Three-Dimensional Design Methodologies for Tree-based FPGA Architecture PDF Download
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Author: Vinod Pangracious
Publisher: Springer
ISBN: 3319191748
Category : Technology & Engineering
Languages : en
Pages : 239
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Book Description
This book focuses on the development of 3D design and implementation methodologies for Tree-based FPGA architecture. It also stresses the needs for new and augmented 3D CAD tools to support designs such as, the design for 3D, to manufacture high performance 3D integrated circuits and reconfigurable FPGA-based systems. This book was written as a text that covers the foundations of 3D integrated system design and FPGA architecture design. It was written for the use in an elective or core course at the graduate level in field of Electrical Engineering, Computer Engineering and Doctoral Research programs. No previous background on 3D integration is required, nevertheless fundamental understanding of 2D CMOS VLSI design is required. It is assumed that reader has taken the core curriculum in Electrical Engineering or Computer Engineering, with courses like CMOS VLSI design, Digital System Design and Microelectronics Circuits being the most important. It is accessible for self-study by both senior students and professionals alike.
Author: Vinod Pangracious
Publisher: Springer
ISBN: 3319191748
Category : Technology & Engineering
Languages : en
Pages : 239
Get Book Here
Book Description
This book focuses on the development of 3D design and implementation methodologies for Tree-based FPGA architecture. It also stresses the needs for new and augmented 3D CAD tools to support designs such as, the design for 3D, to manufacture high performance 3D integrated circuits and reconfigurable FPGA-based systems. This book was written as a text that covers the foundations of 3D integrated system design and FPGA architecture design. It was written for the use in an elective or core course at the graduate level in field of Electrical Engineering, Computer Engineering and Doctoral Research programs. No previous background on 3D integration is required, nevertheless fundamental understanding of 2D CMOS VLSI design is required. It is assumed that reader has taken the core curriculum in Electrical Engineering or Computer Engineering, with courses like CMOS VLSI design, Digital System Design and Microelectronics Circuits being the most important. It is accessible for self-study by both senior students and professionals alike.
Author: Daniel Lu
Publisher: Springer
ISBN: 3319450980
Category : Technology & Engineering
Languages : en
Pages : 974
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Book Description
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Author: Muhammad Mustafa Hussain
Publisher: John Wiley & Sons
ISBN: 352734358X
Category : Technology & Engineering
Languages : en
Pages : 284
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Book Description
Brings novel insights to a vibrant research area with high application potential?covering materials, physics, architecture, and integration aspects of future generation CMOS electronics technology Over the last four decades we have seen tremendous growth in semiconductor electronics. This growth has been fueled by the matured complementary metal oxide semiconductor (CMOS) technology. This comprehensive book captures the novel device options in CMOS technology that can be realized using non-silicon semiconductors. It discusses germanium, III-V materials, carbon nanotubes and graphene as semiconducting materials for three-dimensional field-effect transistors. It also covers non-conventional materials such as nanowires and nanotubes. Additionally, nanoelectromechanical switches-based mechanical relays and wide bandgap semiconductor-based terahertz electronics are reviewed as essential add-on electronics for enhanced communication and computational capabilities. Advanced Nanoelectronics: Post-Silicon Materials and Devices begins with a discussion of the future of CMOS. It continues with comprehensive chapter coverage of: nanowire field effect transistors; two-dimensional materials for electronic applications; the challenges and breakthroughs of the integration of germanium into modern CMOS; carbon nanotube logic technology; tunnel field effect transistors; energy efficient computing with negative capacitance; spin-based devices for logic, memory and non-Boolean architectures; and terahertz properties and applications of GaN. -Puts forward novel approaches for future, state-of-the-art, nanoelectronic devices -Discusses emerging materials and architectures such as alternate channel material like germanium, gallium nitride, 1D nanowires/tubes, 2D graphene, and other dichalcogenide materials and ferroelectrics -Examines new physics such as spintronics, negative capacitance, quantum computing, and 3D-IC technology -Brings together the latest developments in the field for easy reference -Enables academic and R&D researchers in semiconductors to "think outside the box" and explore beyond silica An important resource for future generation CMOS electronics technology, Advanced Nanoelectronics: Post-Silicon Materials and Devices will appeal to materials scientists, semiconductor physicists, semiconductor industry, and electrical engineers.
Author: Christian Piguet
Publisher: Springer Science & Business Media
ISBN: 3642122663
Category : Computers
Languages : en
Pages : 297
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Book Description
This book contains extended and revised versions of the best papers that were p- sented during the 16th edition of the IFIP/IEEE WG10.5 International Conference on Very Large Scale Integration, a global System-on-a-Chip Design & CAD conference. The 16th conference was held at the Grand Hotel of Rhodes Island, Greece (October 13–15, 2008). Previous conferences have taken place in Edinburgh, Trondheim, V- couver, Munich, Grenoble, Tokyo, Gramado, Lisbon, Montpellier, Darmstadt, Perth, Nice and Atlanta. VLSI-SoC 2008 was the 16th in a series of international conferences sponsored by IFIP TC 10 Working Group 10.5 and IEEE CEDA that explores the state of the art and the new developments in the field of VLSI systems and their designs. The purpose of the conference was to provide a forum to exchange ideas and to present industrial and research results in the fields of VLSI/ULSI systems, embedded systems and - croelectronic design and test.
Author: Vasilis F. Pavlidis
Publisher: Morgan Kaufmann
ISBN: 0080921868
Category : Technology & Engineering
Languages : en
Pages : 324
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Book Description
With vastly increased complexity and functionality in the "nanometer era" (i.e. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. Connecting effectively (interconnect design) all of these chip elements has become the greatest determining factor in overall performance. 3-D integrated circuit design may offer the best solutions in the near future. This is the first book on 3-D integrated circuit design, covering all of the technological and design aspects of this emerging design paradigm, while proposing effective solutions to specific challenging problems concerning the design of 3-D integrated circuits. A handy, comprehensive reference or a practical design guide, this book provides a sound foundation for the design of 3-D integrated circuits. Demonstrates how to overcome "interconnect bottleneck" with 3-D integrated circuit design...leading edge design techniques offer solutions to problems (performance/power consumption/price) faced by all circuit designers The FIRST book on 3-D integrated circuit design...provides up-to-date information that is otherwise difficult to find Focuses on design issues key to the product development cycle...good design plays a major role in exploiting the implementation flexibilities offered in the 3-D Provides broad coverage of 3-D integrated circuit design, including interconnect prediction models, thermal management techniques, and timing optimization...offers practical view of designing 3-D circuits
Author: Svetlana N. Yanushkevich
Publisher: CRC Press
ISBN: 1351836382
Category : Technology & Engineering
Languages : en
Pages : 960
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Book Description
Decision diagram (DD) techniques are very popular in the electronic design automation (EDA) of integrated circuits, and for good reason. They can accurately simulate logic design, can show where to make reductions in complexity, and can be easily modified to model different scenarios. Presenting DD techniques from an applied perspective, Decision Diagram Techniques for Micro- and Nanoelectronic Design Handbook provides a comprehensive, up-to-date collection of DD techniques. Experts with more than forty years of combined experience in both industrial and academic settings demonstrate how to apply the techniques to full advantage with more than 400 examples and illustrations. Beginning with the fundamental theory, data structures, and logic underlying DD techniques, they explore a breadth of topics from arithmetic and word-level representations to spectral techniques and event-driven analysis. The book also includes abundant references to more detailed information and additional applications. Decision Diagram Techniques for Micro- and Nanoelectronic Design Handbook collects the theory, methods, and practical knowledge necessary to design more advanced circuits and places it at your fingertips in a single, concise reference.
Author: Michael Hübner
Publisher: KIT Scientific Publishing
ISBN: 3866445156
Category :
Languages : en
Pages : 194
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Book Description
Author: Pierre-Emmanuel Gaillardon
Publisher: CRC Press
ISBN: 1482262193
Category : Technology & Engineering
Languages : en
Pages : 511
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Book Description
During the last three decades, reconfigurable logic has been growing steadily and can now be found in many different fields. Field programmable gate arrays (FPGAs) are one of the most famous architecture families of reconfigurable devices. FPGAs can be seen as arrays of logic units that can be reconfigured to realize any digital systems. Their high versatility has enabled designers to drastically reduce time to market, and made FPGAs suitable for prototyping or small production series in many branches of industrial products. In addition, and thanks to innovations at the architecture level, FPGAs are now conquering segments of mass markets such as mobile communications. Reconfigurable Logic: Architecture, Tools, and Applications offers a snapshot of the state of the art of reconfigurable logic systems. Covering a broad range of architectures, tools, and applications, this book: Explores classical FPGA architectures and their supporting tools Evaluates recent proposals related to FPGA architectures, including the use of network-on-chips (NoCs) Examines reconfigurable processors that merge concepts borrowed from the reconfigurable domain into processor design Exploits FPGAs for high-performance systems, efficient error correction codes, and high-bandwidth network routers with built-in security Expounds on emerging technologies to enhance FPGA architectures, improve routing structures, and create non-volatile configuration flip-flops Reconfigurable Logic: Architecture, Tools, and Applications reviews current trends in reconfigurable platforms, providing valuable insight into the future potential of reconfigurable systems.
Author:
Publisher:
ISBN:
Category : Field programmable gate arrays
Languages : en
Pages : 304
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Book Description
Author: Ajith Abraham
Publisher: Springer Science & Business Media
ISBN: 3642320635
Category : Technology & Engineering
Languages : en
Pages : 500
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Book Description
This book constitutes the thoroughly refereed post-conference proceedings of the first International Symposium on Intelligent Informatics (ISI'12) held in Chennai, India during August 4-5, 2012. The 54 revised papers presented were carefully reviewed and selected from 165 initial submissions. The papers are organized in topical sections on data mining, clustering and intelligent information systems, multi agent systems, pattern recognition, signal and image processing and, computer networks and distributed systems. The book is directed to the researchers and scientists engaged in various fields of intelligent informatics.
