in information-age technologies, the field of electroplating has seen dramatic growth in the decade since the previous edition of Modern Electroplating was published. This expanded new edition addresses these developments, providing a comprehensive, one-stop reference to the latest methods and applications of electroplating of metals, alloys, semiconductors, and conductive polymers. With special emphasis on electroplating and electrochemical plating in nanotechnologies, data storage, and medical applications, the Fifth Edition boasts vast amounts of new and revised material, unmatched in breadth and depth by any other book on the subject. It includes: Easily accessible, self-contained contributions by over thirty experts Five completely new chapters and hundreds of additional pages A cutting-edge look at applications in nanoelectronics Coverage of the formation of nanoclusters and quantum dots using scanning tunneling microscopy (STM) An important discussion of the physical properties of metal thin films Chapters devoted to methods, tools, control, and environmental issues And much more A must-have for anyone in electroplating, including technicians, platers, plating researchers, and metal finishers, Modern Electroplating, Fifth Edition is also an excellent reference for electrical engineers and researchers in the automotive, data storage, and medical industries.
Author: Benedetto Vigna
Publisher: Springer Nature
ISBN: 3030801357
Category : Technology & Engineering
Languages : en
Pages : 988
Get Book Here
Book Description
This book thoroughly reviews the present knowledge on silicon micromechanical transducers and addresses emerging and future technology challenges. Readers will acquire a solid theoretical and practical background that will allow them to analyze the key performance aspects of devices, critically judge a fabrication process, and then conceive and design new ones for future applications. Envisioning a future complex versatile microsystem, the authors take inspiration from Richard Feynman’s visionary talk “There is Plenty of Room at the Bottom” to propose that the time has come to see silicon sensors as part of a “Feynman Roadmap” instead of the “More-than-Moore” technology roadmap. The sharing of the author’s industrially proven track record of development, design, and manufacturing, along with their visionary approach to the technology, will allow readers to jump ahead in their understanding of the core of the topic in a very effective way. Students, researchers, engineers, and technologists involved in silicon-based sensor and actuator research and development will find a wealth of useful and groundbreaking information in this book.
Author: Sanka Ganesan
Publisher: John Wiley & Sons
ISBN: 0471786179
Category : Technology & Engineering
Languages : en
Pages : 804
Get Book Here
Book Description
Lead-free Electronics provides guidance on the design and use of lead-free electronics as well as technical and legislative perspectives. All the complex challenges confronting the elec-tronics industry are skillfully addressed: * Complying with state legislation * Implementing the transition to lead-free electronics, including anticipating associated costs and potential supply chain issues * Understanding intellectual property issues in lead-free alloys and their applications, including licensing and infringement * Implementing cost effective manufacturing and testing * Reducing risks due to tin whiskers * Finding lead-free solutions in harsh environments such as in the automotive and telecommunications industries * Understanding the capabilities and limitations of conductive adhesives in lead-free interconnects * Devising solutions for lead-free, flip-chip interconnects in high-performance integrated circuit products Each chapter is written by leading experts in the field and carefully edited to ensure a consistent approach. Readers will find all the latest information, including the most recent data on cyclic thermomechanical deformation properties of lead-free SnAgCu alloys and a comparison of the properties of standard Sn-Pb versus lead-free alloys, using the energy partitioning approach. With legislative and market pressure to eliminate the use of lead in electronics manufacturing, this timely publication is essential reading for all engineers and professionals in the electronics industry.
Author:
Publisher: George Cushnie
ISBN: 9780615266398
Category :
Languages : en
Pages : 436
Get Book Here
Book Description
Author: Howard H. Manko
Publisher: Springer Science & Business Media
ISBN: 9780442012069
Category : Computers
Languages : en
Pages : 548
Get Book Here
Book Description
Soldering Handbook for Printed Circuits and Surface Mounting, Second Edition, covers every aspect of this packaging technology, and contains the latest information on design, presolder operations, materials, equipment, surface mount technology, cleaning, quality and inspection, touch-up and repair, process economy, line management, and more.
Author: Marian Gaiceanu
Publisher: BoD – Books on Demand
ISBN: 1838803556
Category : Technology & Engineering
Languages : en
Pages : 230
Get Book Here
Book Description
The introductory chapter to this book is like traveling in a time machine into past, present, and future of electric power conversion. Archeological discoveries are being transformed into the discoveries of the future. The book is an incursion to electric power conversion through electromechanical power conversion, static power conversion, and applications in the field. Each of the above-mentioned sections analyzes the knowledge gained using the experimental results of valuable research projects. Novice readers will learn how energy is converted adequately and adapted to different consumers. Advanced readers will discover different kinds of modern solutions and tendencies in the field of electric power conversion.
Author: Andrea Chen
Publisher: CRC Press
ISBN: 1000218619
Category : Technology & Engineering
Languages : en
Pages : 218
Get Book Here
Book Description
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
